Stacked Ceramic Capacitors for High Temperatures (≥200°C)

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000112-000120 ◽  
Author(s):  
John Bultitude ◽  
Lonnie Jones ◽  
John McConnell ◽  
Abhijit Gurav
Keyword(s):  
High Temperature ◽  
Shear Test ◽  
Dielectric Material ◽  
Hole Drilling ◽  
Well Control ◽  
Solder Interconnects ◽  
Deep Well ◽  
Ceramic Capacitors ◽  
Reliable Performance ◽  
Temperature Shear

High temperature applications at 200°C or above in electronics for down-hole drilling are driving the development of capacitors with ever more reliable performance. Deeper wells with increased temperatures and pressures have resulted in exposure to harsher conditions for longer times for the electronics used in the extraction tools and deep-well control instrumentation. The capacitor solutions currently available for 200°C operation are reviewed by value and rated voltage. Some key reliability factors attributed of the various technologies are identified. The recent development of stacks made using multi-layer ceramic capacitors (MLCC) of Class-I C0G type dielectric material with nickel inner electrodes are outlined with respect to their performance benefits at ≥ 200°C. Due to its linear dielectric nature this material exhibits highly stable capacitance as a function of temperature and voltage. The development of higher voltages and larger case size capacitors using this technology is discussed together with their incorporation into stacked ceramic capacitors by soldering on lead frames. Stacks of multi-layer ceramic capacitors (MLCC) allow capacitance to be maximized within the volume available. However, the solder interconnects must be evaluated to assess the long term reliability of the stacks at higher temperatures particularly with respect to maintaining mechanical and electrical integrity. The development of a custom high temperature shear test to evaluate the performance of different solder interconnects at temperatures from 200 to 260°C is described. Evaluations of two different HMP Pb-based solders are presented. The high and low temperature shear test data acquired for these solders is analyzed in terms of the strain and strain energy when force is applied. Changes in performance after exposure to temperatures ≥ 200°C are assessed. The results are interpreted with respect to the values required to survive high g-forces and the performance of the different solder compositions. Performance considerations for high shear strength interconnects at 200°C and beyond are discussed.

Stacked Ceramic Capacitors for High Temperatures (≥200°C)

2014 ◽  
Vol 11 (4) ◽  
pp. 166-173 ◽  
Author(s):  
John Bultitude ◽  
Lonnie Jones ◽  
John McConnell ◽  
Abhijit Gurav
Keyword(s):  
High Temperature ◽  
Shear Test ◽  
Dielectric Material ◽  
High Shear ◽  
Well Control ◽  
Solder Interconnects ◽  
Deep Well ◽  
Ceramic Capacitors ◽  
Reliable Performance ◽  
Temperature Shear

High-temperature applications (200°C or above) in electronics for downhole drilling are driving the development of capacitors with ever more reliable performance. Deeper wells with increased temperatures and pressures have resulted in exposure to harsher conditions for longer times for the electronics used in the extraction tools and deep-well control instrumentation. The capacitor solutions currently available for 200°C operation are reviewed by value and rated voltage. Some key reliability factors attributed to the various technologies are identified. The recent development of stacks made by using multilayer ceramic capacitors (MLCCs) of Class-I C0G type dielectric material with base-metal electrodes of nickel are outlined with respect to their performance benefits at temperatures of 200°C and higher. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. The development of higher voltages and larger case-size capacitors using this technology is discussed together with their incorporation into stacked ceramic capacitors by soldering on lead frames. Stacks of MLCCs allow capacitance to be maximized within the volume available. However, the solder interconnects must be evaluated to assess the long-term reliability of the stacks at higher temperatures, particularly with respect to maintaining mechanical and electrical integrity following exposure to high shear forces. The development of a custom high-temperature shear test to evaluate the performance of different solder interconnects at temperatures from 200–260°C is described. Evaluations of two different high melting point, Pb-based solders are presented. The high- and low-temperature shear test data acquired for these solders are analyzed in terms of the strain and strain energy when force is applied. Changes in performance after exposure to temperatures 200°C or above are assessed. The results are interpreted with respect to the values required to survive high g-forces and the performance of the different solder compositions. Performance considerations for high shear strength interconnects at 200°C and higher are discussed.

