scholarly journals Study on the Electrorheological Ultra-Precision Polishing Process with an Annular Integrated Electrode

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1235
Author(s):  
Cheng Fan ◽  
Yigang Chen ◽  
Yucheng Xue ◽  
Lei Zhang
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Applied Voltage ◽  
Abrasive Particle ◽  
Polishing Process ◽  
Workpiece Surface ◽  
Orthogonal Experiments ◽  
Single Process ◽  
Ultra Precision ◽  
Polishing Tool

Electrorheological (ER) polishing, as a new ultra-precision super-effect polishing method, provides little damage to the workpiece surface and is suitable for polishing all kinds of small and complex curved surface workpieces. In this paper, an ER polishing tool with an annular integrated electrode is developed. The orthogonal experiments are carried out on the six influencing factors of ER polishing which include the applied voltage, the abrasive particle size, the abrasive concentration, the polishing gap, the polishing time and the tool spindle speed. The influence order of these six factors on the ER polishing is obtained. On this basis, the effect of a single process parameter of ER polishing on surface roughness is studied experimentally.

Preparation and Processing Performance of Viscoelastic Abrasive Flow

2013 ◽  
Vol 546 ◽  
pp. 55-59
Author(s):  
Lu Yang ◽  
Ke Hua Zhang ◽  
Guang Zhen Zheng ◽  
Hang Guo
Keyword(s):  
Surface Roughness ◽  
Silicon Carbide ◽  
Particle Size ◽  
Silicone Oil ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Viscosity Coefficient ◽  
Advanced Technology ◽  
Dielectric Characteristics ◽  
Workpiece Surface

Abstract. Abrasive flow machining (AFM) is an advanced technology which can improve the uniform consistency of profiled surface. First, the dielectric characteristics of the abrasive flow (the medium features include medium types, medium viscosity coefficient, the concentration of medium and abrasive, abrasive type, abrasive size) is studied, abrasive flow including different medium is deployed by mixing and mix well of the polymer silicone fluid, silicone oil, wax, and other fats, and adding silicon carbide with different particle size and mixed for processing experiment. Within the limits of the workpiece polishing, the change direction of the surface roughness and the removal rate of workpiece surface are substantially same and approaching the linear relationship, the lowest surface roughness Ra of SiC (abrasive particle size is 200#) reduced from 3.5μm to 0.5μm. The hardness and durability of the silicon carbide abrasive in this study is quite good, and the price is low, the processing characteristics are quite consistent with the economic costs on the demand.

Research on Ultra Precision Mirror Machining Technology for Aluminum Alloy Mobile Phone Shell

2013 ◽  
Vol 797 ◽  
pp. 385-389
Author(s):  
Jia Liang Guan ◽  
Xiao Hui Zhang ◽  
Xin Qiang Ma ◽  
Zhi Wei Wang ◽  
Li Li Zhu
Keyword(s):  
Experimental Study ◽  
Surface Roughness ◽  
Particle Size ◽  
Aluminum Alloy ◽  
Mobile Phone ◽  
Surface Quality ◽  
Abrasive Particle ◽  
Ultra Precision ◽  
Main Factors ◽  
Polishing Pressure

In this paper, the ultra-precision mirror polishing technology was adopted for mirror processing experimental study of Aluminum Alloy mobile phone shell. The experiments show that: polishing pressure, Grinding disc speed, the texture and hardness of polishing pad and abrasive particle size are the main factors to affect the surface quality. Through to optimize these parameters matching combination, can effectively improve the surface quality and reduce the surface roughness and obtain surface roughness is Ra0.026μm.

scholarly journals A curious observation of phenomena occurring during lapping/polishing processes

2019 ◽  
Vol 475 (2230) ◽  
pp. 20190304 ◽  
Author(s):  
Yue Yang ◽  
Haonan Li ◽  
Zhirong Liao ◽  
Dragos Axinte
Keyword(s):  
Surface Roughness ◽  
Surface Morphology ◽  
Motion Capture ◽  
Manufacturing Processes ◽  
Motion Capture System ◽  
Polishing Process ◽  
Workpiece Surface ◽  
Modelling Framework ◽  
Process Outcomes ◽  
Polishing Tool

We demonstrate that the kinematics of the polishing process is more intriguing than an idealized planetary movement as all the previous studies reported. In reality, the workpiece is pseudo-constrained by the planetary carrier and because of this its relative motion to the polishing pad also incurs a ‘parasitic’ movement that previously has not been observed. Here, we report and model this parasitic movement and quantify its effect upon the workpiece surface roughness. Using a motion capture system, the principal and ‘parasitic’ movements between the sample and polishing tool have been tracked and our models validated. It is proved that considering this parasitic movement the prediction of workpiece surface morphology can be significantly improved when compared with the idealized approach (i.e. planetary). Our observations and modelling framework open the avenue to carefully consider the compliance between the tools and workpiece in other manufacturing processes for accurate predictions of the process outcomes.

