Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Immersion Tin-Lead Plating for Surface Mount Technology.

Takeshi MIURA; Shigeru KODAIRA

doi:10.4139/sfj.44.605

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Immersion Tin-Lead Plating for Surface Mount Technology.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.605 ◽

1993 ◽

Vol 44 (7) ◽

pp. 605-608 ◽

Cited By ~ 1

Author(s):

Takeshi MIURA ◽

Shigeru KODAIRA

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Surface Mount Technology ◽

Printed Wiring Boards ◽

Special Issue ◽

Surface Mount ◽

Immersion Tin

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Latest Plating Equipment for Printed Wiring Board.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.609 ◽

1993 ◽

Vol 44 (7) ◽

pp. 609-613

Author(s):

Nobutoshi TAKEMURA

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue ◽

Printed Wiring Board ◽

Wiring Board

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Copper Electroplating for Plated Through Hole of Printed Wiring Boards.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.583 ◽

1993 ◽

Vol 44 (7) ◽

pp. 583-588 ◽

Cited By ~ 3

Author(s):

Mitsuyasu CHIKUMA

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue ◽

Copper Electroplating ◽

Plated Through Hole ◽

Through Hole

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Surface Finishing of Printed Wiring Boards. Mainly on Electroless Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.578 ◽

1993 ◽

Vol 44 (7) ◽

pp. 578-582 ◽

Cited By ~ 1

Author(s):

Kazuyoshi OKUNO

Keyword(s):

Electroless Plating ◽

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Pretreatment for Eelctroplating of Printed Wiring Board. Black Oxide Treatment, Desmear Treatment.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.573 ◽

1993 ◽

Vol 44 (7) ◽

pp. 573-577

Author(s):

Hitoshi SAKISAKO ◽

Masashi KIMURA ◽

Yoshihiko MORIKAWA

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue ◽

Printed Wiring Board ◽

Black Oxide ◽

Wiring Board

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.558 ◽

1993 ◽

Vol 44 (7) ◽

pp. 558-565 ◽

Cited By ~ 1

Author(s):

Masamitsu AOKI

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue

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Special Issue. Recent and Future Trends of Surface Mount Technology for Electronics Component. Base Materials and Surface Finishing Technology. Metal-Polyimide Substrate.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.46.210 ◽

1995 ◽

Vol 46 (3) ◽

pp. 210-215

Author(s):

Shuichi OGASAWARA

Keyword(s):

Surface Finishing ◽

Surface Mount Technology ◽

Future Trends ◽

Special Issue ◽

Surface Mount ◽

Polyimide Substrate ◽

Base Materials

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.589 ◽

1993 ◽

Vol 44 (7) ◽

pp. 589-593

Author(s):

Takeshi MIURA ◽

Masaru SEITA

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue ◽

Printed Wiring Board ◽

Wiring Board

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Special Issue. Recent and Future Trends of Surface Mount Technology for Electronics Component. The Electronic Packaging Technology and Related Surface Finishing.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.46.216 ◽

1995 ◽

Vol 46 (3) ◽

pp. 216-222

Author(s):

Kiyoshi TAKAGI

Keyword(s):

Electronic Packaging ◽

Surface Finishing ◽

Surface Mount Technology ◽

Future Trends ◽

Special Issue ◽

Packaging Technology ◽

Surface Mount

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Etching Technology for Printed Wiring Board Process.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.594 ◽

1993 ◽

Vol 44 (7) ◽

pp. 594-598

Author(s):

Toshio HAYASHI

Keyword(s):

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue ◽

Printed Wiring Board ◽

Wiring Board ◽

Board Process

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Manufacturing Process of Printed Wiring Boards.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.566 ◽

1993 ◽

Vol 44 (7) ◽

pp. 566-572

Author(s):

Hiroharu KAMIYAMA

Keyword(s):

Manufacturing Process ◽

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue

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