scholarly journals Isothermal Recombinase Polymerase Amplification (RPA) of E. coli gDNA in Commercially Fabricated PCB-Based Microfluidic Platforms

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1387
Author(s):  
Maria Georgoutsou-Spyridonos ◽  
Myrto Filippidou ◽  
Georgia D. Kaprou ◽  
Dimitrios C. Mastellos ◽  
Stavros Chatzandroulis ◽  
...  
Keyword(s):  
Target Genes ◽  
Printed Circuit Board ◽  
Point Of Care ◽  
Low Cost ◽  
Recombinase Polymerase Amplification ◽  
Circuit Board ◽  
Microfluidic Platforms ◽  
Seamless Integration ◽  
E Coli ◽  
First Time

Printed circuit board (PCB) technology has been recently proposed as a convenient platform for seamlessly integrating electronics and microfluidics in the same substrate, thus facilitating the introduction of integrated and low-cost microfluidic devices to the market, thanks to the inherent upscaling potential of the PCB industry. Herein, a microfluidic chip, encompassing on PCB both a meandering microchannel and microheaters to accommodate recombinase polymerase amplification (RPA), is designed and commercially fabricated for the first time on PCB. The developed microchip is validated for RPA-based amplification of two E. coli target genes compared to a conventional thermocycler. The RPA performance of the PCB microchip was found to be well-comparable to that of a thermocycler yet with a remarkably lower power consumption (0.6 W). This microchip is intended for seamless integration with biosensors in the same PCB substrate for the development of a point-of-care (POC) molecular diagnostics platform.

scholarly journals PCB-Based Magnetometer as a Platform for Quantification of Lateral-Flow Assays

Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5433 ◽  
Author(s):  
Mohammad Khodadadi ◽  
Long Chang ◽  
João R. C. Trabuco ◽  
Binh V. Vu ◽  
Katerina Kourentzi ◽  
...  
Keyword(s):  
High Precision ◽  
Fe3o4 Nanoparticles ◽  
Printed Circuit Board ◽  
Test Line ◽  
Point Of Care ◽  
Low Cost ◽  
Superparamagnetic Iron Oxide ◽  
High Sensitivity ◽  
Lateral Flow ◽  
Circuit Board

This work presents a proof-of-concept demonstration of a novel inductive transducer, the femtoMag, that can be integrated with a lateral-flow assay (LFA) to provide detection and quantification of molecular biomarkers. The femtoMag transducer is manufactured using a low-cost printed circuit board (PCB) technology and can be controlled by relatively inexpensive electronics. It allows rapid high-precision quantification of the number (or amount) of superparamagnetic nanoparticle reporters along the length of an LFA test strip. It has a detection limit of 10−10 emu, which is equivalent to detecting 4 ng of superparamagnetic iron oxide (Fe3O4) nanoparticles. The femtoMag was used to quantify the hCG pregnancy hormone by quantifying the number of 200 nm magnetic reporters (superparamagnetic Fe3O4 nanoparticles embedded into a polymer matrix) immuno-captured within the test line of the LFA strip. A sensitivity of 100 pg/mL has been demonstrated. Upon further design and control electronics improvements, the sensitivity is projected to be better than 10 pg/mL. Analysis suggests that an average of 109 hCG molecules are needed to specifically bind 107 nanoparticles in the test line. The ratio of the number of hCG molecules in the sample to the number of reporters in the test line increases monotonically from 20 to 500 as the hCG concentration increases from 0.1 ng/mL to 10 ng/mL. The low-cost easy-to-use femtoMag platform offers high-sensitivity/high-precision target analyte quantification and promises to bring state-of-the-art medical diagnostic tests to the point of care.

scholarly journals Characterization of Inkjet-Printed Digital Microfluidics Devices

