ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000501-000525
Author(s):  
Susan Bagen ◽  
Dave Alcoe ◽  
Kim Blackwell ◽  
Frank Egitto
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
High Reliability ◽  
Form Factors ◽  
Dielectric Materials ◽  
Industrial Applications ◽  
Organic Substrate ◽  
Electrical Performance ◽  
Organic Substrates

High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed in detail, and compared to standard PWB and ceramic. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002018-002053
Author(s):  
Swapan Bhattacharya ◽  
Fei Xie ◽  
Daniel F. Baldwin ◽  
Han Wu ◽  
Kelley Hodge ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
Process Development ◽  
High Reliability ◽  
Optimum Process ◽  
Process Conditions ◽  
Harsh Environment ◽  
Mechanical Shock ◽  
Large Area ◽  
Reliability Performance

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

scholarly journals Polyhydroxyalkanoates (PHAs) from dairy wastewater effluent: bacterial accumulation, structural characterization and physical properties

2020 ◽  
Author(s):  
Giorgia Pagliano ◽  
Wanda Gugliucci ◽  
Elena Torrieri ◽  
Alessandro Piccolo ◽  
Silvana Cangemi ◽  
...  
Keyword(s):  
Structural Characterization ◽  
High Performance ◽  
Volatile Fatty Acids ◽  
Industrial Applications ◽  
Organic Substrate ◽  
Dairy Wastewater ◽  
Production Costs ◽  
Batch Mode ◽  
Intermittent Feeding ◽  
Dairy Waste

Abstract Background to establish bioplastics the real alternative to conventional plastics, high production costs have to be constrained by using different kind of wastewater streams as organic substrate and novel microbial strains as accumulating bacteria with high performance. Volatile fatty acids (VFAs) from effluent of dairy wastewater biodigestion represent a new and cheap feedstock used in this study for biopolymers production through microbial processes.Results Cupriavidus necator DSM 13513 was particularly able to accumulate PHAs operating in fed-batch mode by limiting oxygen level together with intermittent feeding of carbon source with the maximum PHB accumulated in 48 h without compromising the microbial growth. The complex VFA mixture from digestate did not influence the PHA homopolymer accumulation. In fact, structural characterization by NMR analysis revealed the 3-hydroxybutirrate synthesis (PHB) by C. necator DSM 13513 grown with these different VFAs mixtures. Moreover, the bioplastic disk obtained C. necator DSM 13513 cells grown on VFA from digested dairy waste effluent, presented good thermic properties and low affinity to water.Conclusions overall results making the digested dairy waste effluent suitable for PHB production for specific bio-based industrial applications.

scholarly journals High-Performance Industrial Wireless: Achieving Reliable and Deterministic Connectivity over IEEE 802.11 WLANs

2020 ◽  
Author(s):  
Adnan Aijaz
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Industrial Applications ◽  
System Level ◽  
Medium Access ◽  
Virtual Time ◽  
High Scalability ◽  
Temporal Redundancy ◽  
Access Mechanisms ◽  
System Level Simulations

<div>Communication for control-centric industrial applications is characterized by the requirements of very high reliability, very low and deterministic latency and high scalability. This paper proposes a novel solution for providing reliable and deterministic communication, through Wi-Fi, in industrial environments. The proposed solution, termed as HAR<sup>2</sup>D-Fi, adopts hybrid channel access mechanisms for achieving deterministic communication. It also provides temporal redundancy for enhanced reliability. HAR<sup>2</sup>D-Fi implements different medium access control (MAC) designs that build on the standard physical (PHY) layer. Such designs can be classified into two categories: (a) MAC designs with pre-defined (physical) time-slotted schedule, and (b) MAC designs with virtual time-slotted schedule. Performance evaluation, based on analysis and system-level simulations, demonstrates the viability of HAR<sup>2</sup>D-Fi for control-centric industrial applications.</div>

A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect

2002 ◽  
Author(s):  
Qi Zhu ◽  
Lunyu Ma ◽  
Suresh K. Sitaraman
Keyword(s):  
High Performance ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Optimization Technique ◽  
Cost Effective ◽  
Organic Substrate ◽  
Electrical Performance ◽  
Wafer Level ◽  
Good Reliability ◽  
Mechanical Compliance

As the rapid advances in IC design and fabrication continue to challenge and push the electronic packaging technology, in terms of fine pitch, high performance, low cost, and good reliability, compliant interconnects show great advantages for next-generation packaging. β-fly is designed as a compliant chip-to-substrate interconnect for performing wafer-level probing and for packaging without underfill. β-fly has good compliance in all directions to compensate the coefficient of thermal expansion (CTE) mismatch between the silicon die and an organic substrate. The fabrication of β-fly is similar to standard IC fabrication, and wafer-level packaging makes it cost effective. In this work, self-weight effect and stress distribution under planar displacement loading of β-fly is studied. The effect of geometry parameters on mechanical and electrical performance of β-fly is also studied. β-fly with thinner and narrower arcuate beams with larger radius and taller post is found to have better mechanical compliance. In addition to mechanical compliance, electrical characteristics of β-fly have also been studied in this work. However, it is found that structures with excellent mechanical compliance cannot have good electrical performance. Therefore, a trade off is needed for the design of β-fly. Response surface methodology and an optimization technique have been used to select the optimal β-fly structure parameters.

