scholarly journals Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2028
Author(s):  
Li-Hua Zhao ◽  
Yun Liao ◽  
Li-Chuan Jia ◽  
Zhong Wang ◽  
Xiao-Long Huang ◽  
...  

The development of highly thermally conductive composites with excellent electrical insulation has attracted extensive attention, which is of great significance to solve the increasingly severe heat concentration issue of electronic equipment. Herein, we report a new strategy to prepare boron nitride nanosheets (BNNSs) via an ion-assisted liquid-phase exfoliation method. Then, silver nanoparticle (AgNP) modified BNNS (BNNS@Ag) was obtained by in situ reduction properties. The exfoliation yield of BNNS was approximately 50% via the ion-assisted liquid-phase exfoliation method. Subsequently, aramid nanofiber (ANF)/BNNS@Ag composites were prepared by vacuum filtration. Owing to the “brick-and-mortar” structure formed inside the composite and the adhesion of AgNP, the interfacial thermal resistance was effectively reduced. Therefore, the in-plane thermal conductivity of ANF/BNNS@Ag composites was as high as 11.51 W m−1 K−1, which was 233.27% higher than that of pure ANF (3.45 W m−1 K−1). The addition of BNNS@Ag maintained tensile properties (tensile strength of 129.14 MPa). Moreover, the ANF/BNNS@Ag films also had good dielectric properties and the dielectric constant was below 2.5 (103 Hz). Hence, the ANF/BNNS@Ag composite shows excellent thermal management performance, and the electrical insulation and mechanical properties of the matrix are retained, indicating its potential application prospects in high pressure and high temperature application environments.

2020 ◽  
Vol 3 (4) ◽  
pp. 3494-3502 ◽  
Author(s):  
Xin Ge ◽  
Jiangyun Zhang ◽  
Guoqing Zhang ◽  
Weijie Liang ◽  
Jinsheng Lu ◽  
...  

Nanoscale ◽  
2016 ◽  
Vol 8 (46) ◽  
pp. 19326-19333 ◽  
Author(s):  
Zhi Yang ◽  
Lihui Zhou ◽  
Wei Luo ◽  
Jiayu Wan ◽  
Jiaqi Dai ◽  
...  

Polymer ◽  
2020 ◽  
Vol 195 ◽  
pp. 122455 ◽  
Author(s):  
Chuan-Gen Yin ◽  
Zhong-Jie Liu ◽  
Rui Mo ◽  
Jin-Chen Fan ◽  
Peng-Hui Shi ◽  
...  

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.


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