scholarly journals High-Temperature Double-Layer Ceramic Packaging Substrates

2020 ◽  
Vol 17 (3) ◽  
pp. 99-105
Author(s):  
Ardalan Nasiri ◽  
Simon S. Ang
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Double Layer ◽  
Room Temperature ◽  
Thermal Tests ◽  
Ceramic Substrates ◽  
Interlayer Dielectric ◽  
Standard Product ◽  
The Military ◽  
Venusian Surface

Abstract A double-layer ceramic electronic packaging technology that survives the Venusian surface temperature of 465°C was developed using a ceramic interlayer dielectric with gold conductors. A 60-μm ceramic interlayer dielectric served as the insulator between the top and bottom gold conductors on high-purity ceramic substrates. Test devices with AuPtPd metallization were attached to the top gold pads using a thick-film gold paste. Thermal aging for 115 h at 500°C and thermal cycling from room temperature to 450°C were performed. Dielectric leakage tests of the interlayer ceramic layer between the top and bottom gold conductors revealed a leakage current density of less than 50 × 10−7 A/cm2 at 600 V after thermal cycling. Gold conductor resistance increased slightly after thermal cycling. The die shear test showed a 33% decrease in die shear strength after thermal tests and its 6.16 kg-F die shear strength satisfies the Military Standard Product Testing Services (MIL-STD) method.

High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

2016 ◽  
Vol 680 ◽  
pp. 179-183 ◽  
Author(s):  
Ming Chao Wang ◽  
Meng Meng Zhuang ◽  
Xin Tao ◽  
Xi Qing Xu ◽  
Hai Tao Geng ◽  
...  
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Thermal Cycling ◽  
Bonding Strength ◽  
Room Temperature ◽  
Temperature Range ◽  
Heat Resistant ◽  
Bonding Effect ◽  
Temperature Shear

A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that the bonding strength of cured adhesive decreased from 7.9 MPa at RT to 0.9 MPa at 1300°C, while that of 1300°C-calcined adhesive could maintain about 4 MPa at temperature range from RT to 700°C and then decreased to 1.7 MPa at 1300°C. Besides, with the increasing thermal cycling times at 1300°C, the high-temperature bonding strength at this temperature could maintain at about 2.3 MPa.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

scholarly journals Flexible electric-double-layer thin film transistors based on a vertical InGaZnO4 channel

RSC Advances ◽  
2021 ◽  
Vol 11 (29) ◽  
pp. 17910-17913
Author(s):  
Liuhui Lei ◽  
Yuanyuan Tan ◽  
Xing Yuan ◽  
Wei Dou ◽  
Jiale Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Double Layer ◽  
Electric Double Layer ◽  
Thin Film Transistors ◽  
Room Temperature ◽  
Layer Thin Film

Flexible electric-double-layer (EDL) thin film transistors (TFTs) based on a vertical InGaZnO4 (IGZO) channel are fabricated at room temperature.

Thermal Cycling of Epoxy Coatings Using Room Temperature Ionic Liquids

2008 ◽  
Vol 155 (3) ◽  
pp. C93 ◽  
Author(s):  
B. R. Hinderliter ◽  
K. N. Allahar ◽  
G. P. Bierwagen ◽  
D. E. Tallman ◽  
S. G. Croll
Keyword(s):  
Ionic Liquids ◽  
Thermal Cycling ◽  
Room Temperature ◽  
Room Temperature Ionic Liquids ◽  
Epoxy Coatings

The Fire Resistance Performance of Double-Layer Square Pyramid Silo-Shell Structure under Fire

2013 ◽  
Vol 405-408 ◽  
pp. 2305-2310
Author(s):  
Ling Feng Gong ◽  
Yin Bai ◽  
Jian Lei Zhai
Keyword(s):  
Double Layer ◽  
Fire Resistance ◽  
Shell Structure ◽  
Room Temperature ◽  
Uniform Temperature ◽  
Global Instability ◽  
Element Analysis ◽  
Fire Temperature ◽  
Resistance Performance ◽  
Typical Temperature

With fire temperature rising, elastic modulus of steel would be reduce, which then would lead to global instability phenomenon of double-layer square pyramid silo-shell structure. In order to analyze its fire resistance performance under high fire temperature, different geometric parameters were set based on the effect factors when it operated normally at room temperature. To analyze its displacement change by conducting nonlinear finite element analysis which was under the two typical temperature rising cases including global non-uniform temperature and localized high temperature. Then, with the temperature rising, the fire resistance performance and the maxium displacement changing rule were obtained.

