Development of Embedded High Power Electronics Modules for Automotive Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001717-001743
Author(s):  
Lars Boettcher ◽  
S. Karaszkiewicz ◽  
D. Manessis ◽  
A. Ostmann
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Printed Circuit Board ◽  
Copper Substrate ◽  
Circuit Board ◽  
Installation Space ◽  
Temperature Sinter ◽  
Die Attach ◽  
Power Modules ◽  
Power Switches

The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics substrates and their top contacts are connected by heavy Al wire bonds. These ceramic modules are vacuum soldered to water-cooled base plates. Embedding of power switches, and controller into compact modules using PCB (Printed Circuit Board) technologies offers the potential to further improve the thermal management by double-sided cooling and to reduce the thickness of the module. In the recently started “HI-LEVEL” (Integration of Power Electronics in in High Current PCBs for Electric Vehicle Application) project, partners from automotive, automotive supplier, material supplier, PCB manufacturer and research teamed up to develop the technology, components and materials to realize high power modules. The following topics of the development will be addressed in detail in this paper:Assemble of power dies (IGBT and diode) using new sinter die attach materials:The deployment of new no pressure, low temperature sinter paste for the assembly of the power dies is a mayor development goal. Here the development of a reliable process to realize a defect free bonding of large IGBT dies (up to 10x14mm2) is essentially. These pastes are applied by stencil printing or dispensing and the sintering will take place after die placement at temperatures of around 200 °C.Thick copper substrate technology:To handle the high switching current, suitable copper tracks in the PCB are required. The realization of such thick copper lines (up to 1mm thickness) requires advanced processing, compared to conventional multilayer PCB production. In this paper the essential development steps towards a 10 kW inverter module with embedded components will be described. The process steps and reliability investigations of the different interconnect levels will be described in detail.

Reliable Power Electronics for Wind Turbines

2009 ◽  
Author(s):  
Patrick McCluskey ◽  
Peter Hansen ◽  
Douglas DeVoto
Keyword(s):  
Wind Turbine ◽  
Power Electronics ◽  
Heat Removal ◽  
Electronic System ◽  
Power Electronic ◽  
Pulse Width Modulated ◽  
Power Extraction ◽  
Die Attach ◽  
Power Modules ◽  
Power Switches

Power electronics are used to minimize losses in converting the energy produced by the generator in a wind turbine, and to drive motors that control the pitch and yaw of the wind turbine to ensure maximum power extraction. The power electronic system is based on a series of three-phase pulse width modulated (PWM) power modules consisting of IGBT power switches and associated diodes that are soldered to a ceramic substrate and interconnected with wirebonds. The design of the packaging and cooling of the power electronics is crucial to enhancing the energy efficiency and the reliability of the electronics, which generate heat loads in the hundreds of watts/cm2, and are often placed in harsh and inaccessible offshore environments. Without adequate heat removal, the increase in device temperature will reduce the efficiency of power electronic devices leading to thermal runaway and eventual failure of the entire power electronic system. Furthermore, the increased temperatures can lead to failure of the packaging elements as well. This paper will provide an overview of the fundamental packaging level mechanisms that can cause failures in the power electronic system. These include wirebond and lead fatigue, die attach fatigue, substrate cracking, and lead bonding fatigue.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Printed Circuit Board ◽  
Microwave Sintering ◽  
Copper Substrate ◽  
Bulk Diffusion ◽  
Circuit Board ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

2021 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Hiren R. Kotadia ◽  
Fosca Conti ◽  
Armin Mauser ◽  
Thomas Rubenbauer ◽  
...  
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Electronics Packaging ◽  
Die Attach

Optimized High Power GaN Transistors

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000195-000199
Author(s):  
J. Roberts ◽  
A. Mizan ◽  
L. Yushyna
Keyword(s):  
High Speed ◽  
Figure Of Merit ◽  
Printed Circuit Board ◽  
Heat Removal ◽  
Vital Role ◽  
Circuit Board ◽  
Die Structure ◽  
Power Switches ◽  
On Chip ◽  
Very High

