3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components

2018 ◽  
Vol 15 (3) ◽  
pp. 107-116
Author(s):  
Zihan Wu ◽  
Junki Min ◽  
Markondeya Raj Pulugurtha ◽  
Siddharth Ravichandran ◽  
Venky Sundaram ◽  
...  
Keyword(s):  
High Precision ◽  
High Performance ◽  
Electrical Performance ◽  
Large Area ◽  
Low Loss ◽  
Thin Glass ◽  
Glass Substrates ◽  
Rf Components ◽  
Thin Polymer ◽  
The Impact

Abstract Double-side or 3-D integration of high-precision and high-performance bandpass and lowpass filters that are interconnected with through-vias were designed and demonstrated on 100-micron thin glass substrates for ultra-miniaturized diplexer components. A novel process for achieving high precision with large-area fabrication was developed to achieve much improved tolerance in electrical performance. High-precision, high quality factor, and high component densities with thin-film layers on glass were used to realize innovative topologies on glass for high out-of-band rejection and low insertion loss. Low-loss 100-μm thick glass cores and multiple layers of 15-μm thin polymer films were used to build the filters on substrates. The demonstrated diplexers have dimensions of 2.3 ×2.8 ×.2 mm. Aided by the dimensional stability of glass and process control with semiadditive patterning, the performance of the fabricated filters showed excellent correlation with the simulation. The impact of process-sensitivity analysis on diplexer performance was also analyzed. Finally, a unique and innovative process solution was demonstrated to control the process deviation and achieve good diplexer tolerance. The performance deviation was controlled by ~3.5X with the new process.

scholarly journals Nanonet: Low-temperature-processed tellurium nanowire network for scalable p-type field-effect transistors and a highly sensitive phototransistor array

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Muhammad Naqi ◽  
Kyung Hwan Choi ◽  
Hocheon Yoo ◽  
Sudong Chae ◽  
Bum Jun Kim ◽  
...  
Keyword(s):  
Low Temperature ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Optical Measurements ◽  
Electrical Performance ◽  
Large Area ◽  
Nanowire Network ◽  
P Type ◽  
Nanowire Networks

AbstractLow-temperature-processed semiconductors are an emerging need for next-generation scalable electronics, and these semiconductors need to feature large-area fabrication, solution processability, high electrical performance, and wide spectral optical absorption properties. Although various strategies of low-temperature-processed n-type semiconductors have been achieved, the development of high-performance p-type semiconductors at low temperature is still limited. Here, we report a unique low-temperature-processed method to synthesize tellurium nanowire networks (Te-nanonets) over a scalable area for the fabrication of high-performance large-area p-type field-effect transistors (FETs) with uniform and stable electrical and optical properties. Maximum mobility of 4.7 cm2/Vs, an on/off current ratio of 1 × 104, and a maximum transconductance of 2.18 µS are achieved. To further demonstrate the applicability of the proposed semiconductor, the electrical performance of a Te-nanonet-based transistor array of 42 devices is also measured, revealing stable and uniform results. Finally, to broaden the applicability of p-type Te-nanonet-based FETs, optical measurements are demonstrated over a wide spectral range, revealing an exceptionally uniform optical performance.

Miniaturized and high-performance RF packages with ultra-thin glass substrates

2018 ◽  
Vol 77 ◽  
pp. 66-72 ◽  
Author(s):  
Min Suk Kim ◽  
Markondeya Raj Pulugurtha ◽  
Youngwoo Kim ◽  
Gapyeol Park ◽  
Kyungjun Cho ◽  
...  
Keyword(s):  
High Performance ◽  
Thin Glass ◽  
Glass Substrates

Mechanical Characterization of Sandwich Composite Structure using a New Experimental Approach

2016 ◽  
Vol 25 (5) ◽  
pp. 096369351602500 ◽  
Author(s):  
F. Alila ◽  
J. Fajoui ◽  
M. Kchaou ◽  
P. Casari ◽  
N. Wali ◽  
...  
Keyword(s):  
Fatigue Life ◽  
High Performance ◽  
Life Time ◽  
Test Method ◽  
Core Material ◽  
Sandwich Composite ◽  
Foam Core ◽  
Current Standard ◽  
Thin Glass ◽  
The Impact

In marine construction, ship hulls are subjected to high fatigue stresses due to the impact of waves and their cyclic solicitations. However, fatigue behaviour evaluation of the constitutive materials of hull is based on standard tests. The objective of this study is to take a critical view on the current standard test method set to investigate the fatigue life of cellular foam core material as used in high performance sandwich materials. The highlight of this study is to develop a new geometry of specimen in order to achieve coherence between the actual fatigue life time of the real structure and the one of specimens tested in a controlled laboratory environment. The tested specimen is made out of a high-density foam core and thin glass fabric faces. Moreover, a new test rig of different flexure types, in quasi-static or fatigue loadings on sandwich specimens, was developed and validated.