Experimental Research on Flexible Polishing by Compound Diamond Powder

2016 ◽  
Vol 1136 ◽  
pp. 484-489
Author(s):  
Rui Le Xiang ◽  
Tian Feng Zhou ◽  
Zhi Qiang Liang ◽  
Xi Bin Wang
Keyword(s):  
Surface Roughness ◽  
Efficient Method ◽  
Incident Angle ◽  
Diamond Powder ◽  
Polishing Process ◽  
Workpiece Surface ◽  
Abrasive Grains ◽  
Surface Polishing ◽  
Ultra Precision ◽  
Flexible Base

Surface polishing is an important technique in the precision/ultra-precision process, especially in the optical industry. This paper introduces a new polishing method named Flexible Polishing by Compound Diamond Powder (FPCDP), in which the polishing abrasive grains are made of a kind of compound particles with flexible base and abrasive diamond powder. In FPCDP process, the compound abrasive grains are jetted onto the workpiece surface with an accelerated speed at an incident angle, and the micro irregularities on the workpiece surface are removed during the scratching, rolling and ploughing by the compound abrasive grains. The mechanism of polishing process is analyzed and the machining condition is optimized by experiments, which shows that FPCDP is an efficient method to improve the glass surface roughness.

Material Removal and Application by Chemical Impact Reaction in Nano-Abrasive Jet Polishing

2013 ◽  
Vol 631-632 ◽  
pp. 550-555
Author(s):  
Wen Qiang Peng ◽  
Sheng Yi Li ◽  
Chao Liang Guan ◽  
Xin Min Shen
Keyword(s):  
Material Removal ◽  
Abrasive Particle ◽  
Precision Machining ◽  
Optical Surface ◽  
Polishing Process ◽  
Abrasive Particles ◽  
Mechanical Process ◽  
Abrasive Jet Polishing ◽  
Ultra Precision ◽  
Machining Properties

Material removed by mechanical process inevitably causes surface or subsurface damage containing cracks, plastic scratch, residual stress or dislocations. In nano-abrasive jet polishing (NAJP) the material is removed by chemical impact reaction. The chemical impact reaction is validated by contrast experiment with traditional lap polishing process in which the material is mainly removed through mechanical process. Experiment results show the dependence of the abrasive particles on the choice of materials. Even if the abrasive particle and the workpiece are composed of similar components, the machining properties are remarkably different due to slight differences in their physical properties or crystallography etc. Plastic scratches on the sample which was polished by the traditional mechanical process are completely removed by NAJP process, and the surface root-square-mean roughness has decreased from 1.403nm to 0.611nm. The NAJP process will become a promising method for ultra precision machining method for ultrasmooth optical surface.

Fundamental Studies on the Mechanisms of Oxide CMP

2000 ◽  
Vol 613 ◽  
Author(s):  
Uday Mahajan ◽  
Seung-Mahn Lee ◽  
Rajiv K. Singh
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Wear Rate ◽  
Removal Rate ◽  
Polished Surface ◽  
Electrostatic Repulsion ◽  
Polishing Process ◽  
Negative Surface ◽  
Negative Surface Charge ◽  
Slurry Stability

ABSTRACTIn this paper, results of studies on the addition of salt to a polishing slurry, in terms of its effect on slurry stability, SiO2 polishing rate and surface roughness of the polished surface are presented. Three salts, viz. LiCl, NaCl and KCl were selected, and three concentrations were tested. Polishing rate measurements using these slurries show that adding salt leads to increased removal rate without affecting surface roughness significantly. Based on these results, we can say that the agglomerates formed by adding salt to the slurry are fairly soft and easily broken during the polishing process. In addition, turbidity and particle size measurements show that significant coagulation of the particles in the slurry occurs only at the highest salt concentration, and is fastest for LiCl and NaCl, with KCl showing the slowest coagulation. From these results, it can be concluded that the enhancement in polish rate is due to increased contact at the wafer-pad-slurry interface, and not due to formation of larger agglomerated particles in the slurry. This is because of reduced electrostatic repulsion between these three surfaces, due to the screening of their negative surface charge by the metal ions in solution, resulting in a higher wear rate.

A Study on Surface Quality of GaN with CMP Polishing Process

2011 ◽  
Vol 291-294 ◽  
pp. 1764-1767
Author(s):  
Wei Li ◽  
Ming Ming Ma ◽  
Bin Hu
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Gallium Nitride ◽  
Surface Quality ◽  
Chemical Reaction ◽  
Experimental Result ◽  
Precision Machining ◽  
Polishing Process

This paper introduced a polishing process for planarization of gallium nitride (GaN) wafer by polishing slurry that is made up by the chemical reaction with H2O2 solution and iron. Some different polishing parameters in the polishing process has been analyzed, which affect the surface quality of wafers, such as slurry particle size, polishing times, polishing slurry etc., and trying to improve the polishing process by optimization of the polishing parameters. The experimental result showed that this polishing method has an effect on the surface quality of GaN wafers, finally, the efficient and precision machining with surface roughness of GaN wafers of Ra0.81 nm has been gained by the CMP polishing process.

