scholarly journals Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive Pastes

2019 ◽  
Vol 16 (2) ◽  
pp. 103-116
Author(s):  
Art Dobie
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Line Width ◽  
Lead Time ◽  
Screen Printing ◽  
Printing Industry ◽  
Loss Of Control ◽  
High Definition ◽  
Circuit Density ◽  
Pet Substrate

Abstract A major obstacle in screen printing conductive low-temperature curing polymer thick-film (PTF) pastes onto common flexible PET substrate materials is the substantial spread of the pastes beyond the designed line width after printing. Industry observation and controlled testing have shown this spread can be as much as 80% over the circuit design's intended line width. This phenomenon prevents designers from increasing circuit density and/or reducing circuit real estate without incorporating other more involved and higher cost patterning methods. In many cases, flexible circuit fabricators, desiring more accurate high-definition circuit elements, may have to subcontract parts out of house to incorporate alternate patterning methods. This subcontracting, in turn, leads to a loss of control of both cost and lead time. This article will provide results of numerous in-house and field testings, comparing printed line width control, edge definition, and improved conductivity of printed polymer Ag conductors on different flexible PET substrates.

Flexible PET Substrate for High Definition Printing of Polymer Thick Film Conductive Pastes

2018 ◽  
Vol 2018 (1) ◽  
pp. 000517-000527
Author(s):  
Art Dobie
Keyword(s):  
Thick Film ◽  
Line Width ◽  
Lead Time ◽  
Screen Printing ◽  
Field Testing ◽  
Printing Industry ◽  
Loss Of Control ◽  
High Definition ◽  
Circuit Density ◽  
Pet Substrate

Abstract A major obstacle in screen printing conductive low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the substantial spread of the pastes beyond the designed line width after printing. Industry observation and controlled testing have shown this spread can be as much as 80% over the circuit design's intended line width. This phenomenon prevents designers from increasing circuit density and/or reducing circuit real estate without incorporating other, more involved and higher cost patterning methods. In many cases, flexible circuit fabricators, desiring more accurate high definition circuit elements, may have to subcontract parts out of house in order to incorporate alternate patterning methods. In-turn this subcontracting leads to a loss of control of both cost and lead time. This paper will provide results of numerous in-house and field testing, comparing printed line width control, edge definition, and improved conductivity of printed polymer Ag conductors on different flexible PET substrates.

Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density

2017 ◽  
Vol 14 (3) ◽  
pp. 94-99 ◽  
Author(s):  
Roland Tacken ◽  
Daniel Mitcan ◽  
Jasper Nab
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Limiting Factors ◽  
Limiting Factor ◽  
Fine Line ◽  
Fine Pitch ◽  
Print Materials ◽  
Multilayer Routing ◽  
Screen Print ◽  
Circuit Density

Abstract There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed.

Flexography Printing of Silver Tracks on LTCC Tapes – Effect of Printing Direction on Line Properties

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000314-000321 ◽  
Author(s):  
Rita Faddoul ◽  
Nadège Reverdy-Bruas ◽  
Anne Blayo ◽  
Didier Chaussy
Keyword(s):  
Electrical Resistivity ◽  
Low Temperature ◽  
Line Width ◽  
Screen Printing ◽  
Silver Flake ◽  
Multilayer Systems ◽  
Conventional Sintering ◽  
On Line ◽  
Line Widths ◽  
Printing Direction

The originality of this work is to print with flexography process conductive silver lines suitable for Low Temperature Co-fired Ceramics (LTCC) multilayer systems. Screen printing conductive paste with 65% silver flake particles was optimised for flexography process. Patterns with different line widths – from 100 to 600 μm – were printed in two directions, parallel and perpendicular to printing orientation. Printed lines withstood temperature as high as 875°C for one hour, relative to conventional sintering profile of LTCC multilayer systems. Line width, thickness and roughness decreased after sintering. A minimum line width of 153 μm was measured on sintered lines. Line thickness varied from 1.8 to 3.8 μm and line roughness from 0.7 to 0.9 μm after sintering. Conductive silver lines along 34 cm length were accomplished after sintering. Very low values of electrical resistivity were measured on the sintered lines. This study demonstrates the huge potential of flexography printing for LTCC multilayer systems.