Ceramic Capacitors and Stacks for High Temperature Applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000030-000037 ◽  
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
John Bultitude ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

There is a growing need for ceramic capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling, geothermal energy generation and power electronics. In traditional X8R ceramic capacitors (EIA specification, TCC or ΔC/C within ±15% between −55°C and +150°C compared that at 25°C), the dielectric material is designed for applications up to 150°C. However, at temperatures above 150°C, the X8R capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C and beyond. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors at high temperatures at 150–200°C and above along with a discussion of possible mechanisms behind the robust reliability of this high temperature dielectric.

Advanced Ceramic Capacitor Solutions for High Temperature Applications

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000025-000032
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Paul Staubli ◽  
John Bultitude ◽  
...  
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitor ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Reliability Performance ◽  
Temperature Applications

For high temperature applications at 150°C or above, such as those in electronics for down-hole drilling, geothermal energy generation and power electronics, a robust dielectric material is necessary for capacitors. Ceramic capacitors using X7R and X8R type dielectrics are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these X7R/X8R types of ceramic capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially when bias is applied. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chip and leaded configurations at 150–200°C and above, and discuss possible mechanisms behind the robust reliability of this high temperature dielectric.

SMD and Leaded Ceramic Capacitors for High Temperature Applications

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000284-000291
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
John Bultitude ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Temperature Applications

For high temperature applications at 150°C or above, such as in electronics for down-hole drilling, geothermal energy generation, power electronics and automotive under the hood electronics, a robust dielectric material is necessary for capacitors. Common X7R and X8R type ceramic capacitors are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these types of capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCCs) made from this material can be qualified as X9G. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chip and leaded configurations at 150–200°C and above along with a discussion of possible mechanisms behind the robust reliability of this high temperature dielectric.

Robust Class-I BME Ceramic Capacitors for High Temperature Applications

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000251-000258
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Jeff Franklin ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Test Data ◽  
Dielectric Material ◽  
Class I ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

In capacitors for applications at temperatures of 150°C or above, such as automotive under-the-hood electronics and power electronics, a robust dielectric material is necessary. In traditional X8R ceramic capacitors (EIA specification, ΔC/C within ±15% between −55°C and +150°C compared that at 25°C), the dielectric material is designed for applications up to 150°C. However, at temperatures above 150°C, the X8R capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors at temperatures ≥150°C. In addition, test data from D-E curves and energy density measurements will be reported along with a discussion of possible mechanisms behind the robust reliability of this material.

Demonstrated Performance Characteristics For Improved High Temperature Ceramic Capacitors Intended For Use In Extreme, Harsh Environments

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000188-000193
Author(s):  
Mustafa A. Syammach ◽  
Michael J. Roach ◽  
Fauzi A. Syammach ◽  
Mustapha Habibi
Keyword(s):  
High Temperature ◽  
Dielectric Material ◽  
Leading Edge ◽  
Performance Characteristics ◽  
Test Reliability ◽  
Operating Voltage ◽  
Insulation Resistance ◽  
Design Engineers ◽  
Ceramic Capacitor ◽  
Ceramic Capacitors

Availability of a reliable and consistent source for high temperature ceramic capacitors has been an ongoing issue for design engineers looking at developing product for applications up to and including +300°C. The general practice has been to derate standard X7R ceramic capacitors for high temperature applications and settle for a device characterized by a significant reduction in those critical performance features related to capacitance value, operating voltage, insulation resistance and breakdown voltage, not to mention a substantial roll off in temperature coefficient above +150°C. In addition, the need to provide coated and / or leaded options also presents additional concerns related to operational integrity. This paper presents packaging options, life test reliability data and compares performance characteristics for a unique high K, high temperature ceramic capacitor, to the more traditional options. This approach utilizes leading edge, Class II dielectric and packaging materials that have been specifically developed for use at +300°C and then benefit from enhanced reliability when operated at lower temperatures. As shown in this paper, capacitors manufactured with this dielectric material exhibit much higher capacitance per unit volume and significant improvements in insulation resistance, without having to sacrifice mechanical strength, voltage rating or long term reliability.

