Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board Manufacturing

2016 ◽  
Vol 2016 (1) ◽  
pp. 000267-000271
Author(s):  
V.D. Heydemann ◽  
S. Lauer ◽  
W. Decker ◽  
J. Slater ◽  
J. Mazurowski
Keyword(s):  
High Precision ◽  
Preliminary Test ◽  
Circuit Board ◽  
Layer By Layer ◽  
Wafer Level ◽  
Active Components ◽  
Bulk Materials ◽  
Poor Tolerance ◽  
Planarization Process ◽  
Potting Compound

Abstract Most embedded components manufactured today are made either by photolithography to pattern inner board layer materials or by placing discrete components on an inner board layer followed by planarization with a potting compound. These traditional methods produce devices with poor tolerance due to inherent variances in the photolithography and etch process, and parasitic capacitance of long traces. Discrete embedded components increase thickness and weight and suffer from reduced reliability caused by the planarization process. This paper introduces an alternative patterning method to integrate in-line embedded passive and active components without photolithography processing. This additive printing process uses high precision, high feature density shadow masks with micrometer-level registration. Devices are built layer by layer using off-the-shelf bulk materials instead of inks to produce tight tolerance passive and active components that can be integrated into traditional PCB and wafer-level processing. Examples of such additively manufactured devices for both DC and RF applications and preliminary test data are presented in this paper.

scholarly journals High Precision Human Skin Temperature Fluctuations Measuring Instrument

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4101
Author(s):  
Nikolai B. Suvorov ◽  
Alexander V. Belov ◽  
Konstantin G. Kuliabin ◽  
Aleksei A. Anisimov ◽  
Timofei V. Sergeev ◽  
...  
Keyword(s):  
Skin Temperature ◽  
Human Skin ◽  
High Precision ◽  
Temperature Fluctuations ◽  
Preliminary Test ◽  
Semiconductor Diode ◽  
Measuring Instrument ◽  
Voltage Range ◽  
Temperature Oscillations ◽  
Depth Study

This paper describes the experimental results of testing a prototype of a high precision human skin rapid temperature fluctuations measuring instrument. Based on the author’s work, an original circuit solution on a miniature semiconductor diode sensor has been designed. The proposed circuitry provides operation in the full voltage range with automatic setting and holding the operating point, as well as the necessary slope of the conversion coefficient (up to 2300 mV/°C), which makes it possible to register fast temperature oscillations from the surface of the human body and other biological objects. Simulation results in the Microcap 12 software and laboratory tests have confirmed all declared design specifications: temperature resolution of 0.01 °C, transducer thermal time constant of 0.05 s. An original thermostat and an experimental setup for the simultaneous registration of the electrocardiogram, pulse wave signals from the Biopac polygraph MP36 and a signal of temperature oscillations from the prototype thermometer have been designed for further investigations. The preliminary test results indicates that using the designed measuring instrument gives a possibility to provide an in-depth study of the relationship between micro- and macro-blood circulations manifested in skin temperature fluctuations.

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

High-precision wafer-level Cu-Cu bonding for 3DICs

2014 ◽  
Author(s):  
Masashi Okada ◽  
Isao Sugaya ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

2018 ◽  
Vol 15 (4) ◽  
pp. 148-162 ◽  
Author(s):  
John Lau ◽  
Ming Li ◽  
Yang Lei ◽  
Margie Li ◽  
Iris Xu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Thermal Cycling Test ◽  
Wafer Level ◽  
Molding Compound ◽  
Shock Test ◽  
Cycling Test

Abstract In this study, the reliability (thermal cycling and shock) performances of a fan-out wafer-level system-in-package (SiP) or heterogeneous integration with one large chip (5 × 5 mm), three small chips (3 ×3 mm), and four capacitors (0402) embedded in an epoxy molding compound package (10 × 10 mm) with two redistribution layers (RDLs) are experimentally determined. Emphasis is placed on the estimation of the Weibull life distribution, characteristic life, and failure rate of the solder joint and RDL of this package. The fan-out wafer-level packaging is assembled on a printed circuit board (PCB) with more than 400 (Sn3wt%Ag0.5wt%Cu) solder joints. It is a six-layer PCB. The sample sizes for the thermal cycling test and shock test are, respectively, equal to 60 and 24. The failure location and modes of the thermal cycling test and shock test of the fan-out wafer-level SiP solder joints and RDLs are provided and discussed. 3-D nonlinear finite element models are also constructed and analyzed for the fan-out heterogeneous integration package during thermal cycling and shock conditions. The simulation results are correlated to the experimental results. Finally, recommendations on improving the fan-out wafer-level SiP solder joints and RDLs under thermal and shock conditions are provided.

