Next Generation System in a Package Manufacturing by Embedded Chip Technologies

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 002075-002103
Author(s):  
Lars Boettcher ◽  
A. Ostmann ◽  
D. Manessis ◽  
S. Karaszkiewicz ◽  
H. Reichl
Keyword(s):  
Glass Fibers ◽  
Copper Substrate ◽  
Standard Type ◽  
Chip Technology ◽  
Fine Pitch ◽  
Wide Range ◽  
Power Part ◽  
Third Dimension ◽  
New Generation ◽  
Embedded Chip

The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by that, the third dimension will be available for further layers or assemblies. This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial Quad Flat Packages with embedded chips (embedded chip QFN). Chips of 50 μm thickness, a pad pitch of 100 μm and pad size of 85 μm are die bonded to a copper substrate and subsequently embedded in RCC (Resin-Coated-Copper) layers by using vacuum lamination. The resulting QFN packages are only 160 μm thick and provide standard pads at 400 μm pitch and a total number of 84 I/Os with dimensions of 10x10 mm2. All embedded chip QFN packages at prototype level are manufactured in 250x300 mm2 panels. The present work will include QFN package reliability results after extensive testing of thermal cycling, temperature humidity, high temperature storage and pressure cooker test. The investigation of new embedding material combinations is one task to provide a reliable package. The main focus here is on new materials that offer improved package stability and also the ability to embed dies of different thickness. Together with material suppliers improved resin formulations as well as the introduction of filler and glass fibers into the resin layers is currently realized and tested. In order to realize a further miniaturization ultra fine pitch (UFP) and fine line (UFL) approaches will be presented. For a UFP approach the goal is to develop the laser via technology further towards their limits as well as the investigation of new concepts. UFP requires the use of a semi additive patterning process. Here LDI processing is being used for all new generation chip embedded packages due to its potential for very fine copper patterning. Results on very fine L/S of 15–20μm will be shown based on the semi-additive processes on an ultra thin initial 1–2μm copper foil. Finally different applications will be presented. In an industrial cooperation different power package developments are ongoing. Here single and multi chips modules are realized as well as multiple routing layers. The combination of power and logic is one of the main challenges here, due to the need of thick copper layers for the power part and the more fine pitch demands for the controller chips. Process developments and results will be discussed in detail.

Next Generation System in a Package Manufacturing by Embedded Chip Technologies

2010 ◽  
Vol 7 (3) ◽  
pp. 131-137 ◽  
Author(s):  
Lars Boettcher ◽  
D. Manessis ◽  
S. Karaszkiewicz ◽  
A. Ostmann ◽  
H. Reichl
Keyword(s):  
Copper Substrate ◽  
Next Generation ◽  
Generation System ◽  
Standard Type ◽  
Passive Components ◽  
The Third ◽  
Chip Technology ◽  
Wide Range ◽  
Third Dimension ◽  
Embedded Chip

The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and thereby the third dimension will be available for further layers or assemblies. This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial quad flat packages with embedded chips (embedded chip QFN). Chips of 50 μm thickness, a pad pitch of 100 μm, and pad size of 85 μm are die bonded to a copper substrate and subsequently embedded in RCC (resin coated copper) layers by using vacuum lamination. The resulting QFN packages are only 160 μm thick and provide standard pads at 400 μm pitch and a total number of 84 I/Os with dimensions of 10 × 10 mm2. All embedded chip QFN packages at the prototype level are manufactured in 250 × 300 mm2 panels.

Realization of Power Modules by Chip Embedding Technology

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001019-001045 ◽  
Author(s):  
Lars Boettcher ◽  
D. Manessis ◽  
S. Karaszkiewicz ◽  
A. Ostmann
Keyword(s):  
Printed Circuit Board ◽  
High Reliability ◽  
Computer Applications ◽  
Circuit Board ◽  
Manufacturing Cost ◽  
Chip Technology ◽  
Power Modules ◽  
Wide Range ◽  
Via Holes ◽  
Third Dimension

