scholarly journals Parasitics Impact on the Performance of Rectifier Circuits in Sensing RF Energy Harvesting

Sensors ◽  
2019 ◽  
Vol 19 (22) ◽  
pp. 4939 ◽  
Author(s):  
Antonio Alex-Amor ◽  
Javier Moreno-Núñez ◽  
José M. Fernández-González ◽  
Pablo Padilla ◽  
Jaime Esteban
Keyword(s):  
Energy Harvesting ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Rf Energy Harvesting ◽  
Printed Circuit ◽  
Sensing Systems ◽  
Half Wave ◽  
Via Holes ◽  
Rf Energy ◽  
Rectifier Circuits

This work presents some accurate guidelines for the design of rectifier circuits in radiofrequency (RF) energy harvesting. New light is shed on the design process, paying special attention to the nonlinearity of the circuits and the modeling of the parasitic elements. Two different configurations are tested: a Cockcroft–Walton multiplier and a half-wave rectifier. Several combinations of diodes, capacitors, inductors and loads were studied. Furthermore, the parasitics that are part of the circuits were modeled. Thus, the most harmful parasitics were identified and studied in depth in order to improve the conversion efficiency and enhance the performance of self-sustaining sensing systems. The experimental results show that the parasitics associated with the diode package and the via holes in the PCB (Printed Circuit Board) can leave the circuits inoperative. As an example, the rectifier efficiency is below 5% without considering the influence of the parasitics. On the other hand, it increases to over 30% in both circuits after considering them, twice the value of typical passive rectifiers.

Investigation of Compact Tree-Shaped Coplanar Waveguide (CPW) Antenna for RF Energy Harvesting

2014 ◽  
Vol 699 ◽  
pp. 903-908
Author(s):  
Zahriladha Zakaria ◽  
Nur Aishah Zainuddin ◽  
Mohd Nor Husain ◽  
Mohamad Zoinol Abidin Abd Aziz ◽  
Mohamad Ariffin Mutalib
Keyword(s):  
Energy Harvesting ◽  
Return Loss ◽  
Printed Circuit Board ◽  
Coplanar Waveguide ◽  
Green Technology ◽  
Circuit Board ◽  
Early Investigation ◽  
Etching Technique ◽  
Rf Energy Harvesting ◽  
Rf Energy

This paper studies a compact wideband tree-shaped coplanar antenna which has the potential to be used for RF energy harvesting. The antenna is fabricated on a double-sided FR-4 printed circuit board using an etching technique. The effect of semi-circle patch embedded to a triangular patch has been studied. The comparison between simulation and measurement results for the return loss and radiation patterns are observed and are in good agreement. The measured return loss is in line with the simulation response where both manage to achieve lower than-10dB. A bandwidth of 3.64 GHz and 3.94 GHz were obtained in simulation and measurement process respectively. This study is an early investigation in designing the antenna for RF energy harvesting system to support green technology and sustainable development particularly for Wireless Sensor Network (WSN).

Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet

2005 ◽  
Vol 2 (3) ◽  
pp. 189-196 ◽  
Author(s):  
Yasushi Sawada ◽  
Keiichi Yamazaki ◽  
Noriyuki Taguchi ◽  
Tetsuji Shibata
Keyword(s):  
Atmospheric Pressure ◽  
Printed Circuit Board ◽  
Formation Rate ◽  
Plasma Processing ◽  
Atmospheric Pressure Plasma ◽  
Plasma Jet ◽  
Circuit Board ◽  
Bottom Surface ◽  
Printed Circuit ◽  
Via Holes

