Thick Film Approaches in High Power LED Array Module

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000130-000133
Author(s):  
Hyo Tae Kim ◽  
Jihoon Kim ◽  
Young Joon Yoon ◽  
Chang Yeoul Kim ◽  
Jong-hee Kim ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thick Film ◽  
High Power ◽  
Light Emitting Diode ◽  
Life Time ◽  
Operating Voltage ◽  
Operation Temperature ◽  
Led Array ◽  
High Power Led ◽  
In Series

Light emitting diode, LED, has become a popular device for display and lighting applications. Among them, high power LED array modules are especially interested in the field of street light system, recently. High power LED array module is generally consisted of several pieces of LEDs which are mounted on the PCB with the combination of series and parallel circuits according to the designed operating voltage and power consumption, i.e. total wattages. Since the life time expectancy and brightness of LED are greatly influenced by the operation temperature of LED, thermal management technology of LED module including system design, heat transfer and dissipation become a hot issue in these days. In this work, we would like to present several thick film approaches to fabricate thermally efficient high power, i.e. LED array modules with over 50 watts by using different array package design, materials selection and film forming techniques. Here, we will demonstrate 50 watts LED array modules directly coupled with aluminum, copper or silicon heat sinks which operates at 12volts using 4 × 9, 4 pieces of LED in series multiplied by 9 arrays in parallel, LED array circuit. The microstructure of metal-ceramic multilayers and interfaces, and the heat transfer performance of the LED array modules will be presented.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

The Study on LED Accelerated Life Testes and Failure Mechanism

2013 ◽  
Vol 462-463 ◽  
pp. 678-682
Author(s):  
Yue Zong Zhang ◽  
Chun Xia Li ◽  
Wen Bin Zhang
Keyword(s):  
Active Region ◽  
Failure Mechanism ◽  
High Power ◽  
Light Emitting Diode ◽  
Characteristic Curve ◽  
Optical Parameter ◽  
Thermal Parameter ◽  
High Current ◽  
Current Stress ◽  
High Power Led

The paper is studied on the performances of low power light-emitting diode and high power LED under high-current. After observing and measuring the degeneration of them, the Analysis of the failure mechanism is given. The degenerations of the optical parameter, electronic parameter and thermal parameter of high power LED under 600mA current stress are measured and the failure mechanism is analyzed. The I-V characteristic curve proves that the degeneration is happened in active region. Under high-current stress, the active region of high power LED is ageing which leads to much more defects. The degenerations of pins on the resin package, metal wire and surface layer metal pads are found with scanning electron microscope.

Analysis of heat transfer of loop heat pipe used to cool high power LED

2009 ◽  
Vol 52 (12) ◽  
pp. 3527-3532 ◽  
Author(s):  
XiangYou Lu ◽  
ZeZhao Hua ◽  
MeiJing Liu ◽  
YuanXia Cheng
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
High Power ◽  
Loop Heat Pipe ◽  
High Power Led

High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

2007 ◽  
Author(s):  
Ming-Ji Dai ◽  
Chih-Kuang Yu ◽  
Chun Kai Liu ◽  
Sheng-Liang Kuo
Keyword(s):  
High Power ◽  
Flip Chip ◽  
Light Emitting Diode ◽  
Infrared Camera ◽  
Junction Temperature ◽  
Integrating Sphere ◽  
Thermoelectric Cooler ◽  
High Power Led ◽  
Silicon Based ◽  
Light Efficiency

A new thermal management application of silicon-based thermoelectric (TE) cooler integrated with high power light emitting diode (LED) is investigated in present study. The silicon-based TE cooler herein is fabricated by MEMS fabrication technology and flip-chip assembly process that is used for high power LED cooling. An electrical-thermal conversion method is used to estimate the junction temperature of LED. Moreover, the Integrating Sphere is also used to measure the light efficiency of LED. The thermal images photographed by infrared camera demonstrated the cooling function of the silicon-based TE devices. The results also show that high power LED integrated with silicon-based thermoelectric cooler package can effectively reduce the thermal resistance to zero. In addition, the light efficiency of the LED (1W) will increase under low TE cooler input power (0.55W), which is about 1.3 times of that without TE cooler packaging.

Toward low-cost, stable, and uniform high-power LED array for solar cells characterization

2020 ◽  
Author(s):  
Minnatullah Moustafa ◽  
Anwar M. Sahbel ◽  
Sameh O. Abdellatif ◽  
Khaled A. Kirah ◽  
Hani Ghali
Keyword(s):  
Solar Cells ◽  
High Power ◽  
Low Cost ◽  
Led Array ◽  
High Power Led

scholarly journals Research on illumination uniformity of high-power LED array light source

2018 ◽  
Author(s):  
Xiaolong Yu ◽  
Xueye Wei ◽  
Ou Zhang ◽  
Xinwei Zhang
Keyword(s):  
Light Source ◽  
High Power ◽  
Led Array ◽  
High Power Led

scholarly journals Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3958
Author(s):  
Jianhua Xiang ◽  
Zeyu Liu ◽  
Chunliang Zhang ◽  
Chao Zhou ◽  
Conggui Chen
Keyword(s):  
Heat Transfer ◽  
Plastic Deformation ◽  
Finite Element ◽  
Phase Change ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Machining Process ◽  
High Power Led ◽  
Radial Heat

A phase change heat sink has higher heat transfer efficiency compared to a traditional metal solid heat sink, and is thus more preferred for the heat dissipation of high-power light-emitting diodes (LEDs) with very high heat flux. The boiling structure at the evaporation surface is the biggest factor that affects heat sink resistance. It is necessary to investigate the plastic deformation law during the machining process of boiling structures. In this study, a novel phase change radial heat sink was developed for high-power LED heat dissipation. First, a working principle and a fabrication process for the heat sink were introduced. Subsequently, to achieve an excellent heat dissipation performance, the machining process of boiling structures was numerically simulated and investigated. To be specific, plastic deformation generated during the formation was analyzed, and key parameters related to the morphology of the boiling structures were discussed including feeding angles and machining depths. Moreover, the finite element (FE) simulation results were compared with those of experiments. Last but not least, the heat transfer performance of the fabricated heat sink was tested. Results showed that the developed heat sink was well suited for a high-power LED application.

Sign in / Sign up

Export Citation Format

Share Document