scholarly journals State-of-the-Art and Practical Guide to Ultrasonic Transducers for Harsh Environments Including Temperatures above 2120 °F (1000 °C) and Neutron Flux above 1013 n/cm2

Sensors ◽  
2019 ◽  
Vol 19 (21) ◽  
pp. 4755 ◽  
Author(s):  
Tittmann ◽  
Batista ◽  
Trivedi ◽  
Lissenden III ◽  
Reinhardt

In field applications currently used for health monitoring and nondestructive testing, ultrasonic transducers primarily employ PZT5-H as the piezoelectric element for ultrasound transmission and detection. This material has a Curie–Weiss temperature that limits its use to about 210 °C. Some industrial applications require much higher temperatures, i.e., 1000–1200 °C and possible nuclear radiation up to 1020 n/cm2 when performance is required in a reactor environment. The goal of this paper is the survey and review of piezoelectric elements for use in harsh environments for the ultimate purpose for structural health monitoring (SHM), non-destructive evaluation (NDE) and material characterization (NDMC). The survey comprises the following categories: 1. High-temperature applications with single crystals, thick-film ceramics, and composite ceramics, 2. Radiation-tolerant materials, and 3. Spray-on transducers for harsh-environment applications. In each category the known characteristics are listed, and examples are given of performance in harsh environments. Highlighting some examples, the performance of single-crystal lithium niobate wafers is demonstrated up to 1100 °C. The wafers with the C-direction normal to the wafer plane were mounted on steel cylinders with high-temperature Sauereisen and silver paste wire mountings and tested in air. In another example, the practical use in harsh radiation environments aluminum nitride (AlN) was found to be a good candidate operating well in two different nuclear reactors. The radiation hardness of AlN was evident from the unaltered piezoelectric coefficient after a fast and thermal neutron exposure in a nuclear reactor core (thermal flux = 2.12 × 1013 ncm−2; fast flux 2 (>1.0 MeV) = 4.05 × 1013 ncm−2; gamma dose rate: 1 × 109 r/h; temperature: 400–500 °C). Additionally, some of the high-temperature transducers are shown to be capable of mounting without requiring coupling material. Pulse-echo signal amplitudes (peak-to-peak) for the first two reflections as a function of the temperature for lithium niobate thick-film, spray-on transducers were observed to temperatures of about 900 °C. Guided-wave send-and-receive operation in the 2–4 MHz range was demonstrated on 2–3 mm thick Aluminum (6061) structures for possible field deployable applications where standard ultrasonic coupling media do not survive because of the harsh environment. This approach would benefit steam generators and steam pipes where temperatures are above 210 °C. In summary, there are several promising approaches to ultrasonic transducers for harsh environments and this paper presents a survey based on literature searches and in-house laboratory observations.

Instruments ◽  
2018 ◽  
Vol 3 (1) ◽  
pp. 2 ◽  
Author(s):  
Christopher Bosyj ◽  
Neelesh Bhadwal ◽  
Thomas Coyle ◽  
Anthony Sinclair

Long-term installation of ultrasonic transducers in high temperature environments allows for continuous monitoring of critical components and processes without the need to halt industrial operations. Transducer designs based on the high-Curie-point piezoelectric material lithium niobate have been shown to both be effective and stable at extreme temperatures for long-term installation. In this study, several brazing techniques are evaluated, all of which aim to provide both mechanical bonding and acoustic coupling directly to a bare lithium niobate piezoelectric element. Two brazing materials—a novel silver-copper braze applied in a reactive air environment and an aluminum-based braze applied in a vacuum environment—are found to be suitable for ultrasound transmission at elevated temperatures. Reliable wide-bandwidth and low-noise ultrasound transmission is achieved between room temperature and 800 °C.


2018 ◽  
Vol 6 (32) ◽  
pp. 8613-8617 ◽  
Author(s):  
Tuan-Khoa Nguyen ◽  
Hoang-Phuong Phan ◽  
Toan Dinh ◽  
Abu Riduan Md Foisal ◽  
Nam-Trung Nguyen ◽  
...  

4H-silicon carbide based sensors are promising candidates for replacing prevalent silicon-based counterparts in harsh environments owing to their superior chemical inertness, high stability and reliability.


Sensors ◽  
2020 ◽  
Vol 20 (24) ◽  
pp. 7067
Author(s):  
Jia-Hao He ◽  
Ding-Peng Liu ◽  
Cheng-Hsien Chung ◽  
Hsin-Haou Huang

In this study, infrared thermography is used for vibration-based structural health monitoring (SHM). Heat sources are employed as sensors. An acrylic frame structure was experimentally investigated using the heat sources as structural marker points to record the vibration response. The effectiveness of the infrared thermography measurement system was verified by comparing the results obtained using an infrared thermal imager with those obtained using accelerometers. The average error in natural frequency was between only 0.64% and 3.84%. To guarantee the applicability of the system, this study employed the mode shape curvature method to locate damage on a structure under harsh environments, for instance, in dark, hindered, and hazy conditions. Moreover, we propose the mode shape recombination method (MSRM) to realize large-scale structural measurement. The partial mode shapes of the 3D frame structure are combined using the MSRM to obtain the entire mode shape with a satisfactory model assurance criterion. Experimental results confirmed the feasibility of using heat sources as sensors and indicated that the proposed methods are suitable for overcoming the numerous inherent limitations associated with SHM in harsh or remote environments as well as the limitations associated with the SHM of large-scale structures.


