scholarly journals Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold

Micromachines ◽  
2018 ◽  
Vol 9 (7) ◽  
pp. 349 ◽  
Author(s):  
Jiang Guo ◽  
Hirofumi Suzuki
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Removal Efficiency ◽  
Process Parameters ◽  
Material Removal ◽  
Removal Rate ◽  
Grain Sizes ◽  
Tool Influence Function ◽  
Polishing Pressure ◽  
Lower Material

Process parameter conditions such as vibrating motion, abrasives, pressure and tool wear play an important role in vibration-assisted polishing of micro-optic molds as they strongly affect material removal efficiency and stability. This paper presents an analytical and experimental investigation on the effects of process parameters, aimed at clarifying interrelations between material removal and process parameters which affect polishing quantitatively. The material removal rate (MRR) and surface roughness which represent the polishing characteristics were examined under different vibrating motions, grain sizes of abrasives and polishing pressure. The effects of pressure and tool wear conditions on tool influence function were analyzed. The results showed that 2D vibrating motion generated better surface roughness with higher material removal efficiency while a smaller grain size of abrasives created better surface roughness but lower material removal efficiency. MRR gradually decreases with the increase of polishing pressure when it exceeds 345 kPa, and it was greatly affected by the wear of polisher when wear diameter on the polisher’s head exceeds 300 μm.

Effect of SiC-Cu Electrode on Material Removal Rate, Tool Wear and Surface Roughness in EDM Process

2020 ◽  
Vol 38 (9A) ◽  
pp. 1406-1413
Author(s):  
Yousif Q. Laibia ◽  
Saad K. Shather
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
304 Stainless Steel ◽  
Tool Electrode ◽  
Pulse Time ◽  
Edm Process

Electrical discharge machining (EDM) is one of the most common non-traditional processes for the manufacture of high precision parts and complex shapes. The EDM process depends on the heat energy between the work material and the tool electrode. This study focused on the material removal rate (MRR), the surface roughness, and tool wear in a 304 stainless steel EDM. The composite electrode consisted of copper (Cu) and silicon carbide (SiC). The current effects imposed on the working material, as well as the pulses that change over time during the experiment. When the current used is (8, 5, 3, 2, 1.5) A, the pulse time used is (12, 25) μs and the size of the space used is (1) mm. Optimum surface roughness under a current of 1.5 A and the pulse time of 25 μs with a maximum MRR of 8 A and the pulse duration of 25 μs.

scholarly journals Investigation an assisting electrode powder mixed electrical discharge machining of nonconductive ceramic

2021 ◽  
Author(s):  
Dragan Rodic ◽  
Marin Gostimirovic ◽  
Milenko Sekulic ◽  
Borislav Savkovic ◽  
Branko Strbac
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Electrical Discharge ◽  
Material Removal ◽  
Metal Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Positive Effects ◽  
Assisting Electrode

Abstract It is well known that electrical discharge machining can be used in the processing of nonconductive materials. In order to improve the efficiency of machining modern engineering materials, existing electrical discharge machines are constantly being researched and improved or developed. The current machining of non-conductive materials is limited due to the relatively low material removal rate and high surface roughness. A possible technological improvement of electrical discharge machining can be achieved by innovations of existing processes. In this paper, a new approach for machining zirconium oxide is presented. It combines electrical discharge machining with assisting electrode and powder-mixed dielectric. The assisting electrode is used to enable electrical discharge machining of nonconductive material, while the powder-mixed dielectric is used to increase the material removal rate, reduce surface roughness, and decrease relative tool wear. The response surface method was used to generate classical mathematical models, analyzing the output performances of surface roughness, material removal rate and relative tool wear. Verification of the obtained models was performed based on a set of new experimental data. By combining these latest techniques, positive effects on machining performances are obtained. It was found that the surface roughness was reduced by 18%, the metal removal rate was increased by about 12% and the relative tool wear was reduced by up to 6% compared to electrical discharge machining with supported electrode without powder.

