scholarly journals Visualization Experimental Study on Silicon-Based Ultra-Thin Loop Heat Pipe Using Deionized Water as Working Fluid

Micromachines ◽  
2021 ◽  
Vol 12 (9) ◽  
pp. 1080
Author(s):  
Wenzhe Song ◽  
Yanfeng Xu ◽  
Lihong Xue ◽  
Huajie Li ◽  
Chunsheng Guo
Keyword(s):  
Heat Pipe ◽  
Heat Dissipation ◽  
Experimental System ◽  
High Heat ◽  
Deionized Water ◽  
Working Fluid ◽  
Stable Operation ◽  
High Heat Flux ◽  
Loop Heat Pipe ◽  
Silicon Based

As a type of micro flat loop heat pipe, s-UTLHP (silicon-based ultra-thin loop heat pipe) is of great significance in the field of micro-scale heat dissipation. To prove the feasibility of s-UTLHP with high heat flux in a narrow space, it is necessary to study its heat transfer mechanism visually. In this paper, a structural design of s-UTLHP was proposed, and then, to realize the working fluid charging and visual experiment, an experimental system including a holding module, heating module, cooling module, data acquisition module, and vacuum chamber was proposed. Deionized water was selected as a working fluid in the experiment. The overall and micro phenomena of s-UTLHP during startup, as well as the evaporation and condensation phenomena of s-UTLHP during stable operation, were observed and analyzed. Finally, the failure phenomenon of s-UTLHP was analyzed, and several solutions were proposed. The observed phenomena and experimental conclusions can provide references for further related experimental research.

scholarly journals Experimental Study on Thermal Performance of Loop Heat Pipe with Flat-Rectangular Evaporator Under Gravity Assisted Condition

2018 ◽  
Vol 1 (2) ◽  
pp. 40-46
Author(s):  
Hien Phuoc Huynh ◽  
Htoo Zin Kyaw ◽  
Keishi Kariya ◽  
Akio Miyara
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Electronics Cooling ◽  
High Heat ◽  
Heating Power ◽  
Working Fluid ◽  
Stable Operation ◽  
Loop Heat Pipe ◽  
Conventional Cooling

In company with extreme developments of electronic devices, there are some unavoidable challenges to the conventional cooling methods such as high heat dissipation, limitation of cooling space, reliable operation as well as saving energy consumption. Therefore, the necessity of studying on new or how to improve the existing technologies is undoubted. Among various methodologies, the loop heat pipe (LHP) whose operation principle base on phase changing process, can be considered as one of the potential solutions of modern electronics cooling. This paper introduces the experimental investigation on the thermal performance of a flat-rