Embedded RDL Enabled by Excimer Laser Ablation

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 000367-000396
Author(s):  
Habib Hichri
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Material Selection ◽  
Cost Effective ◽  
High Energy ◽  
Laser Source ◽  
Process Step ◽  
Excimer Laser Ablation ◽  
New Process ◽  
Advanced Packaging

The continuous trend of the miniaturization, increasing performance and mobility of electronic devices drive the requirements of the chip itself but also its package type. The current integration process based on photolithography will be reaching the limit to develop cost effective and innovative package designs that meet the market requirements. In support of this technology trend and to address the industry problems Excimer laser ablation has been adopted in the semiconductor packaging industry and is now available as disruptive patterning technology. The complementary technology offers the promise of further reductions in manufacturing costs as well as enhancements in chip or package performance. Excimer laser ablation is a direct etching process that uses the advantage of the Excimer laser source to emit high energy pulses at short wavelengths. The combination of the Excimer laser source and dedicated projection optics ensures the capability of high resolution imaging. With this type of patterning technology the industry gets access to materials that do not require photo patterning. The paper proposes a new process based on the front end of line dual damascene integration flow for building multilayer RDL for Advanced Packaging using Excimer laser ablation. The new process uses Excimer laser ablation as the critical method to integrate via and RDL traces in one patterning process step, followed by seed layer deposition, plating and standard planarization processes. In this presentation, we will explain in detail the new proposed integration flow and further demonstrate its technical robustness for the chip interconnect combined with its commercial benefits to users. We will also cover the capability of this Excimer laser process to extend the material selection to non-photo materials.

Embedded RDL formation in Non-Photo Polymers using Excimer Laser Ablation

2016 ◽  
Vol 2016 (1) ◽  
pp. 000025-000031 ◽  
Author(s):  
Habib Hichri ◽  
Seongkuk Lee ◽  
Markus Arendt ◽  
Sanjay Malik ◽  
Ognian Dimov ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Flip Chip ◽  
Dielectric Materials ◽  
High Energy ◽  
Polymer Materials ◽  
Large Field ◽  
Laser Source ◽  
Process Step ◽  
Excimer Laser Ablation

Abstract The continuous trend towards miniaturization, increasing performance and mobility of electronic devices drives interconnect density and integration, not only at the chip level, but also at interposer and package level. Silicon interposers coming from wafer foundries using back end of line (BEOL) redistribution layer (RDL) processes have been introduced successfully. However, there is a continuing need for low cost interposers based on large organic or glass panels. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need, This paper presents the latest results from cost effective and innovative package RDL processes using excimer laser ablation, to meet the market's most stringent requirements. To enable panel and wafer based interposers to reduce RDL cost and scale interconnect pitch to 40um and below, excimer laser ablation is introduced as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove polymer materials with high precision and high throughput. The combination of a high-power excimer laser source, large-field laser mask and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. In addition, with excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in interposer and package performance. In this paper, we propose new process that uses excimer laser ablation to integrate via and RDL traces in one patterning process step, followed by seed layer deposition, plating and planarization steps. A new integration process flow is proposed, and its technical robustness and commercial advantages have been demonstrated. The capability of this excimer laser process to extend the current material portfolio to non-photo materials will be discussed, and its commercial benefits as compared to the current process of record (POR) will be highlighted.

Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

2017 ◽  
Vol 2017 (1) ◽  
pp. 000113-000119
Author(s):  
Habib Hichri ◽  
Shohei Fujishima ◽  
Seongkuk Lee ◽  
Markus Arendt ◽  
Shigeo Nakamura
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Cost Reduction ◽  
High Energy ◽  
Polymer Materials ◽  
Large Field ◽  
Laser Source ◽  
Wafer Level ◽  
Excimer Laser Ablation ◽  
Laser Patterning

Abstract Fan-Out technologies continue to be the main driver for advanced packaging, be it on wafer level (FOWLP) or panel level (FOPLP). There is a continuing need for higher density routing and heterogeneous integration of different devices, but also for continuous cost reduction. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches and via opening below 10um, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need, and also face serious technical challenges. This paper presents the latest results from an innovative package RDL and micro via processes using excimer laser ablation in an especially developed non-photo sensitive material, to meet the market's most stringent requirements. To enable panel and wafer based interposers to reduce RDL cost and scale interconnect pitch to 40um and below, excimer laser ablation is introduced as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove polymer materials with high precision and high throughput. The combination of a high-power excimer laser source, large-field laser mask and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. With excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in interposer and package performance. In this paper, we propose a novel patterning process that uses excimer laser ablation to integrate via and RDL traces in one patterning step, followed by seed layer deposition, plating and planarization. The capability of this excimer laser patterning process in non-photo materials Ajinomoto Build-up Film, which is abbreviated to “ABF” in this paper, will be discussed, and its technical robustness and commercial advantages are demonstrated. We will present electrical and reliability data of Via and RDL traces patterned by excimer laser in ABF material.

Nanosecond Excimer Laser Ablation (W,Ti)C-Co Cemented Carbide

2012 ◽  
Vol 583 ◽  
pp. 333-337
Author(s):  
Jiao Xi Yang ◽  
Xuan He Miao ◽  
Zhi Cheng Wang ◽  
Xi Bing Wang
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Cutting Tool ◽  
Processing Parameters ◽  
High Energy ◽  
Pulse Number ◽  
Cemented Carbide ◽  
Composition Analysis ◽  
Excimer Laser Ablation ◽  
Micro Cracks

In order to increase the serving life of the cemented carbide, high energy pulsed excimer laser ablation was conducted on the surface of (W,Ti)C-Co cemented carbide cutting tool, and the processing parameters were optimized. The morphology of ablation surface was observed by SEM, composition analysis was applied by EDS. The results showed that with the increase of laser pulse number, the Cobalt binder content in cemented carbide decreased, while the micro-cracks increased. The average microhardness of laser irradiation region increased with increasing pulse number.

Deposition of thin films by high-energy excimer laser ablation

1990 ◽  
Author(s):  
K. Schmatjko ◽  
B. Roas ◽  
G. Endres ◽  
L. Schultz
Keyword(s):  
Thin Films ◽  
Laser Ablation ◽  
Excimer Laser ◽  
High Energy ◽  
Excimer Laser Ablation
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