3D TSV-based Inductor Design for a Secure Internet of Things

2016 ◽  
Vol 2016 (1) ◽  
pp. 000364-000367
Author(s):  
Bruce Kim ◽  
Sang-Bock Cho
Keyword(s):  
Internet Of Things ◽  
Quality Factor ◽  
Case Studies ◽  
Hardware Security ◽  
Ferromagnetic Materials ◽  
High Density ◽  
Through Silicon Via ◽  
Iot Applications ◽  
Military Applications

Abstract This paper describes the design and modeling of through-silicon via (TSV)-based high-density 3D inductors for Internet of Things (IoT) applications and presents some possible challenges for TSV-based inductors in IoT applications. For cybersecurity infrastructure, we designed IoT with hardware security in mind. We provide a secure design for Internet of Things based on secure 3D inductors and then show case studies of high-density RF packages with TSV-based inductors that require hardware security, such as military applications. We use ferromagnetic materials to achieve high inductance with good quality factor.

A Secure Tunable LNA Design for Internet of Things

2017 ◽  
Vol 2017 (1) ◽  
pp. 000705-000708
Author(s):  
Bruce Kim ◽  
Sang-Bock Cho
Keyword(s):  
Internet Of Things ◽  
Quality Factor ◽  
Hardware Security ◽  
Ferromagnetic Materials ◽  
Low Noise ◽  
Low Noise Amplifier ◽  
Ring Oscillator ◽  
Through Silicon Via ◽  
Noise Amplifier ◽  
Iot Devices

Abstract This paper describes the design of through-silicon via (TSV)-based inductors for a secure tunable low-noise amplifier (LNA) in Internet of Things (IoT) devices. To improve cybersecurity infrastructure, we designed a tunable LNA with hardware security. Our secure design for tunable LNA uses a ring oscillator-based physically unclonable function (PUF) circuit. For the 3D inductors, we use ferromagnetic materials to achieve high inductance with a good quality factor.

Design of TSV-based Inductors for Internet of Things

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002111-002130 ◽  
Author(s):  
Bruce C Kim ◽  
Saikat Mondal
Keyword(s):  
Magnetic Field ◽  
Internet Of Things ◽  
Power Electronics ◽  
Eddy Current ◽  
Electronics Packaging ◽  
High Density ◽  
Metal Core ◽  
The Core ◽  
Iot Applications ◽  
The Magnetic Field

This paper describes the design of a Through Silicon Via based high density 3D inductors for Internet of Things (IoT) applications. We present some possible challenges for TSV-based inductors in IoT applications. The current trend towards Internet of Things (IOT), System in Package (SiP) and Package-on-Package (PoP) requires meeting the power requirements of heterogeneous technologies while maintaining minimum package size. 3-D chip stacking has emerged as one of the potential solutions due to its high density integration in a 3D power electronics packaging regime. As an integral part of many power electronics applications, TSV-based inductors are becoming a popular choice because of their high inductance density due to the reduced on-chip footprint compared to conventional planar inductors. Depending on the requirement, values of these inductors could range from a few nanohenries to hundreds of microhenries. Small inductors with a high quality factor are mainly used for RF filter applications, whereas large inductors are used in power electronics packaging. For high inductance it is necessary to use ferromagnetic materials. A conventional ferromagnetic metal core like nickel could offer high permeability, which can help to boost the inductance. However, the magnetic field lines within a metal core induce eddy current which can have multiple adverse effect in power electronics packaging. For example, it has long been known that the current can increase the resistance in transformer winding [1]. Eddy current can also heat up the core of the inductor which makes the heat sink process in 3D packaging even more challenging. One way to decrease the eddy current, is to pattern and laminate the core block into multiple segments orthogonal to the direction of the magnetic field line [2]. Another method is to increase the resistivity of the core material so that the eddy current is limited to a very small magnitude [3].

