scholarly journals A VCII-Based Stray Insensitive Analog Interface for Differential Capacitance Sensors

Sensors ◽  
2019 ◽  
Vol 19 (16) ◽  
pp. 3545 ◽  
Author(s):  
Gianluca Barile ◽  
Leila Safari ◽  
Giuseppe Ferri ◽  
Vincenzo Stornelli
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Supply Voltage ◽  
Cmos Technology ◽  
Differential Capacitance ◽  
Discrete Version ◽  
Capacitive Sensors ◽  
Active Devices ◽  
Novel Approach ◽  
Circuit Fabrication

In this paper, a novel approach to implement a stray insensitive CMOS interface for differential capacitive sensors is presented. The proposed circuit employs, for the first time, second-generation voltage conveyors (VCIIs) and produces an output voltage proportional to differential capacitor changes. Using VCIIs as active devices inherently allows the circuit to process the signal in the current domain, and hence, to benefit from its intrinsic advantages, such as high speed and simple implementation, while still being able to natively interface with voltage mode signal processing stages at necessity. The insensitiveness to the effects of parasitic capacitances is achieved through a simple feedback loop. In addition, the proposed circuit shows a very simple and switch-free structure (which can be used for both linear and hyperbolic sensors), improving its accuracy. The readout circuit was designed in a standard 0.35 μm CMOS technology under a supply voltage of ±1.65 V. Before the integrated circuit fabrication, to produce tangible proof of the effectiveness of the proposed architecture, a discrete version of the circuit was also prototyped using AD844 and LF411 to implement a discrete VCII. The achieved measurement results are in good agreement with theory and simulations, showing a constant sensitivity up to 412 mV/pF, a maximum linearity error of 1.9%FS, and acknowledging a good behavior with low baseline capacitive sensors (10 pF in the proposed measurements). A final table is also given to summarize the key specs of the proposed work comparing them to the available literature.

scholarly journals Investigation of PVT-Aware STT-MRAM Sensing Circuits for Low-VDD Scenario

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 551
Author(s):  
Zhongjian Bian ◽  
Xiaofeng Hong ◽  
Yanan Guo ◽  
Lirida Naviner ◽  
Wei Ge ◽  
...  
Keyword(s):  
Nonvolatile Memory ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor

Spintronic based embedded magnetic random access memory (eMRAM) is becoming a foundry validated solution for the next-generation nonvolatile memory applications. The hybrid complementary metal-oxide-semiconductor (CMOS)/magnetic tunnel junction (MTJ) integration has been selected as a proper candidate for energy harvesting, area-constraint and energy-efficiency Internet of Things (IoT) systems-on-chips. Multi-VDD (low supply voltage) techniques were adopted to minimize energy dissipation in MRAM, at the cost of reduced writing/sensing speed and margin. Meanwhile, yield can be severely affected due to variations in process parameters. In this work, we conduct a thorough analysis of MRAM sensing margin and yield. We propose a current-mode sensing amplifier (CSA) named 1D high-sensing 1D margin, high 1D speed and 1D stability (HMSS-SA) with reconfigured reference path and pre-charge transistor. Process-voltage-temperature (PVT) aware analysis is performed based on an MTJ compact model and an industrial 28 nm CMOS technology, explicitly considering low-voltage (0.7 V), low tunneling magnetoresistance (TMR) (50%) and high temperature (85 °C) scenario as the worst sensing case. A case study takes a brief look at sensing circuits, which is applied to in-memory bit-wise computing. Simulation results indicate that the proposed high-sensing margin, high speed and stability sensing-sensing amplifier (HMSS-SA) achieves remarkable performance up to 2.5 GHz sensing frequency. At 0.65 V supply voltage, it can achieve 1 GHz operation frequency with only 0.3% failure rate.

