scholarly journals Influence of Complexing Agents in Electroless Nickel Strike Plating Solution for Solder Ball Shear Properties on Electroless Thin Ni/Au Plated Film.

2016 ◽  
Vol 67 (10) ◽  
pp. 545-550
Author(s):  
Tomohito KATO ◽  
Hajime TERASHIMA ◽  
Hideto WATANABE ◽  
Mitsuhiro WATANABE ◽  
Hideo HONMA ◽  
...  
Keyword(s):  
Solder Ball ◽  
Electroless Nickel ◽  
Complexing Agents ◽  
Shear Properties ◽  
Ball Shear ◽  
Plating Solution

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

scholarly journals Studies on Composition of Caustic Alkaline Electroless Nickel Plating Solution

1964 ◽  
Vol 15 (4) ◽  
pp. 135-138
Author(s):  
Satoru ISHIBASHI ◽  
Osamu TAKANO ◽  
Masaoki YOSHIDA ◽  
Tooru SHIMIZU
Keyword(s):  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Solution

A New Method for the Solder Ball Pull Test Using a Shape Memory Alloy Tube

2004 ◽  
Author(s):  
Jeffery Lo ◽  
Dennis Lau ◽  
S. W. Ricky Lee ◽  
Simon Chan ◽  
Frank Chan ◽  
...  
Keyword(s):  
Shape Memory Alloy ◽  
Shape Memory ◽  
Shear Test ◽  
Solder Ball ◽  
Shear Loading ◽  
Ball Shear ◽  
Pull Test ◽  
Ball Shear Test ◽  
Attachment Strength ◽  
Inner Diameter

The solder ball shear test is a commonly used method to evaluate the attachment strength of solder balls. However, some previous studies indicated that the solder ball shear test may not be suitable for showing the effect of intermetallic compound (IMC) growth due to thermal aging. This is because the IMC layer is thin and not susceptible to the shear loading. Since the IMC layer consists of brittle materials, the ball pull test should be a better method to evaluate the solder ball attachment strength. The major challenge of conducting a solder ball pull test is how to grip the solder ball. This paper presents an innovative method for conducting the solder ball pull test. A shape memory alloy (SMA) tube is used to grip the solder ball and pull it off from the substrate. The inner diameter of the SMA tube is originally smaller than the diameter of the solder ball under testing. Once the temperature is raised to higher than the switching temperature of SMA, the SMA tube will expand radially, resulting an inner diameter larger than the solder ball. After the SMA tube cools down, the tube contracts and grips the solder ball firmly. The solder ball can then be pulled off from the attached substrate by frictional force. A prototype of the aforementioned solder ball pull test device has been developed. Some preliminary testing results are presented in this paper.

A novel method for nickel recovery and phosphorus removal from spent electroless nickel-plating solution

2015 ◽  
Vol 147 ◽  
pp. 237-244 ◽  
Author(s):  
Liuyun Li ◽  
Naoki Takahashi ◽  
Keiichi Kaneko ◽  
Tadaaki Shimizu ◽  
Takayuki Takarada
Keyword(s):  
Phosphorus Removal ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Nickel Recovery ◽  
Novel Method ◽  
Plating Solution

Optimum Shear Height for Evaluation of Pb-Free Solder Ball Shear Strength

2005 ◽  
Vol 486-487 ◽  
pp. 269-272 ◽  
Author(s):  
Jong Woong Kim ◽  
Sun Kyu Park ◽  
Seung Boo Jung
Keyword(s):  
Solder Ball ◽  
High Standard ◽  
Test Results ◽  
Element Analysis ◽  
Test Parameter ◽  
Ball Shear ◽  
Ball Shear Test ◽  
Ball Surface ◽  
Free Solder ◽  
Ball Shear Strength

Ball shear test was investigated in terms of the effects of important test parameter, i.e., shear height, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. The substrate was a common SMD type with solder bond pad openings of 460 ㎛ in diameter. It was observed that increasing the shear height, at a fixed shear speed, has the effect of decreasing the shear force. The high shear height could cause some bad effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces.

The mechanics of the solder ball shear test and the effect of shear rate

2006 ◽  
Vol 417 (1-2) ◽  
pp. 259-274 ◽  
Author(s):  
Julian Yan Hon Chia ◽  
Brian Cotterell ◽  
Tai Chong Chai
Keyword(s):  
Shear Rate ◽  
Shear Test ◽  
Solder Ball ◽  
Ball Shear ◽  
Ball Shear Test
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