The continuous miniaturization of silicon dies and the need for a further package size reduction, with an equal or better performance and reduced manufacturing cost, are the main drivers for new packaging concepts. The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by that, the third dimension will be available for further layers or assemblies. This paper will briefly discuss the necessary process steps of the embedded chip technology, which is based on printed circuit board manufacturing processes, and will also demonstrate the transfer of the technology from a smaller size lab scale equipment environment to an industrial comparable process line, capable of processing large panel formats up to 18” x 24”. The paper will also briefly describe this development and categorize today's embedding technologies. First modules with embedded chips are in production in Asia, mainly for telecom and computer applications. In Europe embedding has gained a strong interest for power modules, especially in automotive applications. Main drivers are the capability for compact and thin packaging, the high reliability and cost saving potential. In a number of European cooperation projects with partners from industry and research, embedding of power chips, like IGBTS and power MOSFET, is of high interest. In this paper current achievements of these projects will be shown, especially examples of realized devices and their characteristics. The dominating technology for power chip embedding is a face-up technology. Chips are bonded with their backside (drain contact) to a Cu substrate using highly conductive adhesive or solder. Using the face up assembly, a direct contact to the backside of the die is possible, allowing a lot of benefits for driving high currents and applying an efficient thermal management for the power devices. Then Chips are embedded by vacuum lamination of prepreg or RCC (resin coated copper) layers. Via holes to the top contacts (gate and source) are formed by laser drilling. The vias are metallized using conventional Cu plating. Finally conductor structures are etched in the top Cu layer, finalizing the circuit. Details will be given about device manufacturing, related yield issues and strategies to overcome them. Finally scenarios for the implementation of embedding technology and concepts for future applications will be discussed.

scholarly journals The Impact of Initial Conditions in N-Body Simulations of Debris Discs

2015 ◽  
Vol 32 ◽  
Author(s):  
E. Thilliez ◽  
S. T. Maddison
Keyword(s):  
Numerical Simulations ◽  
Initial Conditions ◽  
Parent Body ◽  
Dust Trapping ◽  
Physical Context ◽  
Disc Width ◽  
Wide Range ◽  
Belt Width ◽  
New Generation ◽  
The Impact

AbstractNumerical simulations are a crucial tool to understand the relationship between debris discs and planetary companions. As debris disc observations are now reaching unprecedented levels of precision over a wide range of wavelengths, an appropriate level of accuracy and consistency is required in numerical simulations to confidently interpret this new generation of observations. However, simulations throughout the literature have been conducted with various initial conditions often with little or no justification. In this paper, we aim to study the dependence on the initial conditions of N-body simulations modelling the interaction between a massive and eccentric planet on an exterior debris disc. To achieve this, we first classify three broad approaches used in the literature and provide some physical context for when each category should be used. We then run a series of N-body simulations, that include radiation forces acting on small grains, with varying initial conditions across the three categories. We test the influence of the initial parent body belt width, eccentricity, and alignment with the planet on the resulting debris disc structure and compare the final peak emission location, disc width and offset of synthetic disc images produced with a radiative transfer code. We also track the evolution of the forced eccentricity of the dust grains induced by the planet, as well as resonance dust trapping. We find that an initially broad parent body belt always results in a broader debris disc than an initially narrow parent body belt. While simulations with a parent body belt with low initial eccentricity (e ~ 0) and high initial eccentricity (0 < e < 0.3) resulted in similar broad discs, we find that purely secular forced initial conditions, where the initial disc eccentricity is set to the forced value and the disc is aligned with the planet, always result in a narrower disc. We conclude that broad debris discs can be modelled by using either a dynamically cold or dynamically warm parent belt, while in contrast eccentric narrow debris rings are reproduced using a secularly forced parent body belt.

scholarly journals Review of Functional Treatments for Modified Wood

Coatings ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 327
Author(s):  
Morwenna J. Spear ◽  
Simon F. Curling ◽  
Athanasios Dimitriou ◽  
Graham A. Ormondroyd
Keyword(s):  
High Performance ◽  
Responsive Materials ◽  
Wood Modification ◽  
Wide Range ◽  
Natural Wood ◽  
Impregnation Modification ◽  
New Applications ◽  
New Generation ◽  
Dimensional Instability ◽  
Modified Wood

Wood modification is now widely recognized as offering enhanced properties of wood and overcoming issues such as dimensional instability and biodegradability which affect natural wood. Typical wood modification systems use chemical modification, impregnation modification or thermal modification, and these vary in the properties achieved. As control and understanding of the wood modification systems has progressed, further opportunities have arisen to add extra functionalities to the modified wood. These include UV stabilisation, fire retardancy, or enhanced suitability for paints and coatings. Thus, wood may become a multi-functional material through a series of modifications, treatments or reactions, to create a high-performance material with previously impossible properties. In this paper we review systems that combine the well-established wood modification procedures with secondary techniques or modifications to deliver emerging technologies with multi-functionality. The new applications targeted using this additional functionality are diverse and range from increased electrical conductivity, creation of sensors or responsive materials, improvement of wellbeing in the built environment, and enhanced fire and flame protection. We identified two parallel and connected themes: (1) the functionalisation of modified timber and (2) the modification of timber to provide (multi)-functionality. A wide range of nanotechnology concepts have been harnessed by this new generation of wood modifications and wood treatments. As this field is rapidly expanding, we also include within the review trends from current research in order to gauge the state of the art, and likely direction of travel of the industry.