A LOW POWER CRYOGENIC CMOS ROIC DESIGN FOR 512 × 512 IRFPA

2013 ◽  
Vol 22 (10) ◽  
pp. 1340033 ◽  
Author(s):  
HONGLIANG ZHAO ◽  
YIQIANG ZHAO ◽  
YIWEI SONG ◽  
JUN LIAO ◽  
JUNFENG GENG
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Supply Voltage ◽  
Cmos Technology ◽  
High Gain ◽  
Readout Integrated Circuit ◽  
Chip Area ◽  
Operating Modes

A low power readout integrated circuit (ROIC) for 512 × 512 cooled infrared focal plane array (IRFPA) is presented. A capacitive trans-impedance amplifier (CTIA) with high gain cascode amplifier and inherent correlated double sampling (CDS) configuration is employed to achieve a high performance readout interface for the IRFPA with a pixel size of 30 × 30 μm2. By optimizing column readout timing and using two operating modes in column amplifiers, the power consumption is significantly reduced. The readout chip is implemented in a standard 0.35 μm 2P4M CMOS technology. The measurement results show the proposed ROIC achieves a readout rate of 10 MHz with 70 mW power consumption under 3.3 V supply voltage from 77 K to 150 K operating temperature. And it occupies a chip area of 18.4 × 17.5 mm2.

Integrated Optoelectronic Devices on Silicon

2012 ◽  
Vol 1396 ◽  
Author(s):  
Di Liang ◽  
John E. Bowers
Keyword(s):  
Output Power ◽  
Integrated Circuit ◽  
High Speed ◽  
High Performance ◽  
Continuous Wave ◽  
Light Emission ◽  
Extinction Ratio ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Pockels Effect

ABSTRACTSilicon (Si) has been the dominating material platform of microelectronics over half century. Continuous technological advances in circuit design and manufacturing enable complementary metal-oxide semiconductor (CMOS) chips with increasingly high integration complexity to be fabricated in an unprecedently scale and economical manner. Conventional Si-based planar lightwave circuits (PLCs) has benefited from advanced CMOS technology but only demonstrate passive functionalities in most circumstances due to poor light emission efficiency and weak major electro-optic effects (e.g., Pockels effect, the Kerr effect and the Franz–Keldysh effect) in Si. Recently, a new hybrid III-V-on-Si integration platform has been developed, aiming to bridge the gap between Si and III-V direct-bandgap materials for active Si photonic integrated circuit applications. Since then high-performance lasers, amplifiers, photodetectors and modulators, etc. have been demonstrated. Here we review the most recent progress on hybrid Si lasers and high-speed hybrid Si modulators. The former include distributed feedback (DFB) lasers showing over 10 mW output power and up to 85 oC continuous-wave (cw) operation, compact hybrid microring lasers with cw threshold less than 4 mA and over 3 mW output power, and 4-channel hybrid Si AWG lasers with channel space of 360 GHz. Recently fabricated traveling-wave electro-absorption modulators (EAMs) and Mach-Zehnder interferometer modulators (MZM) on this platform support 50 Gb/s and 40 Gb/s data transmission with over 10 dB extinction ratio, respectively.

A New Technique for Designing Low-Power High-Speed Domino Logic Circuits in FinFET Technology

2019 ◽  
Vol 28 (10) ◽  
pp. 1950165 ◽  
Author(s):  
Sandeep Garg ◽  
Tarun K. Gupta
Keyword(s):  
Low Power ◽  
High Speed ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Power Reduction ◽  
Maximum Power ◽  
Oxide Semiconductor ◽  
Domino Logic ◽  
Maximum Delay

In this paper, a fin field-effect transistor (FinFET)-based domino technique dynamic node-driven feedback transistor domino logic (DNDFTDL) is designed for low-power, high-speed and improved noise performance. In the proposed domino technique, the concept of current division is explored below the evaluation network for enhancement of performance parameters. Simulations are carried out for 32-nm complementary metal–oxide–semiconductor (CMOS) and FinFET node using HSPICE for 2-, 4-, 8- and 16-input OR gates with a DC supply voltage of 0.9[Formula: see text]V. Proposed technique shows a maximum power reduction of 73.93% in FinFET short-gate (SG) mode as compared to conditional stacked keeper domino logic (CSKDL) technique and a maximum power reduction of 72.12% as compared to modified high-speed clocked delay domino logic (M-HSCD) technique in FinFET low-power (LP) mode. The proposed technique shows a maximum delay reduction of 35.52% as compared to voltage comparison domino (VCD) technique in SG mode and a reduction of 25.01% as compared to current mirror footed domino logic (CMFD) technique in LP mode. The unity noise gain (UNG) of the proposed circuit is 1.72–[Formula: see text] higher compared to different existing techniques in FinFET SG mode and is 1.42–[Formula: see text] higher in FinFET LP mode. The Figure of Merit (FOM) of the proposed circuit is up to [Formula: see text] higher as compared to existing domino logic techniques because of lower values of power, delay and area and higher values of UNG of the proposed circuit. In addition, the proposed technique shows a maximum power reduction of up to 68.64% in FinFET technology as compared to its counterpart in CMOS technology.

