scholarly journals Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module

2021 ◽  
Vol 18 (3) ◽  
pp. 123-136
Author(s):  
Tzu-Hsuan Cheng ◽  
Kenji Nishiguchi ◽  
Yoshi Fukawa ◽  
B. Jayant Baliga ◽  
Subhashish Bhattacharya ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
High Power ◽  
High Performance ◽  
Mechanical Performance ◽  
Resin Composite ◽  
Wide Band ◽  
Cost Effective ◽  
Power Module ◽  
Wide Band Gap ◽  
Epoxy Resin Composite

Abstract Wide-Band Gap (WBG) power devices have become a promising option for high-power applications due to the superior material properties over traditional Silicon. To not limit WBG devices’ mother nature, a rugged and high-performance power device packaging solution is necessary. This study proposes a Double-Side Cooled (DSC) 1.2 kV half-bridge power module having dual epoxy resin insulated metal substrate (eIMS) for solving convectional power module challenges and providing a cost-effective solution. The thermal performance outperforms traditional Alumina (Al2O3) Direct Bonded Copper (DBC) DSC power module due to moderate thermal conductivity (10 W/mK) and thin (120 mm) epoxy resin composite dielectric working as the IMS insulation layer. This novel organic dielectric can withstand high voltage (5 kVAC @ 120 μm) and has a Glass Transition Temperature (Tg) of 300°C, which is suitable for high-power applications. In the thermal-mechanical modeling, the organic DSC power module can pass the thermal cycling test over 1,000 cycles by optimizing the mechanical properties of the encapsulant material. In conclusion, this article not only proposes a competitive organic-based power module but also a methodology of evaluation for thermal and mechanical performance.

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

2020 ◽  
Vol 2020 (1) ◽  
pp. 000277-000281
Author(s):  
Tzu-Hsuan Cheng ◽  
Kenji Nishiguchi ◽  
Yoshi Fukawa ◽  
B. Jayant Baliga ◽  
Subhashish Bhattacharya ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Resin Composite ◽  
Cost Effective ◽  
Organic Substrates ◽  
Power Module ◽  
Epoxy Resin Composite ◽  
Thermally Conductive ◽  
Low Modulus

Abstract Silicon-Carbide (SiC) power devices have become a promising option for traditional Silicon (Si) due to the superior material properties. To fully take advantage of the SiC devices, a high-performance power device packaging solution is necessary. This study proposes a cost-effective double-sided cooled (DSC) 1.2 kV SiC half-bridge power module using organic epoxy-resin composite dielectric (ERCD) substrates. The high mechanical and thermal performance of the power module is achieved by the low-modulus, moderate thermal conductivity, and relatively thin (120 μm) layer of ERCD material compared with traditional metal-clad ceramic approaches. This novel organic dielectric can withstand high voltage (5 kV @ 120 μm) and operate up to 250°C continuously, which is indispensable for high power applications. The thermal modeling results show that the equivalent thermal resistance junction-to-case (Rjc_eq) of the DSC power module using dual direct bonded copper (DBC) is 17% higher than the dual ERCD configuration. Furthermore, a non-insulated DSC power module concept is proposed for maximizing thermal performance by considering thermal vias in the ERCD substrate and direct-soldered heat sink. A thought process for optimization of thermal via design is demonstrated and it shows up to 24% of improvement on thermal performance compared with the insulated DSC power module.

Preparation and Characterization of Epoxy Resin Composite Modified by Flexible Polyurethane Resin

2014 ◽  
Vol 904 ◽  
pp. 170-172 ◽  
Author(s):  
Rong Cheng ◽  
Cheng Zhang ◽  
Jing Wang
Keyword(s):  
Composite Materials ◽  
Epoxy Resin ◽  
Performance Test ◽  
Mechanical Performance ◽  
Resin Composite ◽  
Mass Ratio ◽  
Scanning Calorimetry ◽  
Epoxy Resin Composite ◽  
Amine Curing ◽  
Modified Epoxy

