Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000033-000038
Author(s):  
Mustafa A. Syammach ◽  
Mustapha Habibi ◽  
Fauzi A. Syammach
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Leading Edge ◽  
Performance Characteristics ◽  
Operating Voltage ◽  
Insulation Resistance ◽  
Design Engineers ◽  
Ceramic Capacitors ◽  
Life Tests

Availability of a reliable and consistent source for high temperature ceramic capacitors has been an ongoing issue for design engineers for the purpose of developing product for applications up to and including +300°C. The general practice has been to de-rate standard X7R ceramic capacitors for high temperature applications and settle for a device characterized by a significant reduction in the critical performance features related to capacitance value, operating voltage, insulation resistance and breakdown voltage, not to mention a substantial roll off in temperature coefficient above +150°C. In addition, the need to provide coated and / or leaded options also presents additional concerns related to operational integrity. This paper presents packaging options, life tests reliability data and compares performance characteristics for a unique high K, high temperature ceramic capacitor, to the more traditional options. This approach utilizes leading edge, Class II dielectric and packaging materials that have been specifically developed for use at +300°C and then benefit from enhanced reliability when operated at lower temperatures. As shown in this paper, capacitors manufactured with this dielectric material exhibit much higher capacitance per unit volume and significant improvements in insulation resistance, without having to sacrifice mechanical strength, voltage rating or long term reliability.

Demonstrated Performance Characteristics For Improved High Temperature Ceramic Capacitors Intended For Use In Extreme, Harsh Environments

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000188-000193
Author(s):  
Mustafa A. Syammach ◽  
Michael J. Roach ◽  
Fauzi A. Syammach ◽  
Mustapha Habibi
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Leading Edge ◽  
Performance Characteristics ◽  
Test Reliability ◽  
Operating Voltage ◽  
Insulation Resistance ◽  
Design Engineers ◽  
Ceramic Capacitor ◽  
Ceramic Capacitors

Availability of a reliable and consistent source for high temperature ceramic capacitors has been an ongoing issue for design engineers looking at developing product for applications up to and including +300°C. The general practice has been to derate standard X7R ceramic capacitors for high temperature applications and settle for a device characterized by a significant reduction in those critical performance features related to capacitance value, operating voltage, insulation resistance and breakdown voltage, not to mention a substantial roll off in temperature coefficient above +150°C. In addition, the need to provide coated and / or leaded options also presents additional concerns related to operational integrity. This paper presents packaging options, life test reliability data and compares performance characteristics for a unique high K, high temperature ceramic capacitor, to the more traditional options. This approach utilizes leading edge, Class II dielectric and packaging materials that have been specifically developed for use at +300°C and then benefit from enhanced reliability when operated at lower temperatures. As shown in this paper, capacitors manufactured with this dielectric material exhibit much higher capacitance per unit volume and significant improvements in insulation resistance, without having to sacrifice mechanical strength, voltage rating or long term reliability.

Robust Class-I BME Ceramic Capacitors for High Temperature Applications

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000251-000258
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Jeff Franklin ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Test Data ◽  
Dielectric Material ◽  
Class I ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

In capacitors for applications at temperatures of 150°C or above, such as automotive under-the-hood electronics and power electronics, a robust dielectric material is necessary. In traditional X8R ceramic capacitors (EIA specification, ΔC/C within ±15% between −55°C and +150°C compared that at 25°C), the dielectric material is designed for applications up to 150°C. However, at temperatures above 150°C, the X8R capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors at temperatures ≥150°C. In addition, test data from D-E curves and energy density measurements will be reported along with a discussion of possible mechanisms behind the robust reliability of this material.

Stacked Ceramic Capacitors for High Temperatures (≥200°C)

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000112-000120 ◽  
Author(s):  
John Bultitude ◽  
Lonnie Jones ◽  
John McConnell ◽  
Abhijit Gurav
Keyword(s):  
High Temperature ◽  
Shear Test ◽  
Dielectric Material ◽  
Hole Drilling ◽  
Well Control ◽  
Solder Interconnects ◽  
Deep Well ◽  
Ceramic Capacitors ◽  
Reliable Performance ◽  
Temperature Shear

High temperature applications at 200°C or above in electronics for down-hole drilling are driving the development of capacitors with ever more reliable performance. Deeper wells with increased temperatures and pressures have resulted in exposure to harsher conditions for longer times for the electronics used in the extraction tools and deep-well control instrumentation. The capacitor solutions currently available for 200°C operation are reviewed by value and rated voltage. Some key reliability factors attributed of the various technologies are identified. The recent development of stacks made using multi-layer ceramic capacitors (MLCC) of Class-I C0G type dielectric material with nickel inner electrodes are outlined with respect to their performance benefits at ≥ 200°C. Due to its linear dielectric nature this material exhibits highly stable capacitance as a function of temperature and voltage. The development of higher voltages and larger case size capacitors using this technology is discussed together with their incorporation into stacked ceramic capacitors by soldering on lead frames. Stacks of multi-layer ceramic capacitors (MLCC) allow capacitance to be maximized within the volume available. However, the solder interconnects must be evaluated to assess the long term reliability of the stacks at higher temperatures particularly with respect to maintaining mechanical and electrical integrity. The development of a custom high temperature shear test to evaluate the performance of different solder interconnects at temperatures from 200 to 260°C is described. Evaluations of two different HMP Pb-based solders are presented. The high and low temperature shear test data acquired for these solders is analyzed in terms of the strain and strain energy when force is applied. Changes in performance after exposure to temperatures ≥ 200°C are assessed. The results are interpreted with respect to the values required to survive high g-forces and the performance of the different solder compositions. Performance considerations for high shear strength interconnects at 200°C and beyond are discussed.