scholarly journals Low-Power High-Speed Double Gate 1-bit Full Adder Cell

2016 ◽  
Vol 62 (4) ◽  
pp. 329-334 ◽  
Author(s):  
Raushan Kumar ◽  
Sahadev Roy ◽  
C.T. Bhunia
Keyword(s):  
Power Consumption ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Average Power ◽  
Full Adder ◽  
Cmos Technology ◽  
Spice Simulation ◽  
Pass Transistor ◽  
Voltage Swing

Abstract In this paper, we proposed an efficient full adder circuit using 16 transistors. The proposed high-speed adder circuit is able to operate at very low voltage and maintain the proper output voltage swing and also balance the power consumption and speed. Proposed design is based on CMOS mixed threshold voltage logic (MTVL) and implemented in 180nm CMOS technology. In the proposed technique the most time-consuming and power consuming XOR gates and multiplexer are designed using MTVL scheme. The maximum average power consumed by the proposed circuit is 6.94μW at 1.8V supply voltage and frequency of 500 MHz, which is less than other conventional methods. Power, delay, and area are optimized by using pass transistor logic and verified using the SPICE simulation tool at desired broad frequency range. It is also observed that the proposed design may be successfully utilized in many cases, especially whenever the lowest power consumption and delay are aimed.

A Novel CNFET Technology Based 3 Bit Flash ADC for Low-Voltage High Speed SoC Application

2015 ◽  
Vol 19 ◽  
pp. 19-36 ◽  
Author(s):  
P.A. Gowri Sankar ◽  
G. Sathiyabama
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Circuit Design ◽  
Field Effect ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Cmos Technology ◽  
Flash Adc ◽  
Simulation Results

The continuous scaling down of metal-oxide-semiconductor field effect transistors (MOSFETs) led to the considerable impact in the analog-digital mixed signal integrated circuit design for system-on-chips (SoCs) application. SoCs trends force ADCs to be integrated on the chip with other digital circuits. These trends present new challenges in ADC circuit design based on existing CMOS technology. In this paper, we have designed and analyzed a 3-bit high speed, low-voltage and low-power flash ADC at 32nm CNFET technology for SoC applications. The proposed ADC utilizes the Threshold Inverter Quantization (TIQ) technique that uses two cascaded carbon nanotube field effect transistor (CNFET) inverters as a comparator. The TIQ technique proposed has been developed for better implementation in SoC applications. The performance of the proposed ADC is studied using two different types of encoders such as ROM and Fat tree encoders. The proposed ADCs circuits are simulated using Synopsys HSPICE with standard 32nm CNFET model at 0.9 input supply voltage. The simulation results show that the proposed 3 bit TIQ technique based flash ADC with fat tree encoder operates up to 8 giga samples per second (GSPS) with 35.88µW power consumption. From the simulation results, we observed that the proposed TIQ flash ADC achieves high speed, small size, low power consumption, and low voltage operation compared to other low power CMOS technology based flash ADCs. The proposed method is sensitive to process, temperature and power supply voltage variations and their impact on the ADC performance is also investigated.

CMOS implementation of an analogue median filter for image processing in real time

2013 ◽  
Vol 61 (3) ◽  
pp. 725-730
Author(s):  
W. Jendernalik ◽  
J. Jakusz ◽  
G. Blakiewicz ◽  
S. Szczepański
Keyword(s):  
Image Processing ◽  
Integrated Circuit ◽  
High Speed ◽  
Median Filter ◽  
Cmos Technology ◽  
Vision Chip ◽  
Interface Circuits ◽  
Photo Sensor ◽  
Power Operation ◽  
Cmos Implementation