In this paper, under the effect of MD1041 cashew oil modified phenolic amine curing agent for epoxy resin, it successfully prepared polyurethane flexible resin modified epoxy resin composite materials by using polyurethane modified epoxy resin reinforced flexible resin. Modified composite material of the new preparation is characteristed by the method of the mechanical performance test, Fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry (DSC). The results show that the flexible resin has a strong effect on the toughness of modified epoxy resin composite materials. When the mass ratio of the flexible resin account for 5.9%,comprehensive mechanical properties of the modified composites is at the premium; when the mass ratio of flexible resin account for 3.1%, the thermal stability of the epoxy resin modified with flexible resin is at the best.

Cd1-xMgxS CQDs Thin Films for High Performance and Highly Selective NIR Photodetection

2021 ◽  
Author(s):  
Pragati Kumar ◽  
Tania Kalsi
Keyword(s):  
Thin Films ◽  
Band Gap ◽  
High Performance ◽  
Wide Band ◽  
Cost Effective ◽  
Wide Band Gap ◽  
Wide Band Gap Semiconductors

Development of high-performance and highly selective NIR photodetectors (PDs) using wide band gap semiconductors is a significant field of research in the present scenario. Herein, cost effective and easy to...

The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000065-000072 ◽  
Author(s):  
Sayan Seal ◽  
Michael D. Glover ◽  
H. Alan Mantooth
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Feasibility Studies ◽  
Wide Band ◽  
Power Devices ◽  
Power Module ◽  
Wide Band Gap ◽  
Fast Switching ◽  
Power Modules ◽  
Wide Band Gap Semiconductors

Abstract This paper presents the plan and initial feasibility studies for an Integrated Wire Bondless Power Module (IWPM). Contemporary power modules are moving toward unprecedented levels of power density. The ball has been set rolling by a drastic reduction in the size of bare die power devices themselves owing to the advent of wide band gap semiconductors like silicon carbide (SiC) and gallium nitride (GaN). SiC has capabilities of operating at much higher temperatures and faster switching speeds as compared with its silicon counterparts, while being a fraction of their size. However, electronic packaging technology has not kept pace with these developments. High performance packaging technologies do exist in isolation, but there has been limited success in integrating these disparate efforts into a single high performance package of sufficient reliability. This paper lays the foundation for an electronic package which is designed to completely leverage the benefits of SiC semiconductor technology, with a focus on high reliability and fast switching capability.

Preparation and characterization of sodium silicate/epoxy resin composite bonded Nd-Fe-B magnets with high performance

2019 ◽  
Vol 37 (10) ◽  
pp. 1083-1087 ◽  
Author(s):  
Weiqiang Liu ◽  
Wang Xi ◽  
Ruijin Hu ◽  
Ming Yue ◽  
Yuxia Yin ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Sodium Silicate ◽  
High Performance ◽  
Resin Composite ◽  
Epoxy Resin Composite

Research of Fly Ash-Epoxy Resin Composite

2012 ◽  
Vol 450-451 ◽  
pp. 692-695
Author(s):  
Jin Hu Dong
Keyword(s):  
Tensile Strength ◽  
Fly Ash ◽  
Impact Strength ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Cost Effective ◽  
Resin Content ◽  
Epoxy Resin Composite ◽  
Result Show ◽  
Composite Properties

This article researched fly ash-epoxy resin composite properties and microstructure changing with the increase of epoxy resin content. The result show that, when the epoxy resin content increased to 30%, the tensile strength, rupture elongation and impact strength of composite increased to 329%, 168% and 257% respectively compare with the composite of epoxy resin content is 15%, and various properties change little with the epoxy resin content continuous increasing. And the composite formed 2μm or so and uniform distributed micro-pores when the epoxy resin content is 30% and the consistency of micro-pores increasing and some small micro-pores gathered into larger with the epoxy resin content increasing. Considering various properties, the fly ash-epoxy resin composite has the highest cost-effective when the epoxy resin content is 30 ~ 40%.

Sign in / Sign up

Export Citation Format

Share Document