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

1997 ◽  
Vol 476 ◽  
Author(s):  
P. H. Townsend ◽  
S. J. Martin ◽  
J. Godschalx ◽  
D. R. Romer ◽  
D. W. Smith ◽  
...  
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Integrated Circuits ◽  
Room Temperature ◽  
Polymer Network ◽  
Flow Characteristics ◽  
Interlayer Dielectric

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics

2012 ◽  
Vol 2012 (1) ◽  
pp. 000410-000413
Author(s):  
David J Rasmussen
Keyword(s):  
Room Temperature ◽  
High Tech ◽  
Ceramic Substrates ◽  
Precise Control ◽  
Hot Gas ◽  
Gold Ball ◽  
Ball Bonding ◽  
Wire Coil ◽  
Bond Pads ◽  
Heated Capillary

Microelectronics used in automotive applications have grown considerably in the last few years with more high tech electronics controlling more functions in automobiles. In an effort to have more precise control and to reduce vehicle weight manufacturers are integrating more functions into smaller packages. Many of these packages are embedded in molded plastic. This causes challenges when it comes to wirebonding these devices. They often cannot be heated to traditional Gold Ball Thermosonic wirebonding temperatures of 120 – 150C. However, using a heated capillary to bond the parts which remain at room temperature simplifies the process considerably. Alternatives such as pre-heating the parts in an oven and complex hot gas handler systems are not required. With a resistive wire coil heater surrounding a standard (or long capillary for deep access) sufficient heat can be provided to the wire bond site for a strong and reliable interconnect. The bonding surface can be any material used in gold ball bonding: aluminum bond pads on die, plated contacts, ceramic substrates or plated copper traces on PCBs. This paper will show that this heated tool process has been successfully utilized with 1mil Au wire and many of the standard die and substrate materials with little impact on process parameters.

Effect of Water Temperature on Interfacial Shear Strength of Resin Particles Added CFRTP

2018 ◽  
Vol 774 ◽  
pp. 7-12
Author(s):  
Hideaki Katogi ◽  
Kenichi Takemura ◽  
Mao Mochizuki
Keyword(s):  
Shear Strength ◽  
Carbon Fiber ◽  
Water Temperature ◽  
Room Temperature ◽  
Interfacial Shear Strength ◽  
Water Immersion ◽  
Interfacial Shear ◽  
Water Penetration ◽  
Resin Particle ◽  
Particle Addition

In this study, interfacial shear strength of resin particles added carbon fiber/maleic acid anhydride grafted polypropylene under water temperature was investigated. Water temperature range was from room temperature to 80 oC. The maximum immersion time was 24 hours. Micro debonding tests of non and resin particles added composites were conducted. Fracture surface of resin particles added composite were observed by Scanning Electron Microscope (SEM). As a result, interfacial shear strengths of non particles added composite monotonously decreased with an increase of water temperature. Interfacial shear strength of resin particles added composite was higher than that of non resin particles added composite under all water temperatures except for 50 oC. From SEM observation, large resin particles on surface of carbon fiber after water immersion at 50 oC were found. And, many matrices and large resin particles on surface of carbon fiber after water immersion at 80 oC were found. Therefore, interfacial shear strength of composite was improved because resin particle addition prevented water penetration into the interface between fiber and matrix under water immersion less than 50 oC. And, interfacial shear strength of composite was probably improved by anchor effect of resin particle under water immersion at 80 oC.

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