Abstract An analogue median filter, realised in a 0.35 μm CMOS technology, is presented in this paper. The key advantages of the filter are: high speed of image processing (50 frames per second), low-power operation (below 1.25 mW under 3.3 V supply) and relatively high accuracy of signal processing. The presented filter is a part of an integrated circuit for image processing (a vision chip), containing: a photo-sensor matrix, a set of analogue pre-processors, and interface circuits. The analysis of the main parameters of the considered median filter is presented. The discussion of important limitations in the operation of the filter due to the restrictions imposed by CMOS technology is also presented.

scholarly journals Performance Analysis of Modified Drain Gating Techniques for Low Power and High Speed Arithmetic Circuits

VLSI Design ◽  
2014 ◽  
Vol 2014 ◽  
pp. 1-5 ◽  
Author(s):  
Shikha Panwar ◽  
Mayuresh Piske ◽  
Aatreya Vivek Madgula
Keyword(s):  
Low Power ◽  
High Speed ◽  
High Performance ◽  
Room Temperature ◽  
Supply Voltage ◽  
Cmos Technology ◽  
Propagation Delay ◽  
Cmos Circuits ◽  
Output Node ◽  
Critical Sections

This paper presents several high performance and low power techniques for CMOS circuits. In these design methodologies, drain gating technique and its variations are modified by adding an additional NMOS sleep transistor at the output node which helps in faster discharge and thereby providing higher speed. In order to achieve high performance, the proposed design techniques trade power for performance in the delay critical sections of the circuit. Intensive simulations are performed using Cadence Virtuoso in a 45 nm standard CMOS technology at room temperature with supply voltage of 1.2 V. Comparative analysis of the present circuits with standard CMOS circuits shows smaller propagation delay and lesser power consumption.

scholarly journals Leakage Reduction Methodology in CMOS for the Design of 1-Bit Full Adder

2021 ◽  
Vol 5 (1) ◽  
pp. 1-7
Author(s):  
S. MOHAN DAS ◽  
GANESH KUMAR M ◽  
BHASKARA RAO K
Keyword(s):  
High Speed ◽  
Supply Voltage ◽  
Logic Gates ◽  
Full Adder ◽  
Cmos Technology ◽  
Universal Logic ◽  
Significant Saving ◽  
Low Leakage ◽  
Low Threshold ◽  
The Cost

This paper presents low leakage and high speed 1-bit full adder projected with low threshold NMOS transistors in associations with universal logic gates which leads to have reduced power and delay. The customized NAND and NOR gates, a necessary blocks, are presented to design a proposed adder cell. The simulations for the designed circuits performed in cadence virtuoso tool with 65 nm CMOS technology at a supply voltage of 1 Volts. The proposed universal gates and 1-bit adder cell is compared with conventional NAND/NOR gates and 1-bit adder. The proposed adder schemes with modified universal logic gates achieve significant saving in terms of delay which are more than 24% and which is at the cost of 5% when compared with conventional designs.

An Energy Efficient Logic Approach to Implement CMOS Full Adder

2017 ◽  
Vol 26 (05) ◽  
pp. 1750084 ◽  
Author(s):  
Pankaj Kumar ◽  
Rajender Kumar Sharma
Keyword(s):  
Energy Efficient ◽  
High Speed ◽  
Supply Voltage ◽  
Signal Integrity ◽  
Full Adder ◽  
Cmos Technology ◽  
Nand Gate ◽  
Common Environment ◽  
Logic Approach ◽  
Power Delay Product

An energy efficient internal logic approach for designing two 1-bit full adder cells is proposed in this work. It is based on decomposition of the full adder logic into the smaller modules. Low power, high speed and smaller area are the main features of the proposed approach. A modified power aware NAND gate, an essential entity, is also presented. The proposed full adder cells achieve 30.13% and improvement in their power delay product (PDP) metrics when compared with the best reported full adder design. Some of the popular adders and proposed adders are designed with cadence virtuoso tool with UMC 90[Formula: see text]nm technology operating at 1.2[Formula: see text]V supply voltage and UMC 55[Formula: see text]nm CMOS technology operating at 1.0[Formula: see text]V. These designs are tested on a common environment. During the experiment, it is also found that the proposed adder cells exhibit excellent signal integrity and driving capability when operated at low voltages.

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