scholarly journals Analysis of the Performance of a Solar Thermoelectric Generator for Variable Leg Geometry with Nanofluid Cooling

Processes ◽  
2021 ◽  
Vol 9 (8) ◽  
pp. 1352
Author(s):  
Cristian Francisco Ramos-Castañeda ◽  
Miguel Angel Olivares-Robles ◽  
Juan Vicente Méndez-Méndez
Keyword(s):  
Cooling System ◽  
Technological Development ◽  
Maximum Efficiency ◽  
Large Temperature ◽  
Temperature Dependent ◽  
Temperature Ranges ◽  
Speed Up ◽  
Solar Thermoelectric Generator ◽  
Conventional Cooling ◽  
The Impact

In this study, the impact of nanofluid use in solar-thermoelectric generators (Solar-TEG) on thermal performance is investigated through analysis and simulation methodology. For conventional cooling analysis, we use air as a coolant and graphene nanoplatelet aqueous nanofluids (GNAN) for nanofluid cooling. We make a comparison between traditional and nanofluid cooling to find the best performance. GNAN at a dispersion of 0.025, 0.05, 0.075, and 0.1-wt% are added to the cooling system. GNAN has been used in the technological development of energy conversion. It has been proposed as a material to achieve better efficiency in Solar-TEG. Five different geometries are developed to analyze the efficiency in a Solar-TEG to find the optimal design. The impact of the thermal concentration relationship, substrate area, and convective transfer coefficient on Solar-TEG performance is investigated. To simplify and speed up simulations, we use equivalent models based on FEM. We are considering the properties of temperature-dependent semiconductors. For thermoelement materials, we use lead-tellurium. Lead-tellurium is an excellent material for thermoelectric study and supports large temperature ranges (up to 750 K). The thermal concentration relationship depends on the substrate area, which affects the efficiency of Solar-TEG. The maximum efficiency between the five geometry types is 5.53%, with a substrate of 110 × 100 mm2. The efficiency and output power using 0.1% wt GNAN as the refrigerant is enhanced by 14.74% and 26.39%. GNAN cooling improves compared to conventional fluid cooling in a Solar-TEG. Different convection coefficients are used to verify this fact.

Short-term temperature dependency of the photosynthetic and PSII photochemical responses to photon flux density of leaves of Vitis vinifera cv. Shiraz vines grown in field conditions with and without fruit

2019 ◽  
Vol 46 (7) ◽  
pp. 634 ◽  
Author(s):  
Dennis H. Greer
Keyword(s):  
Maximum Efficiency ◽  
Photon Flux ◽  
Photochemical Quenching ◽  
Photon Flux Density ◽  
Temperature Dependent ◽  
Psii Photochemistry ◽  
Acclimation Response ◽  
Summer Temperatures ◽  
Non Photochemical Quenching ◽  
The Impact

Shiraz vines grown outdoors with and without a crop load were used to determine photosynthetic and chlorophyll fluorescence responses to light across a range of leaf temperatures to evaluate the impact of presence/absence of a sink on these responses. Results indicate maximum rates of photosynthesis and light saturation in fruiting vines were biased towards higher temperatures whereas these processes in vegetative vines were biased towards lower temperatures. The maximum efficiency of PSII photochemistry was similarly biased, with higher efficiency for the vegetative vines below 30°C and a higher efficiency for the fruiting vines above. The quantum efficiency of PSII electron transport was generally higher across all temperatures in the fruiting compared with vegetative vines. Photochemical quenching was not sensitive to temperature in fruiting vines but strongly so in vegetative vines, with an optimum at 30°C and marked increases in photochemical quenching at other temperatures. Non-photochemical quenching was not strongly temperature dependent, but there were marked increases in both treatments at 45°C, consistent with marked decreases in assimilation. These results suggest demand for assimilates in fruiting vines induced an acclimation response to high summer temperatures to enhance assimilate supply and this was underpinned by comparable shifts in PSII photochemistry.

Impact of Innovative Cooling System on Mechanical Properties of Moulded Parts

2016 ◽  
Vol 368 ◽  
pp. 49-52
Author(s):  
Jiří Habr ◽  
Martin Seidl ◽  
Jiří Bobek
Keyword(s):  
Heat Transfer ◽  
Mechanical Properties ◽  
Cooling System ◽  
Flexural Modulus ◽  
Temperature Fields ◽  
Part Surface ◽  
Spot Cooling ◽  
Conventional Cooling ◽  
Heat Processes ◽  
The Impact

This article deals with the impact evaluation of utilization of innovative cooling system exploiting liquid carbon dioxide injected into injection mould. Process of heat transfer from the polymeric melt and final part solidification has a direct impact on creation of morphology structure of semi-crystalline thermoplastic materials and their ultimate mechanical properties. Usually the heat processes in the production tools are controlled by tempering channels where heat transfer medium circulates (oil, water tec.). This conventional way of cooling has some limitations that cause an uneven distribution of temperature fields on the part surface. Spot cooling system is one of unconventional cooling ways that increase the uniformity of temperature fields distribution on the part surface. This system utilizes the cooling potential of liquid CO2. For the purpose of this study the special shaped insert was designed that was modified both for conventional cooling and for spot cooling system. Flexural modulus very responsively reflects the changes of morphology structure formed by different cooling progressions of the plastic melt and was chosen as an evaluating criterion.