Embedded Systems for Internet of Things (IoT) Applications: A Review Study

2018 ◽  
Author(s):  
Jose David Alvarado Moreno ◽  
Luis Carlos Luis Garcia ◽  
Wilder Castellanos Hernandez ◽  
Anlly Milena Barrera Obando
Keyword(s):  
Internet Of Things ◽  
Embedded Systems ◽  
Iot Applications ◽  
Review Study

scholarly journals Wideband Rectangular Foldable and Non-foldable Antenna for Internet of Things Applications

2019 ◽  
Vol 2019 ◽  
pp. 1-5 ◽  
Author(s):  
Steve W. Y. Mung ◽  
Cheuk Yin Cheung ◽  
Ka Ming Wu ◽  
Joseph S. M. Yuen
Keyword(s):  
Internet Of Things ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design Parameters ◽  
Multiple Frequency ◽  
Wireless Applications ◽  
Printed Circuit ◽  
Iot Applications ◽  
Trade Offs ◽  
The Cost

This article presents a simple wideband rectangular antenna in foldable and non-foldable (printed circuit board (PCB)) structures for Internet of Things (IoT) applications. Both are simple structures with two similar rectangular metal planes which cover multiple frequency bands such as GPS, WCDMA/LTE, and 2.4 GHz industrial, scientific, and medical (ISM) bands. This wideband antenna is suitable to integrate into the short- and long-range wireless applications such as the short-range 2.4 GHz ISM band and standard cellular bands. This lowers the overall size of the product as well as the cost in the applications. In this article, the configuration and operation principle are presented as well as its trade-offs on the design parameters. Simulated and experimental results of foldable and non-foldable (PCB) structures show that the antenna is suited for IoT applications.

scholarly journals Machine Learning and LPWAN Based Internet of Things Applications in Healthcare Sector during COVID-19 Pandemic

Electronics ◽  
2021 ◽  
Vol 10 (14) ◽  
pp. 1615
Author(s):  
Zeeshan Ali Khan ◽  
Ubaid Abbasi ◽  
Sung Won Kim
Keyword(s):  
Machine Learning ◽  
Internet Of Things ◽  
Healthcare Services ◽  
Healthcare Sector ◽  
K Nearest Neighbors ◽  
Iot Applications ◽  
Processing Resources ◽  
Multiple Services ◽  
Applications Of Machine Learning

Low power wide area networks (LPWAN) are comprised of small devices having restricted processing resources and limited energy budget. These devices are connected with each other using communication protocols. Considering their available resources, these devices can be used in a number of different Internet of Things (IoT) applications. Another interesting paradigm is machine learning, which can also be integrated with LPWAN technology to embed intelligence into these IoT applications. These machine learning-based applications combine intelligence with LPWAN and prove to be a useful tool. One such IoT application is in the medical field, where they can be used to provide multiple services. In the scenario of the COVID-19 pandemic, the importance of LPWAN-based medical services has gained particular attention. This article describes various COVID-19-related healthcare services, using the the applications of machine learning and LPWAN in improving the medical domain during the current COVID-19 pandemic. We validate our idea with the help of a case study that describes a way to reduce the spread of any pandemic using LPWAN technology and machine learning. The case study compares k-Nearest Neighbors (KNN) and trust-based algorithms for mitigating the flow of virus spread. The simulation results show the effectiveness of KNN for curtailing the COVID-19 spread.

scholarly journals Self-Synchronization in Duty-Cycled Internet of Things (IoT) Applications

2017 ◽  
Vol 4 (6) ◽  
pp. 2058-2069 ◽  
Author(s):  
Poonam Yadav ◽  
Julie A. McCann ◽  
Tiago Pereira
Keyword(s):  
Internet Of Things ◽  
Iot Applications

Key IOT Technology and Application Research

2014 ◽  
Vol 543-547 ◽  
pp. 3411-3414
Author(s):  
Xu Bing
Keyword(s):  
Wireless Sensor Network ◽  
Internet Of Things ◽  
Intelligent Transportation System ◽  
Rapid Development ◽  
Intelligent Transportation ◽  
Wireless Sensor ◽  
Medical Monitoring ◽  
Application Research ◽  
Iot Applications ◽  
Architectural Model

Key core technologies of IOT (internet of things) have to be addressed to achieve rapid development. This paper focused on studying RFID, wireless sensor network (WSN) and TCCP which were integrated to address the IOT application problems. Meanwhile, an IOT architectural model was established and the IOT applications in real-time medical monitoring, intelligent transportation system (ITS), intelligent appliances and intelligent agriculture were introduced.

Multicast Routing Protocols for Internet of Things (IoT) Applications

2019 ◽  
pp. 99-106
Author(s):  
Prakash Ramesh Gadekar ◽  
Avnish Raj Verma ◽  
Virendrakumar A. Dhotre
Keyword(s):  
Internet Of Things ◽  
Routing Protocols ◽  
Multicast Routing ◽  
Iot Applications ◽  
Multicast Routing Protocols
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