GaN transistors intended for use at 600–900 V and that are capable of providing of 30–100 A are being introduced this year. These devices have a substantially better switching Figure-of-Merit (FOM) than silicon power switches. Rapid market acceptance is expected leading to compound annual growth rates of 85 %. However these devices present new packaging challenges. Their high speed combined with the very high current being switched demands that very low inductance packaging must be combined with highly controlled drive circuitry. While convention, and the usually vertical power device die structure, has largely determined power transistor package formats in the past, the lateral nature of the today GaN devices requires the use of new package types. The new packages have to operate at high temperatures while providing effective heat removal, low inductance, and low series resistance. Because GaN devices are lateral they require the package metal tracks to be integrated within the on-chip tracks to carry the current away from the thin on-chip metal tracks. The new GaN devices are available in two formats: one for use in embedded modular assemblies and the other for use mounted upon conventional circuit board systems. The package intended for discrete printed circuit board (PCB) assemblies has a top side cooling option that simplifies the thermal interface to the heat sink. The paper describes the die layout including the added copper tracks. The corresponding package elements that interface directly with the surface of the die play a vital role in terms of the current handling. They also provide the interface to the external busbars that allow the package to be mounted within, or on PCB. The assembly has been subject to extensive thermal analysis and the performance of a 30 A, 650 V transistor is described.

scholarly journals Recent advances in compact repetitive high-power Marx generators

2019 ◽  
Vol 37 (01) ◽  
pp. 110-121 ◽  
Author(s):  
Falun Song ◽  
Fei Li ◽  
Beizhen Zhang ◽  
Mingdong Zhu ◽  
Chunxia Li ◽  
...  
Keyword(s):  
High Power ◽  
Printed Circuit Board ◽  
Pulse Generator ◽  
Pulsed Power ◽  
Circuit Board ◽  
Constant Current ◽  
Marx Generator ◽  
Power Generators ◽  
Square Wave ◽  
Film Dielectric

AbstractThis paper introduces recent activities on Marx-based compact repetitive pulsed power generators at the Institute of Applied Electronics (IAE), China Academy of Engineering Physics (CAEP), over the period 2010–2018. A characteristic feature of the generators described is the use of a simplified bipolar charged Marx circuit, in which the normal isolation resistors or inductors to ground are removed to make the circuit simpler. Several pulse-forming modules developed to generate a 100 ns square wave output are introduced, including thin-film dielectric lines of different structures, a pulse-forming line based on a Printed Circuit Board, and non-uniform pulse-forming networks. A compact repetitive three-electrode spark gap switch with low-jitter, high-voltage, and high-current was developed and is used in the generators. A positive and negative series resonant constant current power supply with high precision and high power is introduced. As an important part of the repetitive pulse power generator, a lower jitter pulse trigger source is introduced. Several typical high-power repetitive pulsed power generators developed at IAE are introduced including a 30 GW low-impedance Marx generator, a compact square-wave pulse generator based on Kapton-film dielectric Blumlein line, a 20 GW high pulse-energy repetitive PFN-Marx generator, and a coaxial Marx generator based on ceramic capacitors. The research of key technologies and their development status are discussed, which can provide a reference for the future development and application of miniaturization of compact and repetitive Marx generators.

High power triboelectric nanogenerator based on printed circuit board (PCB) technology

Nano Research ◽  
2014 ◽  
Vol 8 (3) ◽  
pp. 722-730 ◽  
Author(s):  
Changbao Han ◽  
Chi Zhang ◽  
Wei Tang ◽  
Xiaohui Li ◽  
Zhong Lin Wang
Keyword(s):  
High Power ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Triboelectric Nanogenerator ◽  
Printed Circuit

Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization

2016 ◽  
Vol 231 (2) ◽  
pp. 267-278 ◽  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Installation Space ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Overcurrent Protection ◽  
Large Current ◽  
Analytical Estimation

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.

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