Thick films of ceramic superconducting, electro-ceramic materials

2002 ◽  
Vol 74 (11) ◽  
pp. 2083-2096 ◽  
Author(s):  
H. Altenburg ◽  
J. Plewa ◽  
G. Plesch ◽  
O. Shpotyuk
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Ceramic Material ◽  
Thick Film ◽  
Screen Printing ◽  
Thick Films ◽  
Ceramic Materials ◽  
Superconducting Materials ◽  
Processing Sequence ◽  
Oxide Powders

The use of thick films becomes more and more important in particular for electronic and microelectronic applications. The term “thick film ” does not relate so much to the thickness of the film but more to the kind of deposition. Thick films are made by low-priced processes such as doctor (dr) blading, screen-printing, or spraying methods, etc. The preparation of thick films of ceramic material by these methods generally implies a processing sequence of the following steps: preparation of the oxide powders; preparation of pastes and slurries; painting/printing, etc.of the pastes onto a suitable substrate; drying at low temperature; and sintering at high temperature to get a consolidated layer. These technologies and the fabricated thick films of thermoresistive and superconducting materials will be discussed.

Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging Density

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000167-000172
Author(s):  
Zhenzhen Shen ◽  
R. Wayne Johnson ◽  
Tan Zhang ◽  
David Shaddock
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Line Width ◽  
High Volume ◽  
Feature Size ◽  
Passive Components ◽  
Surface Insulation Resistance ◽  
Fine Pitch ◽  
Resistance Patterns ◽  
Au Stud Bump

With the increasing electronics demand on complexity and functionality, low temperature cofired ceramic (LTCC) shows its advantages for cost efficiency under high volume, multilayer high packaging density, and compatibility of passive components integration. However, compared with thin film technology, the minimum thick film line width and spacing on LTCC is 4mil, which limits the packaging of fine pitch devices. In this study, one of DuPont™ photoimageable thick film gold (Au) conductors has been selected to fabricate on DuPont 951PX substrate, with the patterns as small as 1mil. Surface insulation resistance (SIR) and serpentine resistance patterns with a series of line width and spacing was printed and post fired on LTCC to investigate the capabilities and limits of the feature size. Feature dimensions were measured to compare with the design value. Metal adhesion and stud bump patterns are also included in the test substrate. After initial testing, the substrates are undergoing 300°C aging. Post aging resistance measurement, metallization adhesion pull test and Au stud bump shear test are carried out to evaluate its high temperature behaviors.

Structural and Optoelectronic Properties of Polycrystalline CdS Thick Film Prepared by Screen Printing

2018 ◽  
Vol 10 (5) ◽  
pp. 05018-1-05018-4
Author(s):  
B. Y. Bagul ◽  
◽  
P. S. Sonawane ◽  
A. Z. Shaikh ◽  
Y. N. Rane ◽  
...  
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Optoelectronic Properties ◽  
Structural And Optoelectronic Properties

Characterization of a LiCoO2 thick film by screen-printing for a lithium ion micro-battery

2006 ◽  
Vol 159 (2) ◽  
pp. 1416-1421 ◽  
Author(s):  
Moon Soo Park ◽  
Sang Hoon Hyun ◽  
Sang Cheol Nam
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Lithium Ion

Electrical and Microstructural Analysis of Contact Formation on Lightly Doped Phosphorus Emitters Using Thick-Film Ag Screen Printing Pastes

2014 ◽  
Vol 4 (1) ◽  
pp. 168-174 ◽  
Author(s):  
Vinodh Shanmugam ◽  
Jessen Cunnusamy ◽  
Ankit Khanna ◽  
Prabir Kanti Basu ◽  
Yi Zhang ◽  
...  
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Microstructural Analysis ◽  
Contact Formation
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