Secular stagnation in the modern world

2018 ◽  
pp. 125-141 ◽  
Author(s):  
S. M. Drobyshevsky ◽  
P. V. Trunin ◽  
A. V. Bozhechkova
Keyword(s):  
Public Debt ◽  
Capital Accumulation ◽  
Technological Development ◽  
Japanese Economy ◽  
Modern World ◽  
Key Factors ◽  
Destruction Process ◽  
Secular Stagnation ◽  
The Impact

The paper studies the factors of secular stagnation. Key factors of long-term slowdown in economic growth include the slowdown of technological development, aging population, human capital accumulation limits, high public debt, creative destruction process violation etc. The authors analyze key theoretical aspects of long-term stagnation and study the impact of these factors on Japanies economy. The authors conclude that most of the factors have significant influence on the Japanese economy for recent decades, but they cannot explain all dynamics. For Russia, on the contrary, we do not see any grounds for considering the decline in the economy since 2013 as an episode of secular stagnation.

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

scholarly journals Study and Assessment of Defect and Trap Effects on the Current Capabilities of a 4H-SiC-Based Power MOSFET

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 735
Author(s):  
Fortunato Pezzimenti ◽  
Hichem Bencherif ◽  
Giuseppe De Martino ◽  
Lakhdar Dehimi ◽  
Riccardo Carotenuto ◽  
...  
Keyword(s):  
Drain Current ◽  
Oxide Semiconductor ◽  
Temperature Dependent ◽  
Channel Mobility ◽  
Blocking Voltage ◽  
Current Voltage ◽  
Wide Range ◽  
Temperature Ranges ◽  
Joint Contribution ◽  
State Resistance

A numerical simulation study accounting for trap and defect effects on the current-voltage characteristics of a 4H-SiC-based power metal-oxide-semiconductor field effect transistor (MOSFET) is performed in a wide range of temperatures and bias conditions. In particular, the most penalizing native defects in the starting substrate (i.e., EH6/7 and Z1/2) as well as the fixed oxide trap concentration and the density of states (DoS) at the 4H-SiC/SiO2 interface are carefully taken into account. The temperature-dependent physics of the interface traps are considered in detail. Scattering phenomena related to the joint contribution of defects and traps shift the MOSFET threshold voltage, reduce the channel mobility, and penalize the device current capabilities. However, while the MOSFET on-state resistance (RON) tends to increase with scattering centers, the sensitivity of the drain current to the temperature decreases especially when the device is operating at a high gate voltage (VGS). Assuming the temperature ranges from 300 K to 573 K, RON is about 2.5 MΩ·µm2 for VGS > 16 V with a percentage variation ΔRON lower than 20%. The device is rated to perform a blocking voltage of 650 V.

scholarly journals Temperature Characterization of Liquid Crystal Dielectric Image Line Phase Shifter for Millimeter-Wave Applications

Crystals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 63
Author(s):  
Henning Tesmer ◽  
Rani Razzouk ◽  
Ersin Polat ◽  
Dongwei Wang ◽  
Rolf Jakoby ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Millimeter Wave ◽  
Insertion Loss ◽  
Phase Shifter ◽  
Ground Plane ◽  
Temperature Dependent ◽  
Differential Phase ◽  
Dependent Behavior ◽  
The Impact ◽  
Temperature Dependent Behavior

In this paper we investigate the temperature dependent behavior of a liquid crystal (LC) loaded tunable dielectric image guide (DIG) phase shifter at millimeter-wave frequencies from 80 GHz to 110 GHz for future high data rate communications. The adhesive, necessary for precise fabrication, is analyzed before temperature dependent behavior of the component is shown, using the nematic LC-mixture GT7-29001. The temperature characterization is conducted by changing the temperature of the LC DIG’s ground plane between −10∘C and 80 ∘C. The orientation of the LC molecules, and therefore the effective macroscopic relative permittivity of the DIG, is changed by inserting the temperature setup in a fixture with rotatable magnets. Temperature independent matching can be observed, while the insertion loss gradually increases with temperature for both highest and lowest permittivity of the LC. At 80 ∘C the insertion loss is up to 1.3dB higher and at −10∘C it is 0.6dB lower than the insertion loss present at 20 ∘C. In addition, the achievable differential phase is reduced with increasing temperature. The impact of molecule alignment to this reduction is shown for the phase shifter and an estimated 85% of the anisotropy is still usable with an LC DIG phase shifter when increasing the temperature from 20 ∘C to 80 ∘C. Higher reduction of differential phase is present at higher frequencies as the electrical length of the phase shifter increases. A maximum difference in differential phase of 72∘ is present at 110 GHz, when increasing the temperature from 20 ∘C to 80 ∘C. Nevertheless, a well predictable, quasi-linear behavior can be observed at the covered temperature range, highlighting the potential of LC-based dielectric components at millimeter wave frequencies.

scholarly journals Tetragonal–Cubic Phase Transition and Low-Field Dielectric Properties of CH3NH3PbI3 Crystals

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4215
Author(s):  
Roxana E. Patru ◽  
Hamidreza Khassaf ◽  
Iuliana Pasuk ◽  
Mihaela Botea ◽  
Lucian Trupina ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Current Knowledge ◽  
Cubic Phase ◽  
Relaxation Processes ◽  
Temperature Dependent ◽  
Thermally Activated ◽  
Low Field ◽  
Conduction Mechanisms ◽  
Temperature Ranges ◽  
Nyquist Plots

The frequency and temperature dependence of dielectric properties of CH3NH3PbI3 (MAPI) crystals have been studied and analyzed in connection with temperature-dependent structural studies. The obtained results bring arguments for the existence of ferroelectricity and aim to complete the current knowledge on the thermally activated conduction mechanisms, in dark equilibrium and in the presence of a small external a.c. electric field. The study correlates the frequency-dispersive dielectric spectra with the conduction mechanisms and their relaxation processes, as well as with the different transport regimes indicated by the Nyquist plots. The different energy barriers revealed by the impedance spectroscopy highlight the dominant transport mechanisms in different frequency and temperature ranges, being associated with the bulk of the grains, their boundaries, and/or the electrodes’ interfaces.

scholarly journals The importance of species interactions in eco-evolutionary community dynamics under climate change

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Anna Åkesson ◽  
Alva Curtsdotter ◽  
Anna Eklöf ◽  
Bo Ebenman ◽  
Jon Norberg ◽  
...  
Keyword(s):  
Climate Change ◽  
Species Interactions ◽  
Community Dynamics ◽  
Evolutionary Dynamics ◽  
Negative Impact ◽  
Trophic Levels ◽  
Temperature Dependent ◽  
Modeling Framework ◽  
Impact Of Climate Change ◽  
The Impact

AbstractEco-evolutionary dynamics are essential in shaping the biological response of communities to ongoing climate change. Here we develop a spatially explicit eco-evolutionary framework which features more detailed species interactions, integrating evolution and dispersal. We include species interactions within and between trophic levels, and additionally, we incorporate the feature that species’ interspecific competition might change due to increasing temperatures and affect the impact of climate change on ecological communities. Our modeling framework captures previously reported ecological responses to climate change, and also reveals two key results. First, interactions between trophic levels as well as temperature-dependent competition within a trophic level mitigate the negative impact of climate change on biodiversity, emphasizing the importance of understanding biotic interactions in shaping climate change impact. Second, our trait-based perspective reveals a strong positive relationship between the within-community variation in preferred temperatures and the capacity to respond to climate change. Temperature-dependent competition consistently results both in higher trait variation and more responsive communities to altered climatic conditions. Our study demonstrates the importance of species interactions in an eco-evolutionary setting, further expanding our knowledge of the interplay between ecological and evolutionary processes.

Cooling Efficiencies of a NiTi-Based Cooling Process

2013 ◽  
Author(s):  
Marvin Schmidt ◽  
Andreas Schütze ◽  
Stefan Seelecke
Keyword(s):  
Solid State ◽  
Thermodynamic Analysis ◽  
Cooling System ◽  
Analysis Method ◽  
Efficiency Ratio ◽  
Cooling Process ◽  
First Results ◽  
Work Input ◽  
Underlying Mechanisms ◽  
The Impact

Energy saving and environmental protection are topics of growing interest. In the light of these aspects alternative refrigeration principles become increasingly important. Shape memory alloys (SMA), especially NiTi alloys, generate a large amount of latent heat during solid state phase transformations, which can lead to a significant cooling effect in the material. These materials do not only provide the potential for an energy-efficient cooling process, they also minimize the impact on the environment by reducing the need for conventional ozone-depleting refrigerants. Our paper, presenting first results obtained in a project within the DFG Priority Program SPP 1599 “Ferroic Cooling”, focuses on the thermodynamic analysis of a NiTi-based cooling system. We first introduce a suitable cooling process and subsequently illustrate the underlying mechanisms of the process in comparison with the conventional compression refrigeration system. We further introduce a graphical solution to calculate the energy efficiency ratio of the system. This thermodynamic analysis method shows the necessary work input and the heat absorption of the SMA in stress/strain- or temperature/entropy-diagrams, respectively. The results of the calculations underline the high potential of this solid-state cooling methodology.

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