Ceramic Capacitors and Stacks for High Temperature Applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000030-000037 ◽  
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
John Bultitude ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

There is a growing need for ceramic capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling, geothermal energy generation and power electronics. In traditional X8R ceramic capacitors (EIA specification, TCC or ΔC/C within ±15% between −55°C and +150°C compared that at 25°C), the dielectric material is designed for applications up to 150°C. However, at temperatures above 150°C, the X8R capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C and beyond. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors at high temperatures at 150–200°C and above along with a discussion of possible mechanisms behind the robust reliability of this high temperature dielectric.

Advanced Ceramic Capacitor Solutions for High Temperature Applications

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000025-000032
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Paul Staubli ◽  
John Bultitude ◽  
...  
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitor ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Reliability Performance ◽  
Temperature Applications

For high temperature applications at 150°C or above, such as those in electronics for down-hole drilling, geothermal energy generation and power electronics, a robust dielectric material is necessary for capacitors. Ceramic capacitors using X7R and X8R type dielectrics are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these X7R/X8R types of ceramic capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially when bias is applied. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chip and leaded configurations at 150–200°C and above, and discuss possible mechanisms behind the robust reliability of this high temperature dielectric.

SMD and Leaded Ceramic Capacitors for High Temperature Applications

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000284-000291
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
John Bultitude ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Temperature Applications

For high temperature applications at 150°C or above, such as in electronics for down-hole drilling, geothermal energy generation, power electronics and automotive under the hood electronics, a robust dielectric material is necessary for capacitors. Common X7R and X8R type ceramic capacitors are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these types of capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCCs) made from this material can be qualified as X9G. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chip and leaded configurations at 150–200°C and above along with a discussion of possible mechanisms behind the robust reliability of this high temperature dielectric.

Stacked Ceramic Capacitors for High Temperatures (≥200°C)

2014 ◽  
Vol 11 (4) ◽  
pp. 166-173 ◽  
Author(s):  
John Bultitude ◽  
Lonnie Jones ◽  
John McConnell ◽  
Abhijit Gurav
Keyword(s):  
High Temperature ◽  
Shear Test ◽  
Dielectric Material ◽  
High Shear ◽  
Well Control ◽  
Solder Interconnects ◽  
Deep Well ◽  
Ceramic Capacitors ◽  
Reliable Performance ◽  
Temperature Shear

High-temperature applications (200°C or above) in electronics for downhole drilling are driving the development of capacitors with ever more reliable performance. Deeper wells with increased temperatures and pressures have resulted in exposure to harsher conditions for longer times for the electronics used in the extraction tools and deep-well control instrumentation. The capacitor solutions currently available for 200°C operation are reviewed by value and rated voltage. Some key reliability factors attributed to the various technologies are identified. The recent development of stacks made by using multilayer ceramic capacitors (MLCCs) of Class-I C0G type dielectric material with base-metal electrodes of nickel are outlined with respect to their performance benefits at temperatures of 200°C and higher. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. The development of higher voltages and larger case-size capacitors using this technology is discussed together with their incorporation into stacked ceramic capacitors by soldering on lead frames. Stacks of MLCCs allow capacitance to be maximized within the volume available. However, the solder interconnects must be evaluated to assess the long-term reliability of the stacks at higher temperatures, particularly with respect to maintaining mechanical and electrical integrity following exposure to high shear forces. The development of a custom high-temperature shear test to evaluate the performance of different solder interconnects at temperatures from 200–260°C is described. Evaluations of two different high melting point, Pb-based solders are presented. The high- and low-temperature shear test data acquired for these solders are analyzed in terms of the strain and strain energy when force is applied. Changes in performance after exposure to temperatures 200°C or above are assessed. The results are interpreted with respect to the values required to survive high g-forces and the performance of the different solder compositions. Performance considerations for high shear strength interconnects at 200°C and higher are discussed.

Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

1988 ◽  
Vol 46 ◽  
pp. 550-551
Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Second Phase ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

KUBOTA KNC-03

Alloy Digest ◽  
2010 ◽  
Vol 59 (1) ◽  
Keyword(s):  
Compressive Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
High Strength ◽  
Temperature Performance ◽  
Resistance To Oxidation

Abstract Kubota KNC-03 is a grade with a combination of high strength and excellent resistance to oxidation. These properties make this alloy suitable for long-term service at temperature up to 1250 deg C (2282 deg F). This datasheet provides information on physical properties, hardness, elasticity, tensile properties, and compressive strength as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: Ni-676. Producer or source: Kubota Metal Corporation, Fahramet Division. See also Alloy Digest Ni-662, April 2008.

ATI 6-2-4-2

Alloy Digest ◽  
2020 ◽  
Vol 69 (8) ◽  
Keyword(s):  
Tensile Strength ◽  
Titanium Alloy ◽  
High Temperature ◽  
Creep Strength ◽  
High Strength ◽  
Heat Treating ◽  
Good Combination ◽  
Long Term Stability ◽  
Temperature Performance

Abstract ATI 6-2-4-2 is a near-alpha, high strength, titanium alloy that exhibits a good combination of tensile strength, creep strength, toughness, and long-term stability at temperatures up to 425 °C (800 °F). Silicon up to 0.1% frequently is added to improve the creep resistance of the alloy. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as creep. It also includes information on high temperature performance as well as forming, heat treating, machining, and joining. Filing Code: Ti-169. Producer or Source: ATI.

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