State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
2021 ◽
Vol 18
(4)
◽
pp. 145-160
Keyword(s):
Abstract In this study, the recent advances and trends of chip-let design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.
2021 ◽
Vol 22
(2)
◽
pp. 12-18
◽
Keyword(s):
Keyword(s):
2017 ◽
Vol 35
(2)
◽
pp. 310-322
◽