scholarly journals Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000066-000072 ◽  
Author(s):  
Liang-Yu Chen ◽  
Philip G. Neudeck ◽  
David J. Spry ◽  
Glenn M. Beheim ◽  
Gary W. Hunter
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Parasitic Capacitance ◽  
Circuit Board ◽  
Electrical Performance ◽  
Operational Testing ◽  
Dielectric Performance ◽  
Temperature Ranges ◽  
Parallel Conductance

Abstract A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 °C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 °C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 °C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 μS, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 °C for over 3736 hours continuously, and at 700 °C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T ≥ 500 °C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics

2017 ◽  
Vol 14 (1) ◽  
pp. 11-16 ◽  
Author(s):  
Liang-Yu Chen ◽  
Philip G. Neudeck ◽  
David J. Spry ◽  
Glenn M. Beheim ◽  
Gary W. Hunter
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Parasitic Capacitance ◽  
Circuit Board ◽  
Electrical Performance ◽  
Packaging System ◽  
Dielectric Performance ◽  
Temperature Ranges ◽  
Parallel Conductance ◽  
Potential Use

A high-temperature cofired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550°C and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high-temperature packaging applications. This article introduces a prototype 32-input/output (I/O) HTCC alumina package with platinum conductor for 500°C low-power SiC-integrated circuits. The design and electrical performance of this package, including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550°C, are discussed in detail. The parasitic capacitance and parallel conductance of neighboring I/Os of this package in the entire frequency and temperature ranges measured do not exceed 1.5 pF and 0.05 μS, respectively. SiC-integrated circuits using this package and a compatible alumina circuit board have been successfully tested at 500°C for more than 3,736 h continuously, and at 700°C for more than 140 h. Some test examples of SiC-integrated circuits with this packaging system are presented.

A Novel Discrete Passives Integration on Organic Substrate

2005 ◽  
Author(s):  
Vasudivan Sunappan ◽  
Chee Wai Lu ◽  
Lai Lai Wai ◽  
Wei Fan ◽  
Boon Keng Lok
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Electrical Performance ◽  
Core Material ◽  
Bottom Surface ◽  
Passive Components ◽  
Printed Circuit

A novel process has been developed to embed discrete (surface mountable) passive components like capacitors, resistors and inductors using printed circuit board fabrication technology. The process comprises of mounting passive components on top surface of a core PCB (printed circuit board) material using surface mount technology. The passive components mounting were designed in multiple clusters within the PCB. Dielectric sheets are sandwiched between top surface of core PCB and second PCB material for lamination process. A direct interconnection of the passive components to one or more integrated circuits (IC) is further accomplished by mounting the ICs on the bottom surface of the core material in an area directly under the passive components. The close proximity of the embedded passive components such as capacitors to an IC improved electrical performance by providing impedance reduction and resonance suppression at high frequency range. The reliability of solder joints was evaluatedd by temperature cycling test.

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Microhardness Testing on Via Fill Material for Via In Pad Technology

2003 ◽  
Author(s):  
Norman J. Armendariz ◽  
Carolyn McCormick
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Strong Dependence ◽  
Circuit Board ◽  
Electrical Performance ◽  
Gravimetric Analysis ◽  
Passive Components ◽  
Root Cause ◽  
Fill Material ◽  
Signal Routing

Abstract Via in pad PCB (Printed Circuit board) technology for passive components such as chip capacitors and resistors, provides the potential for improved signal routing density and reduced PCB area. Because of these improvements there is the potential for PCB cost reduction as well as gains in electrical performance through reduced impedance and inductance. However, not long after the implementation, double digit unit failures for solder joint electrical opens due to capacitor “tombstoning” began to occur. Failure modes included via fill material (solder mask) protrusion from the via as well as “out gassing” and related “tombstoning.” This failure analysis involved investigating a strong dependence on PCB supplier and, less obviously, manufacturing site. Other factors evaluated included via fill material, drill size, via fill thermal history and via fill amount or fill percent. The factor most implicated was incomplete cure of the via fill material. Previous thermal gravimetric analysis methods to determine level of polymerization or cure did not provide an ability to measure and demonstrate via fill cure level in small selected areas or its link to the failures. As a result, there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies.

scholarly journals Compact Modelling of Electrical, Optical and Thermal Properties of Multi-Colour Power LEDs Operating on a Common PCB

