Origin of the Strain Sensitivity for an Organic Heptazole Thin-Film and Its Strain Gauge Application

2018 ◽  
Vol 72 (8) ◽  
pp. 911-914
Author(s):  
Heesun Bae ◽  
Pyo Jin Jeon ◽  
Ji Hoon Park ◽  
Kimoon Lee
Author(s):  
Peng Lei ◽  
Congchun Zhang ◽  
Yawen Pang ◽  
Shenyong Yang ◽  
Meiju Zhang

1973 ◽  
Vol 61 (1) ◽  
pp. 129-130 ◽  
Author(s):  
F.C. Luo ◽  
M. Epstein
Keyword(s):  

2021 ◽  
Vol 516 ◽  
pp. 230669
Author(s):  
Shengxin Zhu ◽  
Le Yang ◽  
Jiawei Wen ◽  
Xiaolong Feng ◽  
Peijun Zhou ◽  
...  

Author(s):  
Liqiang Gong ◽  
Harutoshi Takahashi ◽  
Takashi Abe ◽  
Kensuke Kanda ◽  
Masayuki Sohgawa

Sensors ◽  
2020 ◽  
Vol 20 (12) ◽  
pp. 3579 ◽  
Author(s):  
Rico Tiedemann ◽  
Dennis Lepke ◽  
Martin Fischer ◽  
Christoph Pille ◽  
Matthias Busse ◽  
...  

There is currently a large demand for aluminum components to measure the mechanical and thermal loads to which they are subjected. With structural health monitoring, components in planes, vehicles, or bridges can monitor critical loads and potentially prevent an impending fatigue failure. Externally attached sensors need a structural model to obtain knowledge of the mechanical load at the point of interest, whereas embedded sensors can be used for direct measurement at the point of interest. To produce an embedded sensor, which is automatically encapsulated against environmental influence, the sensor must be able to withstand the boundary conditions of the host component’s manufacturing process. This embedding process is particularly demanding in the case of casting. Previous work showed that silicon-based sensors have a high failure rate when embedded in cast aluminum parts and that using aluminum as a substrate is preferable under these circumstances. In the present paper, we present the fabrication process for the combination of a thick-film insulation and a thin-film strain gauge sensor, on such an aluminum substrate. The sensor is capable of withstanding high temperatures of at least 600 °C for over 20 min and a subsequent embedding in a gravity die casting process.


Author(s):  
Arindom Datta ◽  
Hongseok Choi ◽  
Xiaochun Li

Effective monitoring and diagnosis of manufacturing processes is of importance in reducing operation costs, improving product quality, and reducing process time. If conditions of manufacturing tools are continuously monitored, problems can be detected and solved during the processing cycle, resulting in less tool damage, higher productivity, and less energy consumption. In-situ monitoring of the basic operating conditions (e.g. temperature and strain) of certain mechanical tools and components can be accomplished by placing microsensors in some critical locations. Thin film microsensors (e.g. thermocouple, strain gauge) have drawn considerable attention recently due to their small size, fast response and lower cost [1]. Since most tools and components in manufacturing process are metallic, metal embedded thin film microsensors are very attractive. A new batch fabrication technique based on electroplating and wet chemical etching of silicon has been developed. Microsensors were directly fabricated on an etch stop layer grown on silicon wafer. A multilayer dielectric is deposited to insulate sensor areas followed by seed layer deposition, and electroplating a thicker metal layer. After silicon wafer is etched out, the microsensors are transferred from silicon to electroplated metal substrate directly. After plasma etching of the etch stop layer, these sensors can be further embedded into another electroplated metal layer from the top after insulation by dielectric multilayer. Metal embedded strain gauge array was fabricated successfully. Thin film Ni/Cr strain gauges were fabricated on LPCVD silicon nitride layer grown on a 3-inch silicon wafer. Each strain gauge unit was insulated by Al2O3/PECVD SixNy/Al2O3 multilayer before seed layer deposition and electroplating a thick nickel layer on whole wafer. Si wafer was then etched out in KOH solution to transfer all microsensors to electroplated nickel layer. LPCVD nitride layer covering the sensors was dry etched and same multilayer dielectric was selectively deposited over the sensors except pad areas. These microsensors were finally embedded into another electroplated nickel layer leaving the pads uncovered for external connection. This process offers a novel way to realize batch production of metal embedded microsensors for use in hostile manufacturing environment.


1990 ◽  
Vol 24 (1) ◽  
pp. 35-39 ◽  
Author(s):  
K. Rajanna ◽  
S. Mohan ◽  
M.M. Nayak ◽  
N. Gunasekaran

2014 ◽  
Vol 24 (28) ◽  
pp. 4413-4419 ◽  
Author(s):  
Seung Hee Nam ◽  
Pyo Jin Jeon ◽  
Sung Wook Min ◽  
Young Tack Lee ◽  
Eun Young Park ◽  
...  

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