scholarly journals Distance-Resolving Raman Radar Based on a Time-Correlated CMOS Single-Photon Avalanche Diode Line Sensor

Sensors ◽  
2018 ◽  
Vol 18 (10) ◽  
pp. 3200 ◽  
Author(s):  
Jere Kekkonen ◽  
Jan Nissinen ◽  
Juha Kostamovaara ◽  
Ilkka Nissinen
Keyword(s):  
Background Radiation ◽  
Single Photon ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Raman Signal ◽  
Ambient Light ◽  
Signal Ratio ◽  
Distance Information ◽  
Avalanche Diode ◽  
First Time

Remote Raman spectroscopy is widely used to detect minerals, explosives and air pollution, for example. One of its main problems, however, is background radiation that is caused by ambient light and sample fluorescence. We present here, to the best of our knowledge, the first time a distance-resolving Raman radar device that is based on an adjustable, time-correlated complementary metal-oxide-semiconductor (CMOS) single-photon avalanche diode line sensor which can measure the location of the target sample simultaneously with the normal stand-off spectrometer operation and suppress the background radiation dramatically by means of sub-nanosecond time gating. A distance resolution of 3.75 cm could be verified simultaneously during normal spectrometer operation and Raman spectra of titanium dioxide were distinguished by this system at distances of 250 cm and 100 cm with illumination intensities of the background of 250 lux and 7600 lux, respectively. In addition, the major Raman peaks of olive oil, which has a fluorescence-to-Raman signal ratio of 33 and a fluorescence lifetime of 2.5 ns, were distinguished at a distance of 30 cm with a 250 lux background illumination intensity. We believe that this kind of time-correlated CMOS single-photon avalanche diode sensor could pave the way for new compact distance-resolving Raman radars for application where distance information within a range of several metres is needed at the same time as a Raman spectrum.

scholarly journals Monolithically-Integrated Single-Photon Avalanche Diode in a Zero-Change Standard CMOS Process for Low-Cost and Low-Voltage LiDAR Application

Instruments ◽  
2019 ◽  
Vol 3 (2) ◽  
pp. 33
Author(s):  
Jinsoo Rhim ◽  
Xiaoge Zeng ◽  
Zhihong Huang ◽  
Sai Rahul Chalamalasetti ◽  
Marco Fiorentino ◽  
...  
Keyword(s):  
Low Voltage ◽  
Single Photon ◽  
Low Cost ◽  
Minimum Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Complete Characterization ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Avalanche Diode ◽  
Monolithically Integrated

We present a single-photon sensor based on the single-photon avalanche diode (SPAD) that is suitable for low-cost and low-voltage light detection and ranging (LiDAR) applications. It is implemented in a zero-change standard 0.18-μm complementary metal oxide semiconductor process at the minimum cost by excluding any additional processing step for customized doping profiles. The SPAD is based on circular shaped P+/N-well junction of 8-μm diameter, and it achieves low breakdown voltage below 10 V so that the operation voltage of the single-photon sensor can be minimized. The quenching and reset circuit is integrated monolithically to capture photon-generated output pulses for measurement. A complete characterization of our single-photon sensor is provided.

scholarly journals High Dynamic Range Imaging with TDC-Based CMOS SPAD Arrays

Instruments ◽  
2019 ◽  
Vol 3 (3) ◽  
pp. 38 ◽  
Author(s):  
Majid Zarghami ◽  
Leonardo Gasparini ◽  
Matteo Perenzoni ◽  
Lucio Pancheri
Keyword(s):  
Dynamic Range ◽  
Single Photon ◽  
Photon Counting ◽  
Complementary Metal Oxide Semiconductor ◽  
High Dynamic Range ◽  
Oxide Semiconductor ◽  
Photon Flux ◽  
Integration Time ◽  
Rate Dependent ◽  
High Dynamic