Class-I and Class-II Ceramic Capacitors for High Temperature Applications

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000121-000128
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Reggie Phillips ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Class Ii ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

There is a growing need for ceramic capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling and exploration, geothermal energy generation and power electronics. Conventional X7R and X8R type ceramic capacitors are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these types of capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using nickel electrodes for high temperature application up to 200°C and beyond. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer Ceramic Capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. We have also developed a modified-X7R dielectric composition with nickel internal electrodes to design robust reliability in this Class-II dielectric at 175°C. This paper will report electrical properties and reliability test data on these Class-I C0G and Class-II ceramic capacitors at high temperatures of 150–200°C and above.

Advances in Ceramic Capacitors for High Temperature Applications

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000134-000141 ◽  
Author(s):  
Abhijit Gurav ◽  
Xilin Xu ◽  
Jim Magee ◽  
Reggie Phillips ◽  
Travis Ashburn
Keyword(s):  
High Temperature ◽  
Class Ii ◽  
Class I ◽  
Hole Drilling ◽  
Severe Reduction ◽  
Ceramic Capacitors ◽  
Temperature Application ◽  
Dc Bias ◽  
Reliability Performance ◽  
Robust Reliability

There is a growing need for capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling and exploration, geothermal energy generation and power electronics. Conventional X7R and X8R type ceramic capacitors are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these types of capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C and beyond. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCC) made from this material can be qualified as X9G with robust reliability. A Class-II modified-X7R dielectric composition with nickel internal electrodes showing robust reliability at 175°C has also recently been developed. This paper will report electrical properties and reliability test data on these Class-I C0G and Class-II ceramic capacitors at high temperatures of 150–200°C and above.

Research on Glass Fiber Bars of the Shear Property after High Temperature

2011 ◽  
Vol 311-313 ◽  
pp. 181-184
Author(s):  
Ya Nan Fu ◽  
Jun Zhao ◽  
Long Fei Cheng ◽  
Hai Tao Mao
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Glass Fiber ◽  
Shear Test ◽  
Test Results ◽  
Shear Property ◽  
Temperature Shear

Through 14 group 42 individual specimens of glass fiber bars which diameter is ф10 and ф12 at 20°C, 100°C, 150°C, 200°C, 250°C, 300°C, 350°C, after high temperature, shear test is done , the changing nature and influent factor are analyzed. It indicates from the test results: the surface colour of glass fiber bars is deepening with temperature increasing, becourse combine、decomposition are aggravating with temperature increasing; shear strength is increasing with the diameter getting large; more than certain temperature the glass fiber bars of shear strength is suden drawdown.

Robust Reliability of Ceramic Capacitors for Power Electronics

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000138-000142
Author(s):  
Abhijit Gurav ◽  
John Bultitude ◽  
John McConnell ◽  
Reggie Phillips
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Transient Liquid Phase ◽  
Form Factors ◽  
Liquid Phase Sintering ◽  
Class I ◽  
Hole Drilling ◽  
Capacitance Density ◽  
Ceramic Capacitors ◽  
Robust Reliability

Abstract For applications using Wide Band Gap (WBG) semiconductors, and for electronics for down-hole drilling, oil exploration, geothermal energy generation and power electronics, there is a growing need for capacitors that have robust reliability at temperatures of 125°C, 150°C or above. The development of more energy efficient power converters and inverters based on WBG semiconductors is driving the adoption of higher temperatures in a growing number of power electronics and automotive circuits since these operate at higher junction temperatures than traditional silicon. This has led to a growing need for high temperature capacitors with robust reliability. A Class-I C0G dielectric has been developed using Nickel electrodes for high temperature application up to 200°C and beyond. Since it is a paraelectric linear dielectric, these capacitors exhibit highly stable capacitance as a function of temperature and voltage, possess low loss (DF) and can conduct high RMS currents with a low temperature rise compared to other capacitor solutions. To maximize the capacitance density and achieve a high degree of mechanical robustness, stacks and leaded form factors are commonly needed. Materials for assembly of stacks are of interest due to the challenge of higher cost of attachment materials based on gold-solders or nano-silver pastes, as well as due to the presence of lead (Pb) in common high melting point (HMP) solders. This paper will report electrical properties and reliability test data on these Class-I C0G ceramic capacitors and stacks at high temperatures. It will also review thermal robustness and electrical characteristics of stacks assembled using Pb-free transient liquid phase sintering (TLPS) materials based on Sn-Cu and In-Ag.

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