Achieving Ceramic-like RF Capacitor Requirements with Organic-based Materials

2010 ◽  
Vol 2010 (1) ◽  
pp. 000072-000075 ◽  
Author(s):  
Jin-Hyun Hwang ◽  
John Andresakis ◽  
Bob Carter ◽  
Yuji Kageyama ◽  
Fujio Kuwako
Keyword(s):  
Dielectric Constant ◽  
Form Factor ◽  
High Dielectric Constant ◽  
High Volume ◽  
Electrical Performance ◽  
Frequency Range ◽  
Large Area ◽  
Low Loss ◽  
Capacitance Variation ◽  
High Dielectric

New and novel organic-based composite materials for the use of embedded RF capacitors have been developed to address the important material issues by means of functional filler and resin chemistry. Combining different fillers with appropriate chemistries, the net composite can be made thermally stable while retaining the high dielectric constant and low loss. These composites attained dielectric constant of above 7 without compromising the quality factor in GHz frequency range. In addition, measurement of capacitance variation as a function of temperature (TCC) showed flatter TCC profile, resulting in TCC of ±30 ppm/°C over the temperature range −55°C to 125°C. It can be incorporated into organic chip package and, unlike ceramic-based LTCC they can utilize large area processing that is typical, and available in high volume manufacturing. This material is formulated for RF module designers to successfully implement embedded RF capacitors into their organic chip package designs and thus improve form factor, electrical performance and possibly reduce overall costs.

scholarly journals Simulations of the impact of small details on the magnetic fileld distribution for the compact superconducting cyclotron SC200 commissioning

2019 ◽  
Vol 201 ◽  
pp. 07002
Author(s):  
Dmitry Popov ◽  
Oleg Karamyshev ◽  
Galina Karamysheva ◽  
Vladimir Malinin ◽  
Grigori Shirkov
Keyword(s):  
Magnetic Field ◽  
Virtual Reality ◽  
Field Distribution ◽  
High Precision ◽  
High Performance ◽  
Magnetic Field Distribution ◽  
The Real ◽  
Superconducting Cyclotron ◽  
The Impact ◽  
The Magnetic Field

Modern packages for the design and simulation of cyclotron magnet systems, such as Tosca, CST Studio, Comsol, etc., combined with recent hardware of high performance, allow us to simulate and estimate even a subtle impact on the magnetic field distribution caused by small details and other systems of the accelerator. Such reckoning provides the data to perform and simulate the refilnement of the magnet called the ‘shimming’. That means a signifilcant part of the commissioning stage could be done in ‘virtual reality’. This could substantially decrease the duration of the shimming procedure of the real magnet and the amount of the material wasted on it, eventually this results in a fileld of high-precision which could be compared to real one.

scholarly journals Laser Processing Optimization for Large-Area Perovskite Solar Modules

Energies ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 1069
Author(s):  
Stefano Razza ◽  
Sara Pescetelli ◽  
Antonio Agresti ◽  
Aldo Di Carlo
Keyword(s):  
Laser Processing ◽  
High Performance ◽  
Large Area ◽  
Solar Module ◽  
2D Material ◽  
High Performing ◽  
In Series ◽  
Processing Optimization ◽  
Module Performance ◽  
The Impact

The industrial exploitation of perovskite solar cell technology is still hampered by the lack of repeatable and high-throughput fabrication processes for large-area modules. The joint efforts of the scientific community allowed to demonstrate high-performing small area solar cells; however, retaining such results over large area modules is not trivial. Indeed, the development of deposition methods over large substrates is required together with additional laser processes for the realization of the monolithically integrated cells and their interconnections. In this work, we develop an efficient perovskite solar module based on 2D material engineered structure by optimizing the laser ablation steps (namely P1, P2, P3) required for shaping the module layout in series connected sub-cells. We investigate the impact of the P2 and P3 laser processes, carried out by employing a UV pulsed laser (pulse width = 10 ns; λ = 355 nm), over the final module performance. In particular, a P2 process for removing 2D material-based cell stack from interconnection area among adjacent cells is optimized. Moreover, the impact of the P3 process used to isolate adjacent sub-cells after gold realization over the module performance once laminated in panel configuration is elucidated. The developed fabrication process ensures high-performance repeatability over a large module number by demonstrating the use of laser processing in industrial production.

RF System in Packages (SiP) using Integrated Passive Devices

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001977-001995
Author(s):  
Kai Liu ◽  
YongTaek Lee ◽  
HyunTai Kim ◽  
Gwang Kim ◽  
Billy Ahn
Keyword(s):  
High Performance ◽  
Substrate Material ◽  
Electrical Performance ◽  
Low Loss ◽  
Passive Components ◽  
Cycle Times ◽  
Rf Power Amplifier ◽  
Small Form Factor ◽  
Rf Packaging ◽  
Tolerance Control