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

2017 ◽  
Vol 2017 (1) ◽  
pp. 000325-000330 ◽  
Author(s):  
Wei Zhao ◽  
Mark Nakamoto ◽  
Karthikeyan Dhandapani ◽  
Brian Henderson ◽  
Ron Lindley ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Measured Data ◽  
Circuit Board ◽  
Wafer Level ◽  
Test Chip ◽  
Chip Design ◽  
Packaging Technology ◽  
Printed Circuit ◽  
Wafer Level Packaging ◽  
Simulation Results

Abstract Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, Inc. has converted an existing test chip to wafer level packaging technology. Both the measured data and simulation results show that e-CBI risk is significant and must be carefully managed.

High-Precision Wafer-Level Cu–Cu Bonding for 3-DICs

2015 ◽  
Vol 62 (12) ◽  
pp. 4154-4160 ◽  
Author(s):  
Isao Sugaya ◽  
Masashi Okada ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding

Wafer level high precision small size inductors for RF application

2015 ◽  
Author(s):  
Guo Hongyan ◽  
Long Xinjiang ◽  
Hua Xuan ◽  
Zhang Li ◽  
Tan Kim Hwee ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level

scholarly journals TO THE SUBSTANTIATION OF THE STORAGE BUNKER DESIGN FOR A HIGH-ACCURACY VOLUMETRIC DOSING DEVICE

2020 ◽  
Vol 2 ◽  
pp. 173-179
Author(s):  
Guil Nam Khan ◽  
Evgeny P. Rusin
Keyword(s):  
Discrete Element Method ◽  
High Precision ◽  
Structural Design ◽  
Material Flow ◽  
Bulk Material ◽  
High Accuracy ◽  
Axially Symmetric ◽  
Bulk Materials ◽  
Main Components ◽  
Storage Hopper

The paper substantiates the design of one of the main components of a high-precision volumetric dosing device for bulk materials - its storage hopper. It is determined that hopper structural design should avoid possible hang-ups of the product processed and maintain rather uniform dense packing of the material on its way to the dosing area. The process of bulk material flow in a storage hopper was studied numerically by discrete element method. It is concluded that hopper design should be axially symmetric, with defect-free walls, and expanding at an angle of 2-4° to its base.

scholarly journals PCB-Based Magnetometer as a Platform for Quantification of Lateral-Flow Assays

Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5433 ◽  
Author(s):  
Mohammad Khodadadi ◽  
Long Chang ◽  
João R. C. Trabuco ◽  
Binh V. Vu ◽  
Katerina Kourentzi ◽  
...  
Keyword(s):  
High Precision ◽  
Fe3o4 Nanoparticles ◽  
Printed Circuit Board ◽  
Test Line ◽  
Point Of Care ◽  
Low Cost ◽  
Superparamagnetic Iron Oxide ◽  
High Sensitivity ◽  
Lateral Flow ◽  
Circuit Board

This work presents a proof-of-concept demonstration of a novel inductive transducer, the femtoMag, that can be integrated with a lateral-flow assay (LFA) to provide detection and quantification of molecular biomarkers. The femtoMag transducer is manufactured using a low-cost printed circuit board (PCB) technology and can be controlled by relatively inexpensive electronics. It allows rapid high-precision quantification of the number (or amount) of superparamagnetic nanoparticle reporters along the length of an LFA test strip. It has a detection limit of 10−10 emu, which is equivalent to detecting 4 ng of superparamagnetic iron oxide (Fe3O4) nanoparticles. The femtoMag was used to quantify the hCG pregnancy hormone by quantifying the number of 200 nm magnetic reporters (superparamagnetic Fe3O4 nanoparticles embedded into a polymer matrix) immuno-captured within the test line of the LFA strip. A sensitivity of 100 pg/mL has been demonstrated. Upon further design and control electronics improvements, the sensitivity is projected to be better than 10 pg/mL. Analysis suggests that an average of 109 hCG molecules are needed to specifically bind 107 nanoparticles in the test line. The ratio of the number of hCG molecules in the sample to the number of reporters in the test line increases monotonically from 20 to 500 as the hCG concentration increases from 0.1 ng/mL to 10 ng/mL. The low-cost easy-to-use femtoMag platform offers high-sensitivity/high-precision target analyte quantification and promises to bring state-of-the-art medical diagnostic tests to the point of care.

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