2018 ◽  
Vol 170 ◽  
pp. 04008
Author(s):  
O. Gatsa ◽  
P. Combette ◽  
E. Rozenkrantz ◽  
D. Fourmentel ◽  
C. Destouches ◽  
...  

In the contemporary world, the measurements in hostile environment is one of the predominant necessity for automotive, aerospace, metallurgy and nuclear plant. The measurement of different parameters in experimental reactors is an important point in nuclear power strategy. In the near past, IES (Institut d’Électronique et des Systèmes) on collaboration with CEA (Commissariat à l’Energie Atomique et aux Energies Alternatives) have developed the first ultrasonic sensor for the application of gas quantity determination that has been tested in a Materials Testing Reactor (MTR). Modern requirements state to labor with the materials that possess stability on its parameters around 350°C in operation temperature. Previous work on PZT components elaboration by screen printing method established the new basis in thick film fabrication and characterization in our laboratory. Our trials on Bismuth Titanate ceramics showed the difficulties related to high electrical conductivity of fabricated samples that postponed further research on this material. Among piezoceramics, the requirements on finding an alternative solution on ceramics that might be easily polarized and fabricated by screen printing approach were resolved by the fabrication of thick film from Sodium Bismuth Titanate (NBT) piezoelectric powder. This material exhibits high Curie temperature, relatively good piezoelectric and coupling coefficients, and it stands to be a good solution for the anticipated application. In this paper, we present NBT thick film fabrication by screen printing, characterization of piezoelectric, dielectric properties and material parameters studies in dependence of temperature. Relatively high resistivity in the range of 1.1013 Ohm.cm for fabricated thick film is explained by Aurivillius structure in which a-and b-layers form perovskite structure between oxides of c-layer. Main results of this study are presented and discussed in terms of feasibility for an application to a new sensor device operating at high temperature level (400°). Piezoelectric parameters enhancement and loss reduction at elevated temperatures are envisaged to be optimized. Further sensor development and test in MTR are expected to be realized in the near future.


Author(s):  
Huan Jin ◽  
Wu Yu ◽  
Feng Long ◽  
Min Yu ◽  
Qiyang Han ◽  
...  

The design and R&D for ITER In-Vessel Coils (IVCs) is being deployed. The concerned issue of “Edge Localized Modes” (ELMs) and “Vertical Stabilization” (VS) of the ITER plasma can be addressed by the implemented IVCs. The ELM and VS coils will be installed in the vessel just behind the blanket shield modules to reach the requirement of keeping strong coupling with the plasma. The 59mm Stainless Steel Jacketed Mineral Insulated Conductor (SSMIC) using MgO as the insulation is being designed for the IVCs to resist the special challenges, including the nuclear radiation, high temperature, electromagnetic and thermal fatigue. It is necessary to take the mechanical performances of the SSMIC and the feasibility of fabrication techniques into consideration of the R&D program. The mechanical performances of the SSMIC close to the actual work conditions, including the three point bend modulus, three point bend cyclical performance and the cyclical performance with a U-bend sample of the SSMIC prototypes have been investigated and the results are presented in this paper.


Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano

A novel two-port thermal flux method is implemented for degassing a microscale loop heat pipe (mLHP) and charging it with a working fluid. The mLHP is fabricated on a silicon wafer using standard MEMS micro-fabrication techniques, and capped by a Pyrex wafer, using anodic bonding. For these devices, small volumes and large capillary forces render conventional vacuum pump-based methods quite impractical. Instead, we employ thermally generated pressure gradients to purge non-condensible gases from the device, by vapor convection. Three different, high-temperature-compatible, MEMS device packaging techniques have been studied and implemented, in order to evaluate their effectiveness and reliability. The first approach uses O-rings in a mechanically sealed plastic package. The second approach uses an aluminum double compression fitting assembly for alignment, and soldering for establishing the chip-to-tube interconnects. The third approach uses a high temperature epoxy to hermetically embed the device in a machined plastic base package. Using water as the working fluid, degassing and filling experiments are conducted to verify the effectiveness of the thermal flux method.


2021 ◽  
Author(s):  
Kohei Hirakawa ◽  
Makie Hidaka ◽  
Naoki Kambayashi ◽  
Makiko Kobayashi

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