Thermally conductive, dielectric PCM–boron nitride nanosheet composites for efficient electronic system thermal management

Nanoscale ◽  
2016 ◽  
Vol 8 (46) ◽  
pp. 19326-19333 ◽  
Author(s):  
Zhi Yang ◽  
Lihui Zhou ◽  
Wei Luo ◽  
Jiayu Wan ◽  
Jiaqi Dai ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Thermal Management ◽  
Electronic System ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive

Low Melting-Point Alloy–Boron Nitride Nanosheet Composites for Thermal Management

2020 ◽  
Vol 3 (4) ◽  
pp. 3494-3502 ◽  
Author(s):  
Xin Ge ◽  
Jiangyun Zhang ◽  
Guoqing Zhang ◽  
Weijie Liang ◽  
Jinsheng Lu ◽  
...  
Keyword(s):  
Melting Point ◽  
Boron Nitride ◽  
Thermal Management ◽  
Boron Nitride Nanosheet

Copper nanowires embedded in boron nitride nanosheet-polymer composites with enhanced thermal conductivities for thermal management

Polymer ◽  
2020 ◽  
Vol 195 ◽  
pp. 122455 ◽  
Author(s):  
Chuan-Gen Yin ◽  
Zhong-Jie Liu ◽  
Rui Mo ◽  
Jin-Chen Fan ◽  
Peng-Hui Shi ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Polymer Composites ◽  
Thermal Management ◽  
Copper Nanowires ◽  
Boron Nitride Nanosheet ◽  
Thermal Conductivities

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Stability ◽  
Heat Dissipation ◽  
Thermoplastic Polyurethane ◽  
Thermally Conductive ◽  
Mechanical Bending ◽  
Flexible Polyurethane ◽  
Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

scholarly journals Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Filler Content ◽  
Electronic Devices ◽  
Cure Kinetics ◽  
The Matrix ◽  
Thermally Conductive ◽  
Filler Particles ◽  
Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

scholarly journals Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2028
Author(s):  
Li-Hua Zhao ◽  
Yun Liao ◽  
Li-Chuan Jia ◽  
Zhong Wang ◽  
Xiao-Long Huang ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Boron Nitride ◽  
Thermal Management ◽  
Electrical Insulation ◽  
Interfacial Thermal Resistance ◽  
Conductive Composites ◽  
Boron Nitride Nanosheet ◽  
Brick And Mortar ◽  
The Matrix ◽  
Liquid Phase Exfoliation

The development of highly thermally conductive composites with excellent electrical insulation has attracted extensive attention, which is of great significance to solve the increasingly severe heat concentration issue of electronic equipment. Herein, we report a new strategy to prepare boron nitride nanosheets (BNNSs) via an ion-assisted liquid-phase exfoliation method. Then, silver nanoparticle (AgNP) modified BNNS (BNNS@Ag) was obtained by in situ reduction properties. The exfoliation yield of BNNS was approximately 50% via the ion-assisted liquid-phase exfoliation method. Subsequently, aramid nanofiber (ANF)/BNNS@Ag composites were prepared by vacuum filtration. Owing to the “brick-and-mortar” structure formed inside the composite and the adhesion of AgNP, the interfacial thermal resistance was effectively reduced. Therefore, the in-plane thermal conductivity of ANF/BNNS@Ag composites was as high as 11.51 W m−1 K−1, which was 233.27% higher than that of pure ANF (3.45 W m−1 K−1). The addition of BNNS@Ag maintained tensile properties (tensile strength of 129.14 MPa). Moreover, the ANF/BNNS@Ag films also had good dielectric properties and the dielectric constant was below 2.5 (103 Hz). Hence, the ANF/BNNS@Ag composite shows excellent thermal management performance, and the electrical insulation and mechanical properties of the matrix are retained, indicating its potential application prospects in high pressure and high temperature application environments.

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