High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer

2014 ◽  
Vol 2014 (1) ◽  
pp. 000402-000408
Author(s):  
Venky Sundaram ◽  
Jialing Tong ◽  
Kaya Demir ◽  
Timothy Huang ◽  
Aric Shorey ◽  
...  
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Electrical Performance ◽  
Mechanical Reliability ◽  
Bare Glass ◽  
Fine Pitch ◽  
Glass Panels ◽  
Accelerated Thermal Cycling ◽  
Frequency Behavior

This paper presents, for the first time, the thermo-mechanical reliability and the electrical performance of 30μm through package vias (TPVs) formed by Corning in ultra-thin low-cost bare glass interposers and metallized directly by sputter seed and electroplating. In contrast to glass interposers with polymer coated glass cores reported previously, this paper reports on direct metallization of thin and uncoated glass panels with fine pitch TPVs. The scalability of the unit processes to large panel sizes is expected to result in bare glass interposers at 2 to 10 times lower cost than silicon interposers fabricated using back end of line (BEOL) wafer processes. The thermo-mechanical reliability of 30μm TPVs was studied by conducting accelerated thermal cycling tests (TCT), with most via chains passing 1000 cycles from −55°C to 125°C. The high-frequency behavior of the TPVs was characterized by modeling, design and measurement up to 30 GHz.

Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures

2020 ◽  
Vol 2020 (1) ◽  
pp. 000211-000216
Author(s):  
Tatsushi Hayashi ◽  
Po Yu Lin ◽  
Ryoichi Watanabe ◽  
Seiko Ichikawa
Keyword(s):  
Insertion Loss ◽  
High Speed ◽  
High Performance ◽  
Dielectric Material ◽  
Organic Substrate ◽  
Temperature Cycle ◽  
Organic Substrates ◽  
High Crack ◽  
Low Insertion Loss ◽  
Lower Insertion Loss

Abstract With IP traffic increasing by 10-fold over the last decade, together with limitation and cost increase due to shrinking semiconductor nodes have led to requiring technological breakthrough in the packaging of semiconductor devices especially those used in high performance computing (HPC).This increase in IP traffic has led to requirement for higher data speed transmission in these devices, and consequently packaging technologies that enable those solutions such as 2.5D packaging utilizing silicon interposers. Furthermore, in recent years, increasing number of dies are placed in a single package for these devices thereby making the size of silicon interposers larger. Thus, the design of organic substrates used in these devices, are also becoming ever complex often with multiple layers with long trace lengths for routing increased number of IOs and allowing for power and signal control management. In order to facilitate the high speed data transmission requirement with longer trace lengths, stable low insertion loss design of organic substrates are becoming significantly important even when devices are exposed at elevated humidity or higher temperatures due to surrounding environment or from dies heating. Additionally, as silicon interposers are increasing in size, preventing stress build-up, which can cause cracking between the interposer and the organic substrate, is also becoming paramount. These requirements have led to innovative materials to be developed to enable organic substrates to have these properties. In this paper, we present a new dielectric build-up material for use in advanced organic substrates, by combining newly developed original resin with existing formulation technology that meet these criteria of enabling lower insertion loss with design that reduces deterioration even at elevated humidity and temperature, and furthermore having high crack resistance during temperature cycle testing.

scholarly journals Polyhydroxyalkanoates (PHAs) from dairy wastewater effluent: bacterial accumulation, structural characterization and physical properties

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Giorgia Pagliano ◽  
Wanda Gugliucci ◽  
Elena Torrieri ◽  
Alessandro Piccolo ◽  
Silvana Cangemi ◽  
...  
Keyword(s):  
Structural Characterization ◽  
High Performance ◽  
Volatile Fatty Acids ◽  
Industrial Applications ◽  
Wastewater Effluent ◽  
Dairy Wastewater ◽  
Production Costs ◽  
Organic Substrates ◽  
Batch Mode ◽  
Intermittent Feeding

Abstract Background To establish bioplastics as a real alternative to conventional plastics, high production costs must be constrained by using different kinds of wastewater streams as organic substrates and novel microbial strains as material-accumulating bacteria with high performance. Volatile fatty acids (VFAs) from the effluent of dairy wastewater biodigestion represent a new and inexpensive feedstock, which was used in this study for biopolymer production through microbial processes. Results Cupriavidus necator DSM 13513 was particularly able to accumulate PHAs when operating in fed-batch mode by limiting the oxygen level together with intermittent feeding of a carbon source; maximum poly-β-hydroxybutyrate (PHB) accumulation was achieved in 48 h without compromising microbial growth. The complex VFAs mixture from the digestate did not influence PHA homopolymer accumulation. In fact, structural characterization by NMR analysis revealed PHB synthesis by C. necator DSM 13513 grown with different VFAs mixtures. Moreover, the bioplastic disk obtained from C. necator DSM 13513 cells grown on VFAs from digested dairy wastewater effluent presented good thermic properties and low affinity to water. Conclusions Overall, the results make digested dairy wastewater effluent suitable for PHB production for specific biobased industrial applications.