Host-vector systems

1989 ◽  
Vol 324 (1224) ◽  
pp. 477-485 ◽  
Keyword(s):  
Genetic Manipulation ◽  
Pharmaceutical Products ◽  
Host Cells ◽  
Animal Cells ◽  
Vector Systems ◽  
Wide Range ◽  
Novel Host ◽  
Basic Concepts ◽  
Foreign Genes ◽  
New Generation

In 1980 it was only possible to express foreign genes in bacteria and a few easily cultured animal cells. During the subsequent eight years specialized vectors have been developed to allow the genetic manipulation of a wide range of both prokaryotes and eukaryotes. One of the major goals of biotechnology in 1980 was to use host cells as ‘factories’ for the production of proteins that were only available in minute quantities from natural sources. This has already lead to a new generation of pharmaceutical products. Advances in our understanding of host-vector systems have defined new goals. The basic concepts of expression vector design will be illustrated. Some of the new goals are discussed with particular reference to the exploitation of novel host-vector systems to develop vaccines and anti-viral agents against AIDS.

Abstract 120: Surpass Flow Diverter for Endovascular Treatment of Intracranial Aneurysms - A Multicenter Preliminary Clinical and Angiographic Experience in 161 Patients with 186 Aneurysms

Stroke ◽  
2014 ◽  
Vol 45 (suppl_1) ◽  
Author(s):  
Ajay K Wakhloo ◽  
Pedro Lylyk ◽  
Joost de Vries ◽  
Matthew J Gounis ◽  
Alexandra Biondi ◽  
...  
Keyword(s):  
Intracranial Aneurysms ◽  
Experimental Studies ◽  
Flow Diverter ◽  
Posterior Circulation ◽  
Parent Artery ◽  
Anterior Circulation ◽  
Neck Size ◽  
Wide Range ◽  
New Generation

Objective: Validated through experimental studies a new generation of flow diverters (Surpass™ FD) was evaluated for treatment of intracranial aneurysms (IA). We present our multicenter preliminary clinical and angiographic experience. METHODS: To achieve the calculated flow disruption between the parent artery and aneurysm for thrombosis, single FDs were placed endovascularly in parent arteries. Implants measured 2.5-5.3mm in diameter with a length of 10-80mm. Patients were enrolled harboring a wide range large and giant wide-neck, fusiform and multiple small and blister-type aneurysm. Clinical and angiographic follow-up were performed at 1-3, 6, and 12 months. RESULTS: A total of 186 consecutive IA in 161 patients (mean age 57.1 years) were treated at 33 centers. Fifty-three aneurysms were smaller than 5 mm, 64 were 5-9.9mm in diameter, 47 were 10-20mm in diameter, and 22 were larger than 20mm (10.4±0.7mm, neck size 6.0±0.5mm [mean±SEM]) . The aneurysms originated in 63.4% from the internal carotid artery; 22% and 14.5% of the lesions were located in the anterior circulation distal to Circle of Willis and posterior circulation respectively. Technical success was achieved in 182 aneurysms (98%); average number of devices used per aneurysm was 1.05. Permanent morbidity and mortality during the follow-up period of mean 8.4months (range 1-24 months) including periprocedural complications for patients with aneurysms of the anterior circulation were encountered in 5 (3.7%) and 2 (1.5 %) patients respectively and 1 (3.7%) and 4 (14.8%) respectively for patients with aneurysms of the posterior circulation location. One-hundred-ten patients (70.5%) harboring 127 (70.2%) were available for clinical and angiographic follow-up and showed a complete or near complete aneurysm occlusion in 63 (81.8%) of the ICA. Aneurysms of the ICA≥10mm that were completely covered by FD and not previously stent-treated with a minimum of 6 months follow-up available in 16 patients showed a complete obliteration in 81.3% (n=13) and >90% occlusion in remaining 3 patients. CONCLUSION: Preliminary data demonstrate high safety and efficacy of a new generation of FD for a wide range of IA of the anterior and posterior circulation with a single implant.