scholarly journals Study on high quality surface finishing technology of pre-spinning nozzle in additive manufacturing

2021 ◽  
Vol 39 (2) ◽  
pp. 334-340
Author(s):  
Weiwei Liu ◽  
Qian Lyu ◽  
Liming Lei ◽  
Yanhao Hou ◽  
Lei Shi
Keyword(s):  
Surface Roughness ◽  
Additive Manufacturing ◽  
Abrasive Particle ◽  
Processing Parameters ◽  
Surface Finishing ◽  
Range Analysis ◽  
Typical Structure ◽  
Surface Polishing ◽  
Before And After ◽  
Polishing Tool

Through the simulation of abrasive flow in the inner cavity of the superalloy pre-spinning nozzle made by additive manufacturing, the special abrasive polishing tool is optimized and the surface polishing technology of the inner cavity of typical structure test pieceis studied. Through comparison of the surface morphology before and after polishing, it can be concluded that the abrasive flow has a considerable removal effect on the powder sticking effect, spheroidizing effect, step effect, slag hanging phenomenon and residual support on the surface of parts, but it has a limited effect on the surface pit of the substrate. After polishing, the surface roughness of the inner cavity of parts decreasea from Ra 3.1397 μm to Ra 0.5805 μm, and the surface roughness of blade position decreases from Ra 4.8473 μm to Ra 0.3606 μm. Through the range analysis, it is found that the effect intensity of the processing parameters on the surface roughness of the parts is in order of the processing time, processing pressure and abrasive particle size.

Model establishment of surface roughness and experimental investigation on magnetorheological finishing for polishing the internal surface of titanium alloy tubes

2020 ◽  
pp. 1045389X2093009
Author(s):  
Zhen Peng ◽  
Wan-Li Song ◽  
Cui-Li Ye ◽  
Pei Shi ◽  
Seung-Bok Choi
Keyword(s):  
Surface Roughness ◽  
Titanium Alloy ◽  
Internal Surface ◽  
Initial Surface ◽  
Polishing Process ◽  
Indentation Force ◽  
Rotation Motion ◽  
Surface Precision ◽  
Polishing Tool ◽  
Magnetorheological Polishing

A novel magnetorheological polishing process is devised to polish the internal surface of titanium alloy tubes. Under the magnetic field in polishing area between the internal surface of tube and polishing head, magnetorheological polishing fluid gets stiffened and acts as the polishing tool. In this process, rotation motion of tube and reciprocating linear motion of polishing head are carried out simultaneously resulting in helical motion trajectory of abrasive particles on workpiece surface. The finishing forces during magnetorheological polishing process including normal indentation force and shear force are analyzed and modeled. Based on the proposed model, final surface roughness Ra model is proposed to predict the polishing performance. Experiments are carried out to investigate the effect of polishing time and initial surface roughness Ra on polishing performance. The experimental results are compared with the model results, which are highly consistent. The results show a gradual growth of surface precision with polishing time and an augment of polishing efficiency with increasing initial surface roughness Ra.

scholarly journals Experimental study on polishing process of cylindrical roller bearings

2019 ◽  
Vol 52 (9-10) ◽  
pp. 1272-1281 ◽  
Author(s):  
Duc Nam Nguyen ◽  
Ngoc Le Chau ◽  
Thanh-Phong Dao ◽  
Chander Prakash ◽  
Sunpreet Singh
Keyword(s):  
Experimental Study ◽  
Surface Roughness ◽  
Taguchi Method ◽  
Abrasive Particle ◽  
Particle Sizes ◽  
Machining Parameters ◽  
Polishing Process ◽  
Bearing Life ◽  
Optimal Surface ◽  
Cylindrical Roller

The surface quality and accuracy of the geometry of the cylindrical rollers are important factors for bearing life. This paper presents effects of machining parameters on the surface roughness, topography and roundness of cylindrical rollers through the lapping and polishing experiments. And then the surface roughness of the cylindrical rollers is optimized. The results found that the surface roughness of rollers is significantly changed in lapping process with different abrasive particle sizes, while the surface roughness has slightly reduced in polishing process. It also indicated that the smoother surfaces with better roughness can be obtained after lapping and polishing process. In addition, the surface roughness of cylindrical rollers is rapidly reduced from Ra of 0.5 µm to Ra of 0.063 µm after the 3-h lapping process and Ra of 0.013 µm after the 1-h polishing process. The surface topography of rollers can be achieved by the smoother surface when loads are from 25 to 35 N in lapping process, and the loads are from 35 to 40 N in polishing process. Finally, the Taguchi method is applied to optimize the surface roughness in polishing process. The result found that the optimal surface roughness achieves 0.015 µm with respect to the time of 35 min and type of 4000# Al2O3.

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