High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

2007 ◽  
Author(s):  
Ming-Ji Dai ◽  
Chih-Kuang Yu ◽  
Chun Kai Liu ◽  
Sheng-Liang Kuo
Keyword(s):  
High Power ◽  
Flip Chip ◽  
Light Emitting Diode ◽  
Infrared Camera ◽  
Junction Temperature ◽  
Integrating Sphere ◽  
Thermoelectric Cooler ◽  
High Power Led ◽  
Silicon Based ◽  
Light Efficiency

A new thermal management application of silicon-based thermoelectric (TE) cooler integrated with high power light emitting diode (LED) is investigated in present study. The silicon-based TE cooler herein is fabricated by MEMS fabrication technology and flip-chip assembly process that is used for high power LED cooling. An electrical-thermal conversion method is used to estimate the junction temperature of LED. Moreover, the Integrating Sphere is also used to measure the light efficiency of LED. The thermal images photographed by infrared camera demonstrated the cooling function of the silicon-based TE devices. The results also show that high power LED integrated with silicon-based thermoelectric cooler package can effectively reduce the thermal resistance to zero. In addition, the light efficiency of the LED (1W) will increase under low TE cooler input power (0.55W), which is about 1.3 times of that without TE cooler packaging.

scholarly journals Compact Measurement of the Optical Power in High-Power LED Using a Light-Absorbent Thermal Sensor

Sensors ◽  
2021 ◽  
Vol 21 (14) ◽  
pp. 4690
Author(s):  
You-Young Kim ◽  
Jae-Young Joo ◽  
Jong-Min Kim ◽  
Sun-Kyu Lee
Keyword(s):  
High Power ◽  
Light Emitting Diode ◽  
Hot Spot ◽  
Thermal Power ◽  
Temperature Response ◽  
Reference Value ◽  
Optical Power ◽  
Junction Temperature ◽  
Integrating Sphere ◽  
Thermal Sensor

LED (Light-Emitting Diode) presents advantages such as luminescence, reliability, durability compared with conventional lighting. It has been widely applied for life, healthcare, smart farm, industry, and lighting from indoor to the automotive headlamp. However, the LED is vulnerable to thermal damage originated from the high junction temperature, especially in high power applications. Hence, it requires precise qualification on the optical power and the junction temperature from the pilot line to secure reliability. In this study, the photo-thermal sensor is proposed by employing a sheet-type thermocouple composed of photo-absorbent metal film and thermocouple. This sensor aims low-cost qualification in pilot line for high-power luminous devices and optical monitoring of costly luminaire such as automobile LED headlamp. The sensor is designed to detect the increased temperature response of LED hot spots from the transferred thermal power and absorbed optical power. The temperature response of each sheet-type thermocouple is utilized as a signal output of the absorbed optical power and hot spot temperature based on the introduced sensor equation. The proposed thermal sensor is evaluated by comparing the experiment with the measured reference value from the integrating sphere and the attached thermocouple at a junction. The experiment result reveals 3% of the maximum error for the optical power of 645 mW.

scholarly journals Analyzing Thermal Module Developments and Trends in High-Power LED

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Jung-Chang Wang
Keyword(s):  
Life Cycle ◽  
High Power ◽  
Light Emitting Diode ◽  
Junction Temperature ◽  
Light Emitting ◽  
Consumer Electronic ◽  
High Power Led ◽  
Fin Thickness ◽  
Good Agreement ◽  
Indoor And Outdoor

The solid-state light emitting diode (SSLED) has been verified as consumer-electronic products and attracts attention to indoor and outdoor lighting lamp, which has a great benefit in saving energy and environmental protection. However, LED junction temperature will influence the luminous efficiency, spectral color, life cycle, and stability. This study utilizes thermal performance experiments with the illumination-analysis method and window program (vapour chamber thermal module, VCTM V1.0) to investigate and analyze the high-power LED (Hi-LED) lighting thermal module, in order to achieve the best solution of the fin parameters under the natural convection. The computing core of the VCTM program employs the theoretical thermal resistance analytical approach with iterative convergence stated in this study to obtain a numerical solution. Results showed that the best geometry of thermal module is 4.4 mm fin thickness, 9.4 mm fin pitch, and 37 mm fin height with the LED junction temperature of 58.8°C. And the experimental thermal resistances are in good agreement with the theoretical thermal resistances; calculating error between measured data and simulation results is no more than ±7%. Thus, the Hi-LED illumination lamp has high life cycle and reliability.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

The Study on LED Accelerated Life Testes and Failure Mechanism

2013 ◽  
Vol 462-463 ◽  
pp. 678-682
Author(s):  
Yue Zong Zhang ◽  
Chun Xia Li ◽  
Wen Bin Zhang
Keyword(s):  
Active Region ◽  
Failure Mechanism ◽  
High Power ◽  
Light Emitting Diode ◽  
Characteristic Curve ◽  
Optical Parameter ◽  
Thermal Parameter ◽  
High Current ◽  
Current Stress ◽  
High Power Led

The paper is studied on the performances of low power light-emitting diode and high power LED under high-current. After observing and measuring the degeneration of them, the Analysis of the failure mechanism is given. The degenerations of the optical parameter, electronic parameter and thermal parameter of high power LED under 600mA current stress are measured and the failure mechanism is analyzed. The I-V characteristic curve proves that the degeneration is happened in active region. Under high-current stress, the active region of high power LED is ageing which leads to much more defects. The degenerations of pins on the resin package, metal wire and surface layer metal pads are found with scanning electron microscope.

scholarly journals Analysis and Prediction of Thermal Resistance for High Power LED Using GA-SVR

2012 ◽  
Vol 4 ◽  
pp. 153-160
Author(s):  
De Huai Zeng ◽  
Yuan Liu ◽  
Li Li ◽  
De Gui Yu ◽  
Gang Xu
Keyword(s):  
Service Life ◽  
Thermal Resistance ◽  
High Power ◽  
Thermal Characteristics ◽  
Junction Temperature ◽  
Support Vector ◽  
Mean Squared Errors ◽  
Absolute Relative Error ◽  
High Power Led ◽  
Key Factor

With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. In this paper the accurate and fast measurement equipment was applied to study the thermal characteristics of high power LED. The forward-voltage based method was conducted to measure the junction temperature of high power. Then, support vector regression (SVR) combined with genetic algorithm (GA) for its parameter optimization, was proposed to establish a model to predict the thermal resistance of high power LED. The prediction performance of GA-SVR was compared with those of BPNN model. The result demonstrated that the estimated errors GA-SVR models, such as Mean Absolute Relative Error (MARE) and Root Mean Squared Errors (RMSE), all are smaller than those achieved by the BPNN applying identical samples.

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

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