Automation and Management of Design Process of the Main Drive for an Innovative Fruits and Vegetables Washer

2021 ◽  
Vol 27 (1) ◽  
pp. 9-17
Author(s):  
V. P. Bui ◽  
◽  
S. S. Gavruishin ◽  
V. B. Phung ◽  
H. M. Dang ◽  
...  
Keyword(s):  
Design Process ◽  
Rational Design ◽  
Fruits And Vegetables ◽  
Rational Solution ◽  
Quality Criteria ◽  
Pareto Optimal ◽  
Optimal Domain ◽  
Wide Range ◽  
A New Technique ◽  
New Generation

A new technique is described, used by the authors to automate the design process of the main drive of a new generation machine intended for industrial washing of fruits and vegetables. To solve the problem of multi-criteria design, the original approach is proposed that uses interconnected mathematical models describing the dynamic behavior, strength reliability and functional characteristics of the machine in a unified information space. The generalized mathematical model includes 12 controlled parameters, 16 functional constraints, and 3 quality criteria. A genetic algorithm was used to find the space of Pareto-optimal solutions. The situational approach was used to select the final rational solution from a set of solutions belonging to the Pareto-optimal domain. The rational design of option the washer found using the proposed approach is compared with the existing ones. The proposed design methodology can be recommended for the design of a wide range of similar mechanical structures.

The life and works of Domenico Mario Nuti, 1937–2020: An appreciation

2021 ◽  
Vol 71 (2) ◽  
pp. 181-194
Author(s):  
Saul Estrin ◽  
Milica Uvalic
Keyword(s):  
Economic Theory ◽  
Original Work ◽  
Policy Advice ◽  
Wide Range ◽  
New Generation ◽  
At Home

AbstractIt is challenging to provide an encompassing portrait of Mario Nuti's life and works: he was an exceptional man, who made significant intellectual contributions across a wide range of fields, as well as inspiring generations of students, colleagues and the profession in general, for more than fifty years. A brilliant debater and controversialist, he was equally at home in economic theory and in giving policy advice, and over the decades he had made significant contributions to many branches of the discipline. In this memorial article, we try to give a flavour of the man and his work, hopefully reminding the conoscenti of Mario's perceptive and original work, while introducing a new generation of scholars to his distinctive take on the field of economics.

Cryogenic Machining of Titanium Ti-5553 Alloy

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Yusuf Kaynak ◽  
Armin Gharibi
Keyword(s):  
Titanium Alloy ◽  
Tool Wear ◽  
Cutting Temperature ◽  
Cryogenic Cooling ◽  
Machining Process ◽  
Dry Machining ◽  
Cryogenic Machining ◽  
Machining Performance ◽  
Wide Range ◽  
New Generation

Titanium alloy Ti-5Al-5V-3Cr-0.5Fe (Ti-5553) is a new generation of near-beta titanium alloy that is commonly used in the aerospace industry. Machining is one of the manufacturing methods to produce parts that are made of this near-beta alloy. This study presents the machining performance of new generation near-beta alloys, namely, Ti-5553, by focusing on a high-speed cutting process under cryogenic cooling conditions and dry machining. The machining experiments were conducted under a wide range of cutting speeds, including high speeds that used liquid nitrogen (LN2) and carbon dioxide (CO2) as cryogenic coolants. The experimental data on the cutting temperature, tool wear, force components, chip breakability, dimensional accuracy, and surface integrity characteristics are presented and were analyzed to evaluate the machining process of this alloy and resulting surface characteristics. This study shows that cryogenic machining improved the machining performance of the Ti-5553 alloy by substantially reducing the tool wear, cutting temperature, and dimensional deviation of the machined parts. The cryogenic machining also produced shorter chips as compared to dry machining.

scholarly journals Hardware solutions for energy-efficient control technologies of distribution network objects based on power semiconductor devices

2021 ◽  
Vol 24 (1) ◽  
pp. 91-96
Author(s):  
V. N. Krysanov ◽  
◽  
V. L. Burkovskii ◽  
I. A. Khaychenko ◽  
◽  
...  
Keyword(s):  
Reactive Power ◽  
Short Circuit ◽  
Distribution Networks ◽  
Voltage Transformer ◽  
Industrial Facilities ◽  
Power Semiconductor ◽  
Wide Range ◽  
Electric Power Sector ◽  
Power Part ◽  
Control Technologies

The article considers topical issues in development of energysaving technologies to optimize the control of distribution networks according to the criterion of minimum power losses. The technology consists in introducing new hardware to control the modes based on static devices. Based on the analysis of the existing hardware created to control the modes of distributio networks, the developed circuitry solutions of the power part and the control system of the multifunctional thyristor voltage transformer and hybrid thyristor capacitor are proposed. Their main technical characteristics and ways to reduce voltage asymmetry, limiting short circuit currents and regulating reactive power are det ermined. The use of software and hardware solutions was recommended for a wide range of energy conservation tasks, both in the electric power sector and at the level of industrial facilities

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