Passive components are indispensible parts used in System in Packages (SiP) for various functions, such as decoupling, biasing, resonating, filtering, matching, transforming, etc. Making passive components embedded inside laminate substrates is limited on passive density. SMD solutions are by far the most popular approaches in the industry, and may still be dominant for some times. As high integration and high performance have become a trend in the packaging solutions, integrated passive device (IPD) technology shows some unique features, which helps to achieve these goals, especially for RF packages. In the IPD process, low-loss substrate material is used, and therefore high-Q inductors can be built. In addition, thin-film IPD process has finer pitch feature and better tolerance control than other commonly available ones, such as PCB and LTCC technologies, which may yield very repeatable electrical performance, and provide packages of high integration. Several cases of study will be presented and here are some highlights of them. In case one, a most straightforward SiP approach is presented using QFN package, where several dies (including IPD dies) are implemented side-by-side. This approach may give fast developing cycle times. But importantly, wire-bonding models have big impact on performance from RF packaging, and should be obtained accurately for designs. Another case of study is a stack-die package, where inter-die coupling/cross talk could be a big issue as far as electrical performance is concerned. Placement of some critical parts, such as coils in IPD and in VCO, should be investigated very carefully in design phases. This leads to a concept of ‘IC/IPD/package’ co-design. Finally, a hybrid SiP package solution, where an IPD die is embedded in a mold compound along side with a RF power amplifier die, is presented. This approach (so called ‘eWLB’ packaging), results in the shortest interconnection between dies to dies and dies to balls. With the benefit from both the IPD process and the eWLB process (where low-loss mold materials are used), this approach may lead to high electrical performance and small form-factor at the same time.

Challenges of Adhesion Promotion for the Metallization of Glass Interposers

2013 ◽  
Vol 2013 (1) ◽  
pp. 000635-000640 ◽  
Author(s):  
Simon Bamberg ◽  
Michael Merschy ◽  
Tobias Bernhard ◽  
Frank Bruening ◽  
Robin Taylor ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Sol Gel ◽  
Thin Glass ◽  
Oxide Layers ◽  
Glass Substrates ◽  
Adhesion Promotion ◽  
Adhesion Measurement ◽  
Mechanical Anchoring ◽  
The Cost ◽  
The Impact

Ultra-miniaturization and 3D integration of electronic systems require interposers with a very high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. Through hole via formation or Through Package Via (TPV) in combination with the ability to handle of thin glass materials have already been demonstrated in combination with “polymer on glass” technologies at Georgia Tech Packaging Research Center and by industrial partners. However there is an increasing industry demand to plate electroless copper directly onto smooth glass substrates which is extremely challenging. This is being driven by the desire to be able to benefit from the ability to utilize existing infrastructure and therefore fully benefit from the cost advantages wet-chemical metallization can offer in the manufacturing of glass interposers. It is therefore worthwhile to investigate replacing adhesion promoting techniques such as sputtered metal seed layers or laminated polymer films with a pure wet chemistry alternative. In this study a modified sol gel processes were developed for the formation of metal oxide layers on the glass substrate. The impact of the sol composition on the resulting oxide's surface structure was examined. Centrifugal adhesion measurement allowed quantification of the mechanical anchoring provided by metal oxide layers prepared from different sol gel compositions. With regards to the interposer manufacturing process, the two possibilities of applying the sol gel coating prior to as well as after TPV formation are compared and their respective advantages are discussed.

scholarly journals Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

2018 ◽  
Vol 2018 ◽  
pp. 1-19 ◽  
Author(s):  
Eva S. Rosker ◽  
Rajinder Sandhu ◽  
Jimmy Hester ◽  
Mark S. Goorsky ◽  
Jesse Tice
Keyword(s):  
Transmission Lines ◽  
High Performance ◽  
Low Cost ◽  
Ease Of Use ◽  
Multidisciplinary Teams ◽  
Direct Writing ◽  
Structure Property ◽  
Low Loss ◽  
Rf Components ◽  
Subtractive Manufacturing

Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

scholarly journals Electrical and Mechanical Analysis of Different TSV Geometries

Metals ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 467
Author(s):  
Il Ho Jeong ◽  
Alireza Eslami Majd ◽  
Jae Pil Jung ◽  
Nduka Nnamdi Ekere
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
High Performance ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Electrical Signal ◽  
Electrical Performance ◽  
Mechanical Reliability ◽  
Silicon Chips ◽  
The Impact

Through-silicon via (TSV) is an important component for implementing 3-D packages and 3-D integrated circuits as the TSV technology allows stacked silicon chips to interconnect through direct contact to help facilitate high-speed signal processing. By facilitating the stacking of silicon chips, the TSV technology also helps to meet the increasing demand for high density and high performance miniaturized electronic products. Our review of the literature shows that very few studies have reported on the impact of TSV bump geometry on the electrical and mechanical characteristics of the TSV. This paper reports on the investigation of different TSV geometries with the focus on identifying the ideal shapes for improved electrical signal transmission as well as for improved mechanical reliability. The cylindrical, quadrangular (square), elliptical, and triangular shapes were investigated in our study and our results showed that the quadrangular shape had the best electrical performance due to good characteristic impedance. Our results also showed that the quadrangular and cylindrical shapes provided improved mechanical reliability as these two shapes lead to high Cu protrusion of TSV after the annealing process.

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