Energies ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1286
Author(s):  
Krzysztof Górecki ◽  
Przemysław Ptak
Keyword(s):  
Integrated Circuits ◽  
Optical Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Junction Temperature ◽  
Optical Parameters ◽  
Spice Simulation ◽  
Light Emitting ◽  
Proposed Model ◽  
Good Agreement

This paper concerns the problem of modelling electrical, thermal and optical properties of multi-colour power light-emitting diodes (LEDs) situated on a common PCB (Printed Circuit Board). A new form of electro-thermo-optical model of such power LEDs is proposed in the form of a subcircuit for SPICE (Simulation Program with Integrated Circuits Emphasis). With the use of this model, the currents and voltages of the considered devices, their junction temperature and selected radiometric parameters can be calculated, taking into account self-heating phenomena in each LED and mutual thermal couplings between each pair of the considered devices. The form of the formulated model is described, and a manner of parameter estimation is also proposed. The correctness and usefulness of the proposed model are verified experimentally for six power LEDs emitting light of different colours and mounted on an experimental PCB prepared by the producer of the investigated devices. Verification was performed for the investigated diodes operating alone and together. Good agreement between the results of measurements and computations was obtained. It was also proved that the main thermal and optical parameters of the investigated LEDs depend on a dominant wavelength of the emitted light.

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

scholarly journals A Self-Powered Nanogenerator for the Electrical Protection of Integrated Circuits from Trace Amounts of Liquid

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Zhuang Hui ◽  
Ming Xiao ◽  
Daozhi Shen ◽  
Jiayun Feng ◽  
Peng Peng ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Printed Circuit Board ◽  
Short Circuit ◽  
High Sensitivity ◽  
Short Circuit Current ◽  
Fast Response ◽  
Open Circuit ◽  
Circuit Board ◽  
Self Powered

Abstract With the increase in the use of electronic devices in many different environments, a need has arisen for an easily implemented method for the rapid, sensitive detection of liquids in the vicinity of electronic components. In this work, a high-performance power generator that combines carbon nanoparticles and TiO2 nanowires has been fabricated by sequential electrophoretic deposition (EPD). The open-circuit voltage and short-circuit current of a single generator are found to exceed 0.7 V and 100 μA when 6 μL of water was applied. The generator is also found to have a stable and reproducible response to other liquids. An output voltage of 0.3 V was obtained after 244, 876, 931, and 184 μs, on exposure of the generator to 6 μL of water, ethanol, acetone, and methanol, respectively. The fast response time and high sensitivity to liquids show that the device has great potential for the detection of small quantities of liquid. In addition, the simple easily implemented sequential EPD method ensures the high mechanical strength of the device. This compact, reliable device provides a new method for the sensitive, rapid detection of extraneous liquids before they can impact the performance of electronic circuits, particularly those on printed circuit board.

Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000034-000038 ◽  
Author(s):  
Piers Tremlett ◽  
Phil Elliot ◽  
Pablo Tena
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Real Life ◽  
Circuit Board ◽  
Calibration Data ◽  
Engine Fuel ◽  
Sensors And Actuators ◽  
Pcb Assembly ◽  
Operational Life ◽  
Mems Technology

Printed circuit board (PCB) assemblies must fit into unusual spaces for many real-life, high temperature applications such as sensors and actuators. This paper details the design and manufacture of a complex control circuit for a jet engine fuel flow valve. “Origami” was needed to fit this control circuitry into the tight space in the valve, this was achieved using a high temperature flex rigid PCB assembly. The valve was mounted on a hot section of the engine, and the assembly was tested for its capability to operate at 178°C and withstand multiple thermal cycles of −55°C and 175°C during its operational life. Various component joining media were investigated to extend the life of the assembly. The project also developed a one-time programmable (OTP) memory aimed at up to 300°C operation for on board memory to provide calibration data or boot memory for high temperature microcontrollers or processors. The device was based on Micro-Electro-Mechanical Systems (MEMS) technology.

Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board

2018 ◽  
Vol 2018 (1) ◽  
pp. 000384-000388
Author(s):  
Brian Curran ◽  
Jacob Reyes ◽  
Christian Tschoban ◽  
Ivan Ndip ◽  
Klaus-Dieter Lang ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Antenna Arrays ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Circuit Board ◽  
Front End ◽  
High Bandwidth ◽  
Increasing Demand ◽  
K Band

Abstract Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a K-Band receiver front-end, composed of four GaAs ICs, with linear IF output power for input powers above −40dBm and a temperature of 42°C during operation.

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