300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera's MVP (TSV) Technology

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002254-002271
Author(s):  
Dave Thomas ◽  
Matthew Muggeridge ◽  
Mike Steel ◽  
Dorleta Cortaberria Sanz ◽  
Hefin Griffiths ◽  
...  
Keyword(s):  
High Performance ◽  
Form Factors ◽  
Image Sensor ◽  
Electrical Performance ◽  
Depth Range ◽  
Back Side ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Profile Control ◽  
Bond Pads

Miniature, high performance camera modules are found in a range of consumer devices including phones, PDAs, cameras and gaming consoles. According to Gartner the $1B image sensor market will grow to $2.3B by 2013. Image sensor packaging technologies are increasingly required to deliver greater reliability within smaller form factors. Tessera's OptiML™ Micro Via Pad (MVP) wafer-level packaging technology is in production on 200mm wafers. This paper will report on the first joint activity that scales this technology to 300mm. We focus on three critical silicon etches that form the back-bone of the structure. These etches are carried out from the wafer back-side while bonded to a glass carrier. First there is a blanket dry etch. This removes stress introduced by the back-grind. Uniformity control to &lt; ±5% is essential for this process. Second, after a lithography step, tapered silicon trenches are etched forming streets to a certain depth. The trench etch uniformity is critical because it defines the depth range for the subsequent Vias. Profile control is needed to ease the subsequent spray-coat lithography. Lastly, vias are then etched down to metal bond pads on the device side of the wafer. CD and taper control is required here both within wafer and between wafers. End-pointing represents a way of ensuring process reproducibility. In 2010 Tessera carried out 300mm demos with key suppliers. As part of this activity SPTS scaled the above critical silicon etches. The wafers were further processed into functional die. We will describe the etch equipment used, report on the critical processes developed emphasizing the relationships between 200mm and 300mm results and the essential control parameters. We will also demonstrate successful scaling by including data on the electrical performance of packaged devices.

A Magnetic Bearing System for More-Electric Engines

2000 ◽  
Author(s):  
R. Jett Field ◽  
Christopher K. Sortore ◽  
Victor Iannello
Keyword(s):  
High Speed ◽  
High Performance ◽  
Fault Tolerant ◽  
High Reliability ◽  
Industrial Applications ◽  
Magnetic Bearing ◽  
Tip Clearance ◽  
Critical Components ◽  
Maintenance Requirements ◽  
Bearing System

Magnetic bearing systems for more-electric engines (MEEs) are under development for aircraft and industrial applications to improve performance and reduce maintenance requirements. Key features of the magnetic bearing system are high performance, high temperature actuators with integrated sensors; a high speed digital controller; a high reliability, fault-tolerant system architecture; modular amplifiers; active control of tip clearance; and adaptive control algorithms. Critical components of the magnetic bearing system have been demonstrated in an engine manufacturer’s rotordynamic test stand and other components are in various stages of development.

scholarly journals Failure Detection by Signal Similarity Measurement of Brushless DC Motors

Energies ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1364 ◽  
Author(s):  
Vito Mario Fico ◽  
Antonio Leopoldo Rodríguez Vázquez ◽  
María Ángeles Martín Prats ◽  
Franco Bernelli-Zazzera
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Failure Detection ◽  
Industrial Applications ◽  
Brushless Dc Motors ◽  
Brushless Dc ◽  
Dc Motors ◽  
Technology Readiness Level ◽  
Readiness Level

In recent years, Brushless DC (BLDC) motors have been gaining popularity as a solution for providing mechanical power, starting from low cost mobility solutions like the electric bikes, to high performance and high reliability aeronautical Electro-Mechanical Actuator (EMA). In this framework, the availability of fault detection tools suited to these types of machines appears necessary. There is already a vast literature on this topic, but only a small percentage of the proposed techniques have been developed to a sufficiently high Technology Readiness Level (TRL) to be implementable in industrial applications. The investigation on the state of the art carried out during the first phase of the present work, tried to collect the techniques which are closest to possible implementation. To fill a gap identified in the current techniques, a partial demagnetisation detection method is proposed in this paper. This technique takes advantage of the asymmetries generated in the current by the missing magnetic flux to detect the failure. Simulations and laboratory experiments have been carried out to validate the idea, showing the potential and the easy implementation of the method. The results have been examined in detail and satisfactory conclusions have been drawn.

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