Electroplating and Electroless Plating Process Development for DuPont™ GreenTape™ 9K7 LTCC

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000283-000287
Author(s):  
Allan Beikmohamadi ◽  
Steve Stewart ◽  
Jim Parisi ◽  
Mark McCombs ◽  
Michael Smith ◽  
...  
Keyword(s):  
Thick Film ◽  
Surface Finish ◽  
Electroless Plating ◽  
Process Development ◽  
Cost Effective ◽  
Electroless Nickel ◽  
Free Atmosphere ◽  
Gold Plating ◽  
Cost Effective Approach ◽  
Easy Integration

Low Temperature Co-fired Ceramic (LTCC) technology provides an attractive packaging platform for microwave and millimeter wave circuits and systems due to its unique properties. Generally, thick film gold or silver conductors are used as metallizations on LTCC substrates along with occasional use of copper thick films. This paper reports methods and results of extensive process development experiments DuPont Microcircuit Materials has undertaken to establish a commercially viable plating process for the market leading DuPont™ GreenTape™ 9K7 LTCC system. Both Electroplating and Electroless plating processes are investigated in this work. These techniques provide certain advantages when used in isolation or in combination with standard thick film metallizations, helping to extend their applicability. Electroplating of copper on LTCC provides a means of using copper as the external conductor without having to use complicated firing processes in oxygen-free atmosphere as required for copper thick film. This approach leads to a much more cost effective approach if copper is required as the external metal. Electroless Nickel/Gold plating (ENIG) of both silver and copper (electroplated and/or thick film) provides an industry standard, highly reliable, robust surface finish. Such surface finish enables easy integration of both soldering and wire bonding processes.

A STUDY OF SURFACE FINISHES FOR IC SUBSTRATES AND WIRE BOND APPLICATIONS

2011 ◽  
Vol 2011 (1) ◽  
pp. 000516-000520 ◽  
Author(s):  
John Ganjei ◽  
Ernest Long ◽  
Lenora Toscano
Keyword(s):  
Surface Finish ◽  
Printed Circuit Boards ◽  
Performance Enhancement ◽  
High Reliability ◽  
Cost Effective ◽  
Electroless Nickel ◽  
Gold Wire ◽  
Electronics Industry ◽  
Surface Finishes ◽  
And Performance

The continuing drive for ever increasing performance enhancement in the electronics industry, in combination with the recent, very significant increase in precious metal costs have left fabricators and OEMs questioning what the best, most cost effective, surface finish is for high reliability applications. Currently, the IC substrate market relies heavily on electrolytic nickel and gold as a solderable and superior wire bondable surface. The use of this finish has allowed manufacturers to avoid the reliability concerns However, this choice also results in significant design restraints being imposed. Many in the industry are now investigating the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) to achieve both high reliability and performance, without the negative design restraints imparted by the use of electrolytic processes. However, over the last year alone, the industry has watched the price of gold increase by 50% and that of palladium double [1]. With this in mind, and considering the historic precedent set in the mid 1990’s when ENEPIG was also evaluated as a surface finish for printed circuit boards, when coincidentally, the cost of palladium also reached an all time high, it should be remembered that the electronics industry quickly moved to evaluate alternate, more cost sustainable, surface finishes. This paper details the use of lower cost, alternate surface finishes for IC substrate applications, with particular experimental focus on gold wire bonding capabilities and BGA solderability of the finishes described. The paper also discusses related process cycle advantages and the significantly reduced operating costs associated with these new finishes.

E-Insurance :A Platform For Insurance Penetration In India

2019 ◽  
Vol 118 (6) ◽  
pp. 90-93
Author(s):  
L. Terina Grazy ◽  
Dr.G. Parimalarani
Keyword(s):  
Insurance Industry ◽  
Cost Effective ◽  
Online Marketing ◽  
Insurance Companies ◽  
The Internet ◽  
Insurance Sector ◽  
The People ◽  
Cost Effective Approach ◽  
Time And Energy ◽  
Work Done

E-commerce is a part of Internet Marketing. The arrival of Internet made the world very simple and dynamic in all the areas. Internet is the growing business as a result most of the people are using it in their day to day life. E-commerce is attractive and efficient way for both buyers and sellesr as it reduce cost, time and energy for the buyer. No surprise the insurance sector has become quite active within the internet sphere. Most insurance companies are offering policies to be brought online and also the portals for paying premiums. It actually saves from hassles involved in going to an insurance office and spend hours to get the insurance work done. Insurance has become an important and crucial aspect of life. Online insurance is the best and most cost effective approach of taking the insurance deal. This paper focused on influence of online marketing on the insurance industry in India, usage of internet in India , the internet penetration in India and the online sale of insurance product by the insurance sector.

Conclusion

2018 ◽  
Author(s):  
Yana van der Meulen Rodgers
Keyword(s):  
Family Planning ◽  
Reproductive Health ◽  
Health Services ◽  
Health Outcomes ◽  
Cost Effective ◽  
Reproductive Health Services ◽  
Cost Effective Approach ◽  
Restrictive Legislation

Chapter 7 concludes by highlighting the three biggest messages from the analysis presented in this book: (1) the global gag rule has failed to achieve its goal of reducing abortions; (2) restrictive legislation is associated with more unsafe abortions; and (3) the expanded global gag rule is likely to have negative repercussions across a range of health outcomes for women, children, and men. They are simple but powerful messages that should be heard by policymakers over the voices calling for an ideologically based policy that fails to achieve its desired outcome. The chapter closes with a more constructive and cost-effective approach for US family-planning assistance that targets integrated reproductive health services.

scholarly journals The Inverse Spacer—A Novel, Safe, and Cost-Effective Approach in Routine Procedures for Revision Knee Arthroplasty

2021 ◽  
Vol 10 (5) ◽  
pp. 971
Author(s):  
Kristoff Hammerich ◽  
Jens Pollack ◽  
Alexander F. Hasse ◽  
André El Saman ◽  
René Huber ◽  
...  
Keyword(s):  
Knee Arthroplasty ◽  
Clinical Success ◽  
Cost Effective ◽  
Revision Total Knee Arthroplasty ◽  
Rotational Stability ◽  
X Rays ◽  
Free Interval ◽  
Major Disadvantage ◽  
Cost Effective Approach ◽  
Before And After

Background: A major disadvantage of current spacers for two-stage revision total knee arthroplasty (R-TKA) is the risk of (sub-) luxation during mobilization in the prosthesis-free interval, limiting their clinical success with detrimental consequences for the patient. The present study introduces a novel inverse spacer, which prevents major complications, such as spacer (sub-) luxations and/or fractures of spacer or bone. Methods: The hand-made inverse spacer consisted of convex tibial and concave femoral components of polymethylmethacrylate bone cement and was intra-operatively molded under maximum longitudinal tension in 5° flexion and 5° valgus position. Both components were equipped with a stem for rotational stability. This spacer was implanted during an R-TKA in 110 knees with diagnosed or suspected periprosthetic infection. Postoperative therapy included a straight leg brace and physiotherapist-guided, crutch-supported mobilization with full sole contact. X-rays were taken before and after prosthesis removal and re-implantation. Results: None of the patients experienced (sub-) luxations/fractures of the spacer, periprosthetic fractures, or soft tissue compromise requiring reoperation. All patients were successfully re-implanted after a prosthesis-free interval of 8 weeks, except for three patients requiring an early exchange of the spacer due to persisting infection. In these cases, the prosthetic-free interval was prolonged for one week. Conclusion: The inverse spacer in conjunction with our routine procedure is a safe and cost-effective alternative to other articulating or static spacers, and allows crutch-supported sole contact mobilization without major post-operative complications. Maximum longitudinal intra-operative tension in 5° flexion and 5° valgus position appears crucial for the success of surgery.

scholarly journals Overexpression of OsABCG48 Lowers Cadmium in Rice (Oryza sativa L.)

Agronomy ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 918
Author(s):  
Xingzhe Cai ◽  
Meng Wang ◽  
Yucong Jiang ◽  
Changhu Wang ◽  
David W. Ow
Keyword(s):  
Oryza Sativa L ◽  
Cost Effective ◽  
Health Issues ◽  
Rna Seq ◽  
Wild Type ◽  
Genetic Changes ◽  
Cd Accumulation ◽  
Lateral Root Development ◽  
Atp Binding Cassette Transporter ◽  
Cost Effective Approach

Cadmium pollution threatens food safety and security by causing health issues and reducing farmland availability. Engineering genetic changes in crop plants to lower Cd accumulation can be a cost-effective approach to address this problem. Previously, we reported that a rice line, 2B, which expresses a truncated version of OsO3L2 had reduced Cd accumulation throughout the plant, including in seed. However, downstream events caused by expression of this gene were not known. In this study, RNA-seq was used to identify differentially expressed genes between the wild type and 2B rice with or without Cd treatment, leading to the study of an ABC transporter gene, OsABCG48 (ATP-Binding Cassette transporter G family member 48). Heterologous expression of OsABCG48 conferred tolerance to Cd in Schizosaccharomyces pombe, Arabidopsis and rice. Moreover, overexpressing OsABCG48 in rice lowered root Cd accumulation that was associated with more extensive lateral root development. These data suggest that OsABCG48 might have applications for engineering low-Cd rice.

scholarly journals 3D Printed Imaging Platform for Portable Cell Counting

The Analyst ◽  
2021 ◽  
Author(s):  
Diwakar M. Awate ◽  
Cicero C. Pola ◽  
Erica Shumaker ◽  
Carmen L Gomes ◽  
Jaime Javier Juarez
Keyword(s):  
3D Printing ◽  
Point Of Care ◽  
Cost Effective ◽  
Cell Counting ◽  
Biomedical Sciences ◽  
Widespread Application ◽  
Resource Limited ◽  
Cost Effective Approach ◽  
3D Printed

Despite having widespread application in the biomedical sciences, flow cytometers have several limitations that prevent their application to point-of-care (POC) diagnostics in resource-limited environments. 3D printing provides a cost-effective approach...

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