Erratum: Thermal Momentum in Thermodynamics, Part 1: Nature of Pressure, Equilibrium, and Nonequilibium and Generalization of the Maxwell‐Einstein Diffusion Force [Phys. Essays10, 287 (1997)]

1998 ◽  
Vol 11 (1) ◽  
pp. 181-181
Author(s):  
Mahmoud A. Melehy
Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2309
Author(s):  
Benedikt Roth ◽  
Dietmar Drummer

Integrative simulation techniques for predicting component properties, based on the conditions during processing, are becoming increasingly important. The calculation of orientations in injection molding, which, in addition to mechanical and optical properties, also affect the thermal shrinkage behavior, are modeled on the basis of measurements that cannot take into account the pressure driven flow processes, which cause the orientations during the holding pressure phase. Previous investigations with a high-pressure capillary rheometer (HPC) and closed counter pressure chamber (CPC) showed the significant effect of a dynamically applied pressure on the flow behavior, depending on the temperature and the underlying compression rate. At a constant compression rate, an effective pressure difference between the measuring chamber and the CPC was observed, which resulted in a stop of flow through the capillary referred to as dynamic compression induced solidification. In order to extend the material understanding to the moment after dynamic solidification, an equilibrium time, which is needed until the pressure signals equalize, was evaluated and investigated in terms of a pressure, temperature and a possible compression rate dependency in this study. The findings show an exponential increase of the determined equilibrium time as a function of the holding pressure level and a decrease of the equilibrium time with increasing temperature. In case of supercritical compression in the area of a dynamic solidification, a compression rate dependency of the determined equilibrium times is also found. The measurement results show a temperature-invariant behavior, which allows the derivation of a master curve, according to the superposition principle, to calculate the pressure equilibrium time as a function of the holding pressure and the temperature.


Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2335
Author(s):  
Jialong Qiu ◽  
Yanzhi Peng ◽  
Peng Gao ◽  
Caiju Li

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.


2014 ◽  
Vol 78 (1) ◽  
pp. 171-202 ◽  
Author(s):  
C. M. B. Henderson ◽  
D. L. Hamilton ◽  
J. P. Waters

AbstractExperiments in the system NaAlSiO4(Ne)−KAlSiO4(Ks)−SiO2(Qz)−H2O at 100 MPa show that the maximum content of NaAlSi2O6 in leucite is ∼4 wt.% and that analcime is close to the stoichiometric composition (NaAlSi2O6.H2O). Analcime forms metastably on quenching the higher-temperature experiments; it is secondary after leucite in experiments quenched from 780°C, while from 850°C it forms by alteration of leucite, and by devitrification of water-saturated glass. Both processes involve reaction with Na-rich aqueous fluids. Stable analcime forms at 500°C, well below the solidus, and cannot form as phenocrysts in shallow volcanic systems. New data for natural analcime macrocrysts in blairmorites are presented for the Crowsnest volcanics, Alberta, Canada. Other researchers have suggested that primary analcime occurs as yellow-brown, glassy, analcime phenocrysts. Our microprobe analyses show that such primary analcime is close to stoichiometric, with very low K2O (<0.1 wt.%), minor Fe2O3 (0.5−0.8 wt.%) and CaO (∼0.5 wt.%). An extrapolation of published experimental data for Ne−Ks−Qz at >500 MPa PH2O, where Anl + melt coexist, suggests that at >800 MPa two invariant points are present: (1) a reaction point involving Kf + Ab + Anl + melt + vapour; and (2) a eutectic with Kf + Anl + Ne + melt + vapour. We suggest that the nepheline-free equilibrium mineral assemblage for Crowsnest samples is controlled by reaction point (1). In contrast, blairmorites from Lupata Gorge, Mozambique, form at eutectic (2), consistent with the presence of nepheline phenocrysts. Our conclusions, based on high- vs. low-pressure experiments, confirm the suggestion made by other authors, that Crowsnest volcanic rocks must have been erupted explosively to preserve glassy analcime phenocrysts during very rapid, upward transport from deep in the crust (H2O pressures ≫500 MPa). Only rare examples survived the deuteric and hydrothermal alteration that occurred during and after eruption.


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