This paper investigates the use of image sensors based on complementary metal–oxide–semiconductor (CMOS) single-photon avalanche diodes (SPADs) in high dynamic range (HDR) imaging by combining photon counts and timestamps. The proposed method is validated experimentally with an SPAD detector based on a per-pixel time-to-digital converter (TDC) architecture. The detector, featuring 32 × 32 pixels with 44.64-µm pitch, 19.48% fill factor, and time-resolving capability of ~295-ps, was fabricated in a 150-nm CMOS standard technology. At high photon flux densities, the pixel output is saturated when operating in photon-counting mode, thus limiting the DR of this imager. This limitation can be overcome by exploiting the distribution of photon arrival times in each pixel, which shows an exponential behavior with a decay rate dependent on the photon flux level. By fitting the histogram curve with the exponential decay function, the extracted time constant is used to estimate the photon count. This approach achieves 138.7-dB dynamic range within 30-ms of integration time, and can be further extended by using a timestamping mechanism with a higher resolution.

scholarly journals Modeling, Simulation Methods and Characterization of Photon Detection Probability in CMOS-SPAD

Sensors ◽  
2021 ◽  
Vol 21 (17) ◽  
pp. 5860
Author(s):  
Aymeric Panglosse ◽  
Philippe Martin-Gonthier ◽  
Olivier Marcelot ◽  
Cédric Virmontois ◽  
Olivier Saint-Pé ◽  
...  
Keyword(s):  
Detection Probability ◽  
Computer Aided Design ◽  
Single Photon ◽  
Complementary Metal Oxide Semiconductor ◽  
Simulation Method ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Doping Profile ◽  
Cmos Process ◽  
Photon Detection

Single-Photon Avalanche Diodes (SPAD) in Complementary Metal-Oxide Semiconductor (CMOS) technology are potential candidates for future “Light Detection and Ranging” (Lidar) space systems. Among the SPAD performance parameters, the Photon Detection Probability (PDP) is one of the principal parameters. Indeed, this parameter is used to evaluate the SPAD sensitivity, which directly affects the laser power or the telescope diameter of space-borne Lidars. In this work, we developed a model and a simulation method to predict accurately the PDP of CMOS SPAD, based on a combination of measurements to acquire the CMOS process doping profile, Technology Computer-Aided Design (TCAD) simulations, and a Matlab routine. We compare our simulation results with a SPAD designed and processed in CMOS 180 nm technology. Our results show good agreement between PDP predictions and measurements, with a mean error around 18.5%, for wavelength between 450 and 950 nm and for a typical range of excess voltages between 15 and 30% of the breakdown voltage. Due to our SPAD architecture, the high field region is not entirely insulated from the substrate, a comparison between simulations performed with and without the substrate contribution indicates that PDP can be simulated without this latter with a moderate loss of precision, around 4.5 percentage points.

scholarly journals Fast-Gated 16 × 1 SPAD Array for Non-Line-of-Sight Imaging Applications

Instruments ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 14
Author(s):  
Marco Renna ◽  
Ji Hyun Nam ◽  
Mauro Buttafava ◽  
Federica Villa ◽  
Andreas Velten ◽  
...  
Keyword(s):  
Single Photon ◽  
Photon Counting ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Line Of Sight ◽  
Single Photon Detector ◽  
Single Photon Counting ◽  
Timing Resolution ◽  
Fast Gating ◽  
Non Line Of Sight

In this paper we present a novel single-photon detector specifically designed for Non-Line-Of-Sight (NLOS) imaging applications within the framework of the DARPA REVEAL program. The instrument is based on a linear 16 × 1 Complementary Metal-Oxide-Semiconductor (CMOS) Single-Photon Avalanche Diode (SPAD) array operated in fast-gated mode by a novel fast-gating Active Quenching Circuit (AQC) array, which enables the detectors with sub-ns transitions thanks to a SPAD-dummy approach. The detector exhibits a timing resolution better than 50 ps (Full Width at Half Maximum - FWHM) at a measurement repetition rate up to 40 MHz, and provides 16 independent outputs compatible with commercial Time-Correlated Single-Photon Counting (TCSPC) instrumentation. The instrument has been experimentally characterized and operated in preliminary NLOS imaging acquisitions where a 40 × 60 cm hidden object is successfully reconstructed by scanning over a grid of 150 × 150 positions.

Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection

2016 ◽  
Vol 13 (2) ◽  
pp. 71-76 ◽  
Author(s):  
Colin McDonough ◽  
Doug La Tulipe ◽  
Dan Pascual ◽  
Paul Tariello ◽  
John Mucci ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Complementary Metal Oxide Semiconductor ◽  
Silicon On Insulator ◽  
Oxide Semiconductor ◽  
Heterogeneous Integration ◽  
Production Environment ◽  
Si Photonics ◽  
Electrical Connections ◽  
First Time ◽  
Low Capacitance

A fully functional Si photonics and 65-nm complementary metal-oxide semiconductor (CMOS) heterogeneous three-dimensional (3-D) integration is demonstrated for the first time in a 300-mm production environment. Direct oxide wafer bonding was developed to eliminate voids between silicon on insulator photonics and bulk Si CMOS wafers. A via-last, Cu through-oxide via 3-D integration was developed for low capacitance electrical connections with no impact on the CMOS performance. The 3-D yield approaching 100% was demonstrated on >20,000 via chains.

scholarly journals CMOS-compatible photonic devices for single-photon generation

Nanophotonics ◽  
2016 ◽  
Vol 5 (3) ◽  
pp. 427-439 ◽  
Author(s):  
Chunle Xiong ◽  
Bryn Bell ◽  
Benjamin J. Eggleton
Keyword(s):  
Secure Communication ◽  
Single Photon ◽  
Complementary Metal Oxide Semiconductor ◽  
Building Blocks ◽  
Photonic Devices ◽  
Oxide Semiconductor ◽  
Single Photons ◽  
Quantum Secure Communication ◽  
Cmos Compatible ◽  
Photon Generation

AbstractSources of single photons are one of the key building blocks for quantum photonic technologies such as quantum secure communication and powerful quantum computing. To bring the proof-of-principle demonstration of these technologies from the laboratory to the real world, complementary metal–oxide–semiconductor (CMOS)-compatible photonic chips are highly desirable for photon generation, manipulation, processing and even detection because of their compactness, scalability, robustness, and the potential for integration with electronics. In this paper, we review the development of photonic devices made from materials (e.g., silicon) and processes that are compatible with CMOS fabrication facilities for the generation of single photons.

Single-Event Upsets in Microelectronics: Fundamental Physics and Issues

MRS Bulletin ◽  
2003 ◽  
Vol 28 (2) ◽  
pp. 111-116 ◽  
Author(s):  
Henry H.K. Tang ◽  
Kenneth P. Rodbell
Keyword(s):  
Cosmic Rays ◽  
Cross Sections ◽  
Background Radiation ◽  
Complementary Metal Oxide Semiconductor ◽  
Alpha Particles ◽  
Oxide Semiconductor ◽  
Thermal Neutrons ◽  
Single Event ◽  
Single Event Upsets ◽  
Future Technologies

AbstractWe review the current understanding of single-event upsets (SEUs) in microelectronic devices. In recent years, SEUs have been recognized as one of the key reliability concerns for both current and future technologies. We identify the major sources of SEUs that impact many commercial products: (1) alpha particles in packaging materials, (2) background radiation due to cosmic rays, and (3) thermal neutrons in certain device materials. The origins of SEUs are examined from the standpoint of the fundamental atomic and nuclear interactions between the intruding particles (alpha particles, cosmic rays, and thermal neutrons) and semiconductor materials. We analyze field funneling, which is a key mechanism of charge collection in a device struck by an ionizing particle. Next, we formulate how SEU cross sections and SEU rates are calculated and discuss how these basic quantities are related to experiments. Finally, we summarize the major SEU issues regarding modeling, bulk complementary metal oxide semiconductor technologies, and research on future, exploratory technologies.

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