Sensors ◽  
2021 ◽  
Vol 21 (9) ◽  
pp. 3064
Author(s):  
Shiyu Chen ◽  
Zhidong He ◽  
Suhwan Choi ◽  
Igor V. Novosselov
Keyword(s):  
Printed Circuit Board ◽  
Dielectric Breakdown ◽  
Point Of Care ◽  
Low Cost ◽  
Digital Microfluidics ◽  
Actuation Voltage ◽  
Circuit Board ◽  
Pmma Layer ◽  
Design Iteration ◽  
Droplet Movement

Digital microfluidics (DMF) devices enable precise manipulation of small liquid volumes in point-of-care testing. A printed circuit board (PCB) substrate is commonly utilized to build DMF devices. However, inkjet printing can be used to fabricate DMF circuits, providing a less expensive alternative to PCB-based DMF designs while enabling more rapid design iteration cycles. We demonstrate the cleanroom-free fabrication process of a low-cost inkjet-printed DMF circuit. We compare Kapton and polymethyl methacrylate (PMMA) as dielectric coatings by measuring the minimal droplet actuation voltage for a range of actuation frequencies. A minimum actuation voltage of 5.6 V was required for droplet movement with the PMMA layer thickness of 0.2 μm and a hydrophobic layer of 0.17 μm. Significant issues with PMMA dielectric breakdown were observed at actuation voltages above 10 V. In comparison, devices that utilized Kapton were found to be more robust, even at an actuation voltage up to 100 V.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

EFFECT OF HYDROTHERMAL TIME ON THE GROWTH OF ZnO NANORODS

2020 ◽  
pp. 84-91
Author(s):  
Hanh
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Zinc Nitrate ◽  
Circuit Board ◽  
Nitrate Hexahydrate ◽  
Hydrothermal Time ◽  
One Step ◽  
Surface Morphologies

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.

scholarly journals A Novel Microfluidic Point-of-Care Biosensor System on Printed Circuit Board for Cytokine Detection

Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 4011 ◽  
Author(s):  
Daniel Evans ◽  
Konstantinos Papadimitriou ◽  
Nikolaos Vasilakis ◽  
Panagiotis Pantelidis ◽  
Peter Kelleher ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Point Of Care ◽  
Reference Electrode ◽  
Circuit Board ◽  
Enzyme Linked Immunosorbent Assay ◽  
Interferon Gamma Release Assay ◽  
Counter Electrodes ◽  
Printed Circuit ◽  
Cytokine Detection ◽  
Biosensor System

Point of Care (PoC) diagnostics have been the subject of considerable research over the last few decades driven by the pressure to detect diseases quickly and effectively and reduce healthcare costs. Herein, we demonstrate a novel, fully integrated, microfluidic amperometric enzyme-linked immunosorbent assay (ELISA) prototype using a commercial interferon gamma release assay (IGRA) as a model antibody binding system. Microfluidic assay chemistry was engineered to take place on Au-plated electrodes within an assay cell on a printed circuit board (PCB)-based biosensor system. The assay cell is linked to an electrochemical reporter cell comprising microfluidic architecture, Au working and counter electrodes and a Ag/AgCl reference electrode, all manufactured exclusively via standard commercial PCB fabrication processes. Assay chemistry has been optimised for microfluidic diffusion kinetics to function under continual flow. We characterised the electrode integrity of the developed platforms with reference to biological sampling and buffer composition and subsequently we demonstrated concentration-dependent measurements of H2O2 depletion as resolved by existing FDA-validated ELISA kits. Finally, we validated the assay technology in both buffer and serum and demonstrate limits of detection comparable to high-end commercial systems with the addition of full microfluidic assay architecture capable of returning diagnostic analyses in approximately eight minutes.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

A PCB Sensor for Magnetic Materials

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 001323-001342
Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham
Keyword(s):  
Magnetic Materials ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Complex Impedance ◽  
Corrosion Products ◽  
Physical Contact ◽  
Circuit Board ◽  
Sensor Technology ◽  
Printed Circuit ◽  
Surrounding Environment

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

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