Flexible Hand-Free Microelectronics assembly Line for the Chip and Wire industry

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000790-000826
Author(s):  
Prakash Bhartia ◽  
Jim Angeloni ◽  
Will Bolinger
Keyword(s):  
Integrated Circuits ◽  
Assembly Line ◽  
High Volume ◽  
Microwave Integrated Circuits ◽  
Fully Integrated ◽  
Die Attach ◽  
High Volume Production ◽  
Volume Production ◽  
Overseas Operations ◽  
Automated Lines

This paper presents Natel's effort in pioneering the design and development of the first Touch-Free Microelectronics assembly Line for the Chip and Wire industry. When the Surface Mount Technology (SMT) industry first started, it began as a series of discrete pieces of equipment that performed the functions required to populate Circuit Cards. Over the years, the technology has evolved as has the industry such that fully integrated, automated lines are available where the circuit cards are installed at one end of the line, reels or tubes of components, such as packaged resistors, inductors, capacitors and semiconductors etc., loaded, the machine programmed and assembled circuit cards are available at the other end. However, no such line has been developed for the Chip and Wire industry, with most assembly houses still using individual stand alone die attach, bonders, plasma clean machines to populate substrates. Natel has developed the first of its kind integrated Auto line for the Chip and Wire industry, which conceptually replicates a SMT line. This Auto Line is touch–free and incorporates die attach ( including eutectic), ball and ribbon bonding , plasma clean and in line testing. The line is ideal for high volume production of Hybrid and Microwave Integrated Circuits. The obvious advantages of this approach are the “ hands-free” continuous flow aspect with significant reduction in product defects, increase in efficiency and cost reduction thereby increasing competitiveness against low labor rate overseas operations. This paper will provide details of the line, and discuss what additional capabilities can be added and hopefully promote the future development of the Chip and Wire industry built on this pioneering development.

Automated Precision Assembly for High-Volume HB LEDs

2011 ◽  
Vol 2011 (1) ◽  
pp. 000117-000122
Author(s):  
Donald J. Beck ◽  
Jessica Sylvester
Keyword(s):  
Light Emitting Diode ◽  
High Reliability ◽  
Bright Light ◽  
High Volume ◽  
Commercial Production ◽  
Production Lines ◽  
Light Emitting ◽  
Die Attach ◽  
High Volume Production ◽  
Volume Production

Since the introduction of automated die and wire bonders in the 1980s, equipment manufacturers and process engineers have been challenged to balance speed with repeatability. Today, die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour [6]; and wire bonders can interconnect complex packages at speeds of more than 10 wires per second [7]. The advantage of automation is speed and consistency—however, there is one major concern with operating at these speeds: if something in the assembly process is wrong, everything will be wrong. Having tightly regulated assembly processes helps avoid the risk of building a large batch of rejected product. This paper presents a methodology and process flow supporting High Bright Light Emitting Diode (HB LED) automated assembly, supported by equipment certification, product inspection and SPC data collection methods. The methods presented in this paper have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure time-to-market success in high-volume production, specific methods to achieve throughput and quality are required. This paper will cover the strategies and methods necessary to achieve the ultimate goal of an automated precision HB LED assembly—to blend the requirements of high-reliability and high-throughput to support high-volume commercial production.

RF and Microwave Test of MMICs from Qualification to Mass Production

2012 ◽  
pp. 333-345
Author(s):  
Mohamed Mabrouk
Keyword(s):  
Integrated Circuits ◽  
Noise Figure ◽  
High Volume ◽  
Low Noise ◽  
Production Environment ◽  
Rf Receiver ◽  
High Volume Production ◽  
Volume Production ◽  
Noise Amplifier ◽  
Insertion Losses

This chapter describes some basic characteristic responses that must be known for each Monolithic Microwave Integrated Circuits. The main parameters such Return Loss, Insertion Losses or Gain, Power at 1dB compression, InterModulation Products or Noise Figure are very important and have to be measured before using the device in final applications. Basic rules of Test and Measurement in RF and Microwaves, as well for characterization on benches as for high volume production using Automatic Test Equipments installed in test platforms, are summarized for helping today’s test engineers to develop their own test solutions. The device, that was characterized on bench and tested in production environment, is a monolithic, integrated low noise amplifier (LNA) and mixer usable in RF receiver Front-End applications for Personal Communications functioning on frequency wideband between 0.1 and 2.0 GHz.

The interface between device and circuit design

1985 ◽  
Vol 63 (6) ◽  
pp. 699-701
Author(s):  
R. C. Foss ◽  
A. L. Silburt
Keyword(s):  
Integrated Circuits ◽  
Circuit Simulation ◽  
Performance Standards ◽  
High Volume ◽  
Circuit Element ◽  
Proper Understanding ◽  
User Input ◽  
High Volume Production ◽  
Volume Production ◽  
Simulation Task

A proper understanding of transistor and other circuit-element behavior is critical in the design process of integrated circuits intended for high-volume production or exacting performance standards. Models of such elements are a key ingredient in the circuit-simulation task, which provides design-verification feedback to chip designers. Failures in this process can have costly consequences. Much of the effort put into modelling work contributes very little to real needs as practical failures are usually at the much more gross level of user input or program-coding problems.

Design and Manufacture of a New Telephone Transmitter/Receiver Capsule

1985 ◽  
Vol 199 (3) ◽  
pp. 189-196
Author(s):  
V P Baker ◽  
W Chambers ◽  
F Taylor ◽  
N W Tester
Keyword(s):  
Production Line ◽  
Assembly Line ◽  
High Volume ◽  
Automated Assembly ◽  
Design Decisions ◽  
High Volume Production ◽  
Volume Production ◽  
Design And Manufacture

This paper describes a project to design a new telephone transmitter/receiver capsule which could be assembled on an automatic high volume production line. The reasons why the project was undertaken are outlined together with design decisions that were taken, and the automated assembly line is described in detail. The resulting achievements and the benefits to the company are reviewed.

scholarly journals Congener-specific partition properties of chlorinated paraffins evaluated with COSMOtherm and gas chromatographic retention indices

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jort Hammer ◽  
Hidenori Matsukami ◽  
Satoshi Endo
Keyword(s):  
Chemical Properties ◽  
High Volume ◽  
Retention Indices ◽  
Chromatographic Retention ◽  
Linear Free Energy Relationship ◽  
Linear Free Energy ◽  
Chlorinated Paraffins ◽  
Gas Chromatographic Retention Indices ◽  
High Volume Production ◽  
Volume Production

AbstractChlorinated Paraffins (CPs) are high volume production chemicals and have been found in various organisms including humans and in environmental samples from remote regions. It is thus of great importance to understand the physical–chemical properties of CPs. In this study, gas chromatographic (GC) retention indexes (RIs) of 25 CP congeners were measured on various polar and nonpolar columns to investigate the relationships between the molecular structure and the partition properties. Retention measurements show that analytical standards of individual CPs often contain several stereoisomers. RI values show that chlorination pattern have a large influence on the polarity of CPs. Single Cl substitutions (–CHCl–, –CH2Cl) generally increase polarity of CPs. However, many consecutive –CHCl– units (e.g., 1,2,3,4,5,6-C11Cl6) increase polarity less than expected from the total number of –CHCl– units. Polyparameter linear free energy relationship descriptors show that polarity difference between CP congeners can be explained by the H-bond donating properties of CPs. RI values of CP congeners were predicted using the quantum chemically based prediction tool COSMOthermX. Predicted RI values correlate well with the experimental data (R2, 0.975–0.995), indicating that COSMOthermX can be used to accurately predict the retention of CP congeners on GC columns.

High Volume Production Growth of GaAs on Silicon Substrates

1986 ◽  
Vol 67 ◽  
Author(s):  
Chris R. Ito ◽  
M. Feng ◽  
V. K. Eu ◽  
H. B. Kim
Keyword(s):  
Schottky Diodes ◽  
High Volume ◽  
Wafer Surface ◽  
Silicon Substrates ◽  
Growth Technique ◽  
Wafer Thickness ◽  
Production Growth ◽  
High Volume Production ◽  
Volume Production ◽  
P Type

ABSTRACTA high-volume epitaxial reactor has been used to investigate the feasibility for the production growth of GaAs on silicon substrates. The reactor is a customized system which has a maximum capacity of 39 three-inch diameter wafers and can accommodate substrates as large as eight inches in diameter. The MOCVD material growth technique was used to grow GaAs directly on p-type, (100) silicon substrates, three and five inches in diameter. The GaAs surfaces were textured with antiphase boundaries. Double-cyrstal rocking curve measurements showed single-cyrstal GaAs with an average FWHMof 520 arc seconds measured at four points over the wafer surface. Within-wafer thickness uniformity was ± 4% with a wafer-to-wafer uniformity of ± 2%. Photoluminescence spectra showed Tour peaks at 1.500, 1.483, 1.464, and 1.440 ev. Schottky diodes were fabricated on the GaAs on silicon material.

Determination of transverse flexural and shear moduli of chopped carbon fiber tape-reinforced thermoplastic by vibration

2017 ◽  
Vol 52 (3) ◽  
pp. 395-404
Author(s):  
Xiuqi Lyu ◽  
Jun Takahashi ◽  
Yi Wan ◽  
Isamu Ohsawa
Keyword(s):  
Carbon Fiber ◽  
Beam Theory ◽  
Transversely Isotropic ◽  
High Volume ◽  
Bending Test ◽  
Thermoplastic Material ◽  
Shear Moduli ◽  
High Volume Production ◽  
Volume Production

Chopped carbon fiber tape-reinforced thermoplastic material is specifically developed for the high-volume production of lightweight automobiles. With excellent design processability and flexibility, the carbon fiber tape-reinforced thermoplastic material is manufactured by compressing large amounts of randomly oriented, pre-impregnated unidirectional tapes in a plane. Therefore, the carbon fiber tape-reinforced thermoplastic material presents transversely isotropic properties. Transverse shear effect along the thickness direction of carbon fiber tape-reinforced thermoplastic beam has a distinct influence on its flexural deformation. Accordingly, the Timoshenko beam theory combined with vibration frequencies was proposed to determine the set of transverse flexural and shear moduli. Meanwhile, the transverse flexural and shear moduli of carbon fiber tape-reinforced thermoplastic beam were finally determined by fitting all the first seven measured and calculated eigenfrequencies with the least squares criterion. In addition, the suggested thickness to length ratio for the 3-point bending test and Euler–Bernoulli model was given.

Sign in / Sign up

Export Citation Format

Share Document