Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)
2012 ◽
Vol 9
(2)
◽
pp. 97-103
◽
Keyword(s):
3D Ic
◽
Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.
2011 ◽
Vol 2011
(1)
◽
pp. 000025-000032
◽
2016 ◽
Vol 7
(1-2)
◽
pp. 45-55
Keyword(s):
2016 ◽
Vol 138
(11)
◽
2016 ◽