scholarly journals Fringing Electric Field Sensors for Anti-Attack at System-Level Protection

Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 3034
Author(s):  
Xiang Gao ◽  
Yiqiang Zhao ◽  
Haocheng Ma
Keyword(s):  
Integrated Circuits ◽  
Electric Field ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Low Cost ◽  
Circuit Board ◽  
System Level ◽  
Geometrical Parameters ◽  
Electric Field Sensors ◽  
Fringing Electric Field

Information system security has been in the spotlight of individuals and governments in recent years. Integrated Circuits (ICs) function as the basic element of communication and information spreading, therefore they have become an important target for attackers. From this perspective, system-level protection to keep chips from being attacked is of vital importance. This paper proposes a novel method based on a fringing electric field (FEF) sensor to detect whether chips are dismantled from a printed circuit board (PCB) as system-level protection. The proposed method overcomes the shortcomings of existing techniques that can be only used in specific fields. After detecting a chip being dismantled from PCB, some protective measures like deleting key data can be implemented to be against attacking. Fringing electric field sensors are analyzed through simulation. By optimizing sensor’s patterns, areas and geometrical parameters, the methods that maximize sensitivity of fringing electric field sensors are put forward and illustrated. The simulation is also reproduced by an experiment to ensure that the method is feasible and reliable. The results of experiments are inspiring in that they prove that the sensor can work well for protection of chips and has the advantage of universal applicability, low cost and high reliability.

New Packaging Substrate Technology,Ibss (Interpenetrating Polymer Network Build Up Structure System)

1996 ◽  
Vol 445 ◽  
Author(s):  
Motoo Asai
Keyword(s):  
Printed Circuit Board ◽  
Layer Structure ◽  
High Reliability ◽  
Low Cost ◽  
Polymer Network ◽  
High Heat ◽  
Temperature Cycling ◽  
Interpenetrating Polymer Network ◽  
Circuit Board ◽  
Structure System

AbstractWe have developed a new type of printed circuit board which is called “IBSS” (Interpenetrating polymer network Build up Structure System) for the purpose of meeting the demand of high density routing, high reliability and low cost substrates in IC packages. The new technology achieves 50μm line / 50μm space and 100μm diameter photo‐via hole. Full additive method is applied for patterning, and the build‐up method is used to form the multi‐layer structure. The newly developed photo‐imagable dielectric resin, “IPN”, which has a glass transition of 200'C, a copper peel strength of 1.5kg/cm, and withstands 1000 cycles of temperature cycling (TCB), is used for IBSS. IPN is composed of high heat resistant photo‐sensitive epoxy and supper engineering plastic. This IBSS technology is suitable for direct chip attachment. This paper presents the characteristics IBSS.

Electrowetting Actuation for a Sessile Liquid Drop: Experiments and Simulations

2011 ◽  
Author(s):  
S. Alavi ◽  
M. Passandideh-Fard ◽  
M. H. Tafteh
Keyword(s):  
Contact Angle ◽  
Free Surface ◽  
Electric Field ◽  
Printed Circuit Board ◽  
Liquid Drop ◽  
Ccd Camera ◽  
Circuit Board ◽  
Geometrical Parameters ◽  
Computational Domain ◽  
Electrowetting On Dielectric

In this paper, experiments and numerical simulations are performed to study the effects of electric field on the contact angle of a sessile liquid drop resting on a substrate in electrowetting-on-dielectric (EWOD) application. In the experiments for studying the electrowetting, a mercury droplet of 20μL was dispensed manually on a soldermask-coated PCB (Printed Circuit Board) and different values of AC voltage were applied between the droplet and the insulator. High quality images were captured using a CCD camera in all experiments and a program was developed using the MATLAB software for image-processing purposes to obtain the contact angle and other geometrical parameters of the droplet. A numerical model was also used to simulate the drop deformation under an electric field. The continuity and momentum equations along with an equation for tracking the liquid free surface were solved. The free surface advection and reconstruction were performed based on the volume-of-fluid method using Youngs’ algorithm. To evaluate the effect of the electric field on the free surface, the electrostatic potential was first solved for the entire computational domain. Next, the electric field intensity and the surface density of the electric charge were calculated on the free surface after which the electric force could be determined. Calculated droplet shapes agreed well with those of the experiments.

A 160-GHz system in package for short-range mm-wave applications

2014 ◽  
Vol 6 (3-4) ◽  
pp. 361-369 ◽  
Author(s):  
Abouzar Hamidipour ◽  
Reinhard Feger ◽  
Sebastian Poltschak ◽  
Andreas Stelzer
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Noise Figure ◽  
Low Cost ◽  
Directional Antennas ◽  
Circuit Board ◽  
Wafer Level ◽  
Frequency Multiplication ◽  
Fmcw Radar ◽  
Ball Grid Array Packages

This paper proposes a fully integrated 160-GHz transmitter and receiver in package for millimeter-wave applications. The monolithic integrated circuits were designed with a harmonic approach and were fabricated using a SiGe:C HBT production technology with an fTand fmaxof 170 and 250 GHz, respectively. The manufactured 2006 × 1865 µm2bare dies were integrated in 6 × 6 mm2embedded wafer level ball grid array packages, where they were interconnected with highly directional antennas built on the redistribution layer of the packages. With a total frequency multiplication factor of 36 and an active balun at the first stage, the transmitter allows the use of a 4.5-GHz input signal driven from a single-ended signal source [1] and distributed on a standard low-cost printed circuit board. The receiver comprises a Gilbert-cell-based subharmonic mixer with a simulated 1-dB input compression point of −4 dBm, and a minimum double-sideband noise figure of 16.5 dB. The functionality of the proposed system was successfully demonstrated in a quasi-monostatic FMCW radar measurement with a 1-ms up-chirp frequency sweep from 157 to 160 GHz and in a forward-scatter imaging experiment with an 8-GHz frequency ramp from 157 to 165 GHz.