The effectiveness of atmospheric pressure (AP) plasma preprocessing before Ni/Au or Cu plating has been examined by applying it to a build-up printed circuit board (FR-4 grade) and polyimide-based flexible circuit film, both with blind via-holes (BVHs). The AP plasma applied with a dielectric barrier discharge is generated inside a 56 mm wide quartz vessel by an RF power generator using Ar-O2 gas mixture. One side of the vessel is open and the plasma jet is blown on the sample substrate transported 5 mm downward from the outlet of the vessel. The deposit failure rate of Ni/Au electroless deposit to 50 μm-diameter BVHs formed on a photo resist on the printed circuit board is 12.5% without preprocessing but is decreased to 0% after applying the AP plasma processing. As for 50 μm-diameter BVHs formed with a YAG laser on a polyimide-based flexible circuit film, the bump formation using electrolytic copper plating fails without preprocessing, but a 100% bump formation rate is achieved after applying AP plasma processing. It is presumed that the AP plasma processing improves the wetting property of the BVH walls and allows the plating solution to uniformly cover the entire wall surfaces without generating bubbles. The removal of organic substances attached to the BVH bottom surface also helps to improve the adherence of metal plating.

404 Modeling Method of the Printed Circuit Board with Some Kind of Arrangements of Thermal Via Holes

2010 ◽  
Vol 2010.47 (0) ◽  
pp. 129-130
Author(s):  
Sadakazu TAKAKUWA ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA ◽  
Tomoyuki HATAKEYAMA
Keyword(s):  
Printed Circuit Board ◽  
Modeling Method ◽  
Circuit Board ◽  
Printed Circuit ◽  
Via Holes

scholarly journals Development of Op-Amp Based Piezoelectric Rectifier for Low Power Energy Harvesting Applications

2018 ◽  
Vol 150 ◽  
pp. 01012
Author(s):  
Muhamad Syazmie Bin Sepeeh ◽  
Farahiyah Binti Mustafa ◽  
Anis Maisarah Binti Mohd Asry ◽  
Sy Yi Sim ◽  
Mastura Shafinaz Binti Zainal Abidin
Keyword(s):  
Energy Harvesting ◽  
Printed Circuit Board ◽  
Input Voltage ◽  
Circuit Board ◽  
Op Amp ◽  
Full Wave ◽  
Piezoelectric Energy ◽  
Half Wave ◽  
Future Work ◽  
Piezoelectric Devices

In this study, the development of operational amplifier (op-amp) based rectifier for piezoelectric energy harvesting applications was studied. The two stage op-amp full wave rectifier was used to convert the AC signal to DC signal voltage received by piezoelectric devices. The inverted half wave rectifier integrated with full wave rectifier were designed and simulated using MultiSIM software. The circuit was then fabricated onto a printed circuit board (PCB), using standard fabrication process. The achievement of this rectifier was able to boost up the maximum voltage of 5 V for input voltage of 800 mV. The output of the rectifier was in DC signal after the rectification by the op-amp. In term of power, the power dissipation was reduced consequently the waste power decreases. Future work includes optimization of the rectifying circuit to operate more efficiently can be made to increase the efficiency of the devices.

scholarly journals Extracting PCB components based on color distribution of highlight areas

2010 ◽  
Vol 7 (1) ◽  
pp. 13-30 ◽  
Author(s):  
Zhou Zeng ◽  
Zhuang Li ◽  
Zuoyong Zheng
Keyword(s):  
Solder Joint ◽  
Protective Coating ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Color Distribution ◽  
Printed Circuit ◽  
Distribution Features ◽  
Via Holes ◽  
Two Stages

This paper investigates methodologies for locating and identifying the components on a printed circuit board (PCB) used for surface mount device inspection. The proposed scheme consists of two stages: solder joint extraction and protective coating extraction. Solder joints are extracted by first detecting all the highlight areas, and then recognizing and removing the invalid highlight areas which are mainly markings and via-holes. We sum up three color distribution features. And the invalid highlight areas are recognized and removed by comparing the features of the target objects and the reference objects. The sequence of color distribution as a new clue has been applied to clustering solder joints. Each protective coating is extracted by the positions of the clustered solder joints. Experimental results show that the proposed method can extract most of components effectively.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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