Investigation of Grinding Force and Surface Integrity of IC10 in Creep Feed Grinding

2020 ◽  
Author(s):  
Jun-chen Li ◽  
Wen-hu Wang ◽  
Rui-song Jiang ◽  
Xiao-fen Liu ◽  
Huang Bo ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal ◽  
Normal Force ◽  
Removal Rate ◽  
Tangential Force ◽  
Grinding Force ◽  
Wheel Speed ◽  
Creep Feed Grinding ◽  
Creep Feed

Abstract The IC10 superalloy material is one of the most important materials for aero-engine turbine blade due to its excellent performances. However, it is difficult to be machined because of its special properties such as terrible tool wear and low machined efficiency. The creep feed grinding is widely used in machining IC10 superalloy due to the advance in reducing tool wear, improving material removal rate and surface quality. The creep feed grinding is a promising machining process with the advantages of high material removal rate due to large cutting depth, long cutting arc and very slow workpiece, and its predominant features might have significant influence on the grinding force and surface quality for the workpiece. Hence, it is of great importance to study the grinding force and surface integrity in creep feed grinding IC10 superalloy. In this paper, a series of orthogonal experiments have been carried out and the effects of grinding parameters on the grinding force and the surface roughness are analyzed. The topographies and defects of the machined surface were observed and analyzed using SEM. The results of the experiments show that the tangential force is decreased with the workpiece speed increasing. However, there is no significant change in tangential force with the increasing of grinding depth and wheel speed. The normal force is decreased with the workpiece speed increasing when the workpiece speed is less than 150 mm/min, but when the workpiece speed is more than 150 mm/min the normal force is increased tardily. Moreover, the normal force is increased sharply with the increase of grinding depth and is increased slowly with the increase of wheel speed. In general, the surface roughness is increased with workpiece speed and grinding depth increasing, while the trend of increase corresponding that of workpiece speed is more evident. The value of the surface roughness is decreased with wheel speed increasing. And it is found out that the main defect is burning of the IC10 superalloy material in creep feed grinding by energy spectrum analysis of some typical topography in this study.

Optimization of Process Parameters in Plasma Arc Cutting Applying Genetic Algorithm and Fuzzy Logic

2018 ◽  
pp. 123-139
Author(s):  
Nehal Dash ◽  
Apurba Kumar Roy ◽  
Sanghamitra Debta ◽  
Kaushik Kumar
Keyword(s):  
Genetic Algorithm ◽  
Surface Roughness ◽  
Fuzzy Logic ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Plasma Arc ◽  
Plasma Arc Cutting ◽  
Optimization Of Process Parameters

Plasma Arc Cutting (PAC) process is a widely used machining process in several fabrication, construction and repair work applications. Considering gas pressure, arc current and torch height as the inputs and among all possible outputs, in the present work Material Removal Rate and Surface Roughness would be considered as factors that determines the quality, machining time and machining cost. In order to reduce the number of experiments Design of Experiments (DOE) would be carried out. In later stages applications of Genetic Algorithm (GA) and Fuzzy Logic would be used for Optimization of process parameters in Plasma Arc Cutting (PAC). The output obtained would be minimized and maximized for Surface Roughness and Material Removal Rate respectively using Genetic Algorithm (GA) and Fuzzy Logic.

Experimental Investigation on Wafer Polishing of Oxide and Copper Layers

2002 ◽  
Author(s):  
Jhy-Cherng Tsai
Keyword(s):  
Process Parameters ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Back Pressure ◽  
Copper Layer ◽  
Wafer Polishing ◽  
Critical Technology ◽  
And Performance ◽  
Polishing Pressure

Polishing, in particular chemical-mechanical polishing (CMP), is a critical technology for the planarization of wafers. This paper investigates, via experiments, and compares the performance of CMP process with different process parameters for wafers with silicon-dioxide (SiO2) layer and for wafers with copper (Cu) layer. Polishing pressure (P), speed (V), and back pressure (BP) are used as process parameters in this study. Different pads and slurries are also experimented for copper layer as its properties are different from that of conventional oxide layer. Material removal rate (RR) and non-uniformity (NU) are used as indices to measure the performance. Experimental data on oxide layers show RR increases as P and V increase but NU gets worse at the same time. This condition can be improved, for both oxide and copper layers, with suitable BP. Experiments on copper CMP using slurry with abrasives show that RR increases with higher P and V. While NU gets worse with higher P, it can be reduced as V increases using a soft pad. Better NU can be obtained using soft pad though RR is lower in this case. For abrasive-free polishing of copper layer, RR, though relatively lower compared to CMP with regular slurry, is unstable using hard pad despite that NU becomes better at higher P. NU of polished wafer is best at certain pressure but becomes worse at low pressure for hard pad and at high P for soft pad. It is also observed that NU of AFP can be improved with BP and softer pad. Soft pad gives better polishing quality and performance though RR is lower than that using slurry with abrasives.

Multi Response Optimization of Process Parameters of Abrasive Water Jet Machining for Stainless Steel AISI 304 Using VIKOR Approach Coupled with Signal to Noise Ratio Methodology

2015 ◽  
Vol 14 (02) ◽  
pp. 107-121 ◽  
Author(s):  
Vedansh Chaturvedi ◽  
Diksha Singh
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Aisi 304 ◽  
Steel Aisi ◽  
Machining Characteristics ◽  
Stainless Steel Aisi ◽  
Experimental Runs

As the population of the world is continuously increasing, demand of the mechanical manufactured products is also increasing. Machining is the most important process in any mechanical manufacturing, and in machining two factors, i.e. material removal rate (MRR) and surface roughness (SR) are the most important responses. If the MRR is high, the product will get desired shape in minimum time so the production rate will be high, but we could not scarify with the surface finishing also because in close tolerance limit parts like in automobile industry, if the surface is rough exact fit cannot take place. The term optimization is intensively related to the field of quality engineering. Abrasive water jet machining is an important unconventional machining, in order to obtain better response, i.e. material removal rate and surface roughness. Various process parameters of AWJM need to be observed and selected to improve machining characteristics. Better machining characteristics can be achieved by optimizing various process parameters of AWJM. This study considers four process control parameters such as transverse speed, standoff distance, abrasive flow rate and water pressure. The response is taken to be material removal rate and surface roughness. The work piece for stainless steel AISI 304 material of size 15 cm × 10 cm × 2 cm is selected for experiments. Sixteen experimental runs (two trials for each experimental runs) were carried out for calculating MRR and SR and average value of these two trials have been taken for analysis. MRR is normalized according to higher-is-better and SR is normalized according to lower is better. The experiment data analysis is done and VIKOR index is found. Finally, the analysis of VIKOR index using S/N ratio is done and found the most significant factor for AWJM and predicted optimal parameters setting for higher material removal rate and lower surface roughness. Verification of the improvement in quality characteristics has been made through confirmation test with the predicted optimal parameters setting. It is found that the determined optimum combination of AWJM parameters gives the lowest VIKOR INDEX which shows the successful implementation of VIKOR Method coupled with S/N ratio in AWJM.

Influence of Flat Lapping Kinematics on Machinability of Ceramics

2013 ◽  
Vol 199 ◽  
pp. 615-620
Author(s):  
Adam Barylski ◽  
Mariusz Deja
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Shape Error ◽  
Roughness Parameters ◽  
Tool Wear Estimation ◽  
Machine Configuration ◽  
Lapping Machine

New tools for flat grinding of ceramics (Al2O3) are presented in the paper. Electroplated CBN tools (B64 and B107) were used in a modified single-disc lapping machine configuration. The results from experiments, such as the material removal rate and surface roughness parameters are presented and analyzed. Numerical simulations, based on the model for the shape error and tool wear estimation in machining with flat lapping kinematics, are also presented. The tool life of electroplated tools can be extended by choosing appropriate parameter K related to the process kinematics.

Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet

2014 ◽  
Vol 1027 ◽  
pp. 58-62
Author(s):  
Hai Feng Cheng ◽  
Li Jie Ma ◽  
Jian Guo Yao ◽  
Jian Xiu Su
Keyword(s):  
Stainless Steel ◽  
Process Parameters ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Rotational Velocity ◽  
Stainless Steel Sheet ◽  
Polishing Pressure ◽  
Abrasive Size

Chemical mechanical polishing (CMP) is the most effective technology to achieve ultra-smooth without damage surface in ultra-precision machining of stainless steel substrate. In this paper, according to the slurry ingredients obtained by former research, the influences of the CMP process parameters, such as the rotational velocity of the platen and the carrier, the polishing pressure and the abrasive size on the material removal rate (MRR), have been studied in CMP stainless steel substrate based on the alumina (Al2O3) abrasive. The research results show that the material removal rate increases with the increase of the abrasive size, the rotational velocity of the platen and the polishing pressure significantly and the surface roughness increases with the increase of the abrasive size. This study results will provide the reference for optimizing the process parameters and researching the material removal mechanism in CMP stainless steel sheet.

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