Development of Compact Pulse Generator with Adjustable Pulse Width for Pulse Electric Field Treatment Technology

2018 ◽  
Vol 9 (2) ◽  
pp. 889 ◽  
Author(s):  
Nur Faizal Kasri ◽  
Mohamed Afendi Mohamed Piah
Keyword(s):  
Electric Field ◽  
Duty Cycle ◽  
Pulse Width ◽  
Printed Circuit Board ◽  
Pulse Generator ◽  
Low Cost ◽  
Pulse Electric Field ◽  
Circuit Board ◽  
Treatment Technology ◽  
Pulse Electric

<span lang="EN-MY">The pulse generator which has been implemented in the pulse electric field (PEF) treatment system for food processing is worth to be highlighted and improved. It is parallel with the advancement in semiconductor technology, which offers robust and accurate devices. This research is an effort to produce a low cost, compact and reliable pulse generator as well as equipped with a pulse width modulation (PWM) method for wide selection of frequency and duty cycle. The result shows that the simulation process has proven the theoretical concept to be right and yields the desired outcome based on the designed values. Then, the actual printed circuit board (PCB) has been fabricated to obtain practical results which intended to be compared with the simulation outcomes. Concerning the frequency and its duty cycle, both parameters can be altered without affecting each other. It means by changing the frequency, duty cycle remains the same and vice versa. Thus, this proposed pulse generator achieves its objective and fits to be implemented in PEF treatment technology. It also can replace the conventional pulse forming network (PFN) which is bulky and costly</span><span>.</span>

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Compact Modelling of Electrical, Optical and Thermal Properties of Multi-Colour Power LEDs Operating on a Common PCB

Energies ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1286
Author(s):  
Krzysztof Górecki ◽  
Przemysław Ptak
Keyword(s):  
Integrated Circuits ◽  
Optical Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Junction Temperature ◽  
Optical Parameters ◽  
Spice Simulation ◽  
Light Emitting ◽  
Proposed Model ◽  
Good Agreement

This paper concerns the problem of modelling electrical, thermal and optical properties of multi-colour power light-emitting diodes (LEDs) situated on a common PCB (Printed Circuit Board). A new form of electro-thermo-optical model of such power LEDs is proposed in the form of a subcircuit for SPICE (Simulation Program with Integrated Circuits Emphasis). With the use of this model, the currents and voltages of the considered devices, their junction temperature and selected radiometric parameters can be calculated, taking into account self-heating phenomena in each LED and mutual thermal couplings between each pair of the considered devices. The form of the formulated model is described, and a manner of parameter estimation is also proposed. The correctness and usefulness of the proposed model are verified experimentally for six power LEDs emitting light of different colours and mounted on an experimental PCB prepared by the producer of the investigated devices. Verification was performed for the investigated diodes operating alone and together. Good agreement between the results of measurements and computations was obtained. It was also proved that the main thermal and optical parameters of the investigated LEDs depend on a dominant wavelength of the emitted light.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

scholarly journals A Self-Powered Nanogenerator for the Electrical Protection of Integrated Circuits from Trace Amounts of Liquid

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Zhuang Hui ◽  
Ming Xiao ◽  
Daozhi Shen ◽  
Jiayun Feng ◽  
Peng Peng ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Printed Circuit Board ◽  
Short Circuit ◽  
High Sensitivity ◽  
Short Circuit Current ◽  
Fast Response ◽  
Open Circuit ◽  
Circuit Board ◽  
Self Powered

Abstract With the increase in the use of electronic devices in many different environments, a need has arisen for an easily implemented method for the rapid, sensitive detection of liquids in the vicinity of electronic components. In this work, a high-performance power generator that combines carbon nanoparticles and TiO2 nanowires has been fabricated by sequential electrophoretic deposition (EPD). The open-circuit voltage and short-circuit current of a single generator are found to exceed 0.7 V and 100 μA when 6 μL of water was applied. The generator is also found to have a stable and reproducible response to other liquids. An output voltage of 0.3 V was obtained after 244, 876, 931, and 184 μs, on exposure of the generator to 6 μL of water, ethanol, acetone, and methanol, respectively. The fast response time and high sensitivity to liquids show that the device has great potential for the detection of small quantities of liquid. In addition, the simple easily implemented sequential EPD method ensures the high mechanical strength of the device. This compact, reliable device provides a new method for the sensitive, rapid detection of extraneous liquids before they can impact the performance of electronic circuits, particularly those on printed circuit board.

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