Effects of Humidity and Domain Polarity on Retention Loss in Ferroelectric P(VDF-TrFE) Thin Films

2020 ◽  
Vol 77 (1) ◽  
pp. 78-81
Author(s):  
Seonhyoung Kim ◽  
Yukwang Kim ◽  
Kwang-Won Park ◽  
Jongin Hong ◽  
Byung-Hyuk Jun
Keyword(s):  
Thin Films ◽  
Retention Loss

Retention characteristics of Pb(Zr, Ti)O3 films deposited by various methods for high-density non-volatile memory

2002 ◽  
Vol 748 ◽  
Author(s):  
Sangmin Shin ◽  
Mirko Hofmann ◽  
Yong Kyun Lee ◽  
Choong Rae Cho ◽  
June Key Lee ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor ◽  
Passive Layer ◽  
High Density ◽  
Organic Chemical ◽  
Interfacial Layers ◽  
Retention Loss ◽  
Non Volatile Memory ◽  
Retention Characteristics ◽  
Volatile Memory

ABSTRACTRetention loss is a significant issue for an application of ferroelectric thin films to high-density non-volatile memory devices. We investigated the polarization retention characteristics of ferroelectric Pb(Zr,Ti)O3 (PZT) thin films which were fabricated on Pt/IrO2/Ir substrates by different deposition methods. In thermally-accelerated retention failure tests, Pb(Zr,Ti)O3 (PZT) films which were prepared by a chmeical solution deposition (CSD) method showed rapid decay of retained polarization charges as the films became thinner down to 1000 Å, while the films which were grown by metal organic chemical vapor deposition (MOCVD) showed relatively large nonvolatile charges at the same thickness. We concluded that in the CSD-grown films, the relatively large interfacial passive layer compared with the MOCVD-grown films had an unfavorable effect on retention behavior. We observed the existence of such interfacial layers by extrapolation of the total capacitance with thickness of the films and the capacitance of this layer was larger in MOCVD-grown films. It means that the possibility of the accumulation of space charges at the interface was reduced, so that less imprint and less retention loss could be observed in the MOCVD-grown films.

Nanoscale Properties of SrBi2Ta2O9 Thin Films

2000 ◽  
Vol 655 ◽  
Author(s):  
A. Gruverman ◽  
C. Isobe ◽  
M. Tanaka
Keyword(s):  
Thin Films ◽  
Conduction Mechanism ◽  
Dielectric Breakdown ◽  
Scanning Force Microscopy ◽  
Time Intervals ◽  
Force Microscopy ◽  
Retention Loss ◽  
Scanning Force ◽  
Local Polarization ◽  
First Time

AbstractPiezoresponse scanning force microscopy (PFM) was applied to study the nanoscale mechanism of retention loss in SrBi2Ta2O9 (SBT) thin films. Experiments were conducted by performing local polarization reversal within an individual grain with subsequent imaging of a resulting domain structure at different time intervals. The retention behavior of the films was studied as a function of switching conditions and electrode material. SFM was also used for nanoscale mapping of leakage current sites and investigation of electrical conduction mechanism at these sites. For the first time, the development of dielectric breakdown in SBT films was directly observed at nanoscale.

scholarly journals Nanoscale Investigation of Polarization Retention Loss in Ferroelectric Thin Films VIA Scanning Force Microscopy

1997 ◽  
Vol 493 ◽  
Author(s):  
A. Gruverman ◽  
S. A. Prakash ◽  
S. Aggarwal ◽  
R. Ramesh ◽  
O. Auciello ◽  
...  
Keyword(s):  
Thin Films ◽  
Domain Switching ◽  
Scanning Force Microscopy ◽  
Ferroelectric Thin Films ◽  
Time Intervals ◽  
Force Microscopy ◽  
Retention Loss ◽  
Scanning Force ◽  
Local Polarization ◽  
Polarization Retention

ABSTRACTScanning force microscopy (SFM) was applied to direct nanoscale investigation of the mechanism of retention loss in ferroelectric thin films. Experiments were conducted by performing local polarization reversal within an individual grain with subsequent imaging of a resulting domain structure at various time intervals. A conductive SFM tip was used for domain switching and imaging in the SFM piezoresponse mode.

Characterization of Retention Phenomena of Micron-Size Electrical Domains in Pzt Thin Films

1999 ◽  
Vol 574 ◽  
Author(s):  
Seungbum Hong ◽  
Hyunjung Shin ◽  
Y. Eugene Pak ◽  
Kwangsoo No
Keyword(s):  
Thin Films ◽  
Unit Area ◽  
Relaxation Times ◽  
Local Variation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Retention Loss ◽  
Micron Size ◽  
Retention Characteristics ◽  
Lock In

AbstractThe retention phenomena of purposely aligned micron-size domains (defined as “bits”) in Pb(Zr,Ti)O3 thin films were characterized by atomic force microscopy (AFM) combined with a lock-in amplifier. It is found that the retention loss occurs by “region by region” showing local variation of the rate of the loss. Furthermore, the total retention loss can be successfully described by an extended exponential decay, which implies a narrow distribution of the relaxation times of the domains. This probably comes from the fact that the micron-size bits consist a few hundreds of domains. Along with the characterization, the effects of the bit size and the poling time per unit area on the retention characteristics were investigated. Based on our observations, it is concluded that the retention time is proportional to both the poling time per unit area and the bit size. This trend is successfully explained by a kinetic model developed by our group.

The study of interfacial reactions of nickel thin films on GaAs

1983 ◽  
Vol 41 ◽  
pp. 156-157
Author(s):  
L.J. Chen ◽  
Y.F. Hsieh
Keyword(s):  
Thin Films ◽  
Integrated Circuits ◽  
Interfacial Reactions ◽  
Metal Contacts ◽  
Nickel Thin Films ◽  
Thin Foils ◽  
The Status ◽  
Si Doped ◽  
Electron Microscopes

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.

Studies on Water in the Hydration Chamber of a Modified Electron Microscope

1970 ◽  
Vol 28 ◽  
pp. 544-545
Author(s):  
R. C. Moretz ◽  
G. G. Hausner ◽  
D. F. Parsons
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Microscope ◽  
Steady State ◽  
Room Temperature ◽  
Small Mass ◽  
Equilibrium Pressure ◽  
Biological Objects ◽  
Mechanical Pump ◽  
Differential Pumping

Use of the electron microscope to examine wet objects is possible due to the small mass thickness of the equilibrium pressure of water vapor at room temperature. Previous attempts to examine hydrated biological objects and water itself used a chamber consisting of two small apertures sealed by two thin films. Extensive work in our laboratory showed that such films have an 80% failure rate when wet. Using the principle of differential pumping of the microscope column, we can use open apertures in place of thin film windows.Fig. 1 shows the modified Siemens la specimen chamber with the connections to the water supply and the auxiliary pumping station. A mechanical pump is connected to the vapor supply via a 100μ aperture to maintain steady-state conditions.

Nucleation and Early Growth of Sputtered thin Films

1970 ◽  
Vol 28 ◽  
pp. 516-517
Author(s):  
Dudley M. Sherman ◽  
Thos. E. Hutchinson
Keyword(s):  
Thin Films ◽  
Electron Beam ◽  
Ion Beam ◽  
Ion Source ◽  
Water Cooling ◽  
Stages Of Growth ◽  
Lens Assembly ◽  
Microscope Technique ◽  
Ion Beam Sputter Deposition

The in situ electron microscope technique has been shown to be a powerful method for investigating the nucleation and growth of thin films formed by vacuum vapor deposition. The nucleation and early stages of growth of metal deposits formed by ion beam sputter-deposition are now being studied by the in situ technique.A duoplasmatron ion source and lens assembly has been attached to one side of the universal chamber of an RCA EMU-4 microscope and a sputtering target inserted into the chamber from the opposite side. The material to be deposited, in disc form, is bonded to the end of an electrically isolated copper rod that has provisions for target water cooling. The ion beam is normal to the microscope electron beam and the target is placed adjacent to the electron beam above the specimen hot stage, as shown in Figure 1.

Macromolecular structures of biological specimens are not obscured by controlled osmium impregnation

1983 ◽  
Vol 41 ◽  
pp. 606-607
Author(s):  
Klaus-Ruediger Peters ◽  
Samuel A. Green
Keyword(s):  
Thin Films ◽  
Electrical Conductivity ◽  
Critical Point ◽  
Metal Films ◽  
High Magnification ◽  
Osmium Impregnation ◽  
Instrumental Resolution ◽  
20 Nm ◽  
Continuous Metal

High magnification imaging of macromolecules on metal coated biological specimens is limited only by wet preparation procedures since recently obtained instrumental resolution allows visualization of topographic structures as smal l as 1-2 nm. Details of such dimensions may be visualized if continuous metal films with a thickness of 2 nm or less are applied. Such thin films give sufficient contrast in TEM as well as in SEM (SE-I image mode). The requisite increase in electrical conductivity for SEM of biological specimens is achieved through the use of ligand mediated wet osmiuum impregnation of the specimen before critical point (CP) drying. A commonly used ligand is thiocarbohvdrazide (TCH), first introduced to TEM for en block staining of lipids and glvcomacromolecules with osmium black. Now TCH is also used for SEM. However, after ligand mediated osinification nonspecific osmium black precipitates were often found obscuring surface details with large diffuse aggregates or with dense particular deposits, 2-20 nm in size. Thus, only low magnification work was considered possible after TCH appl ication.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Sign in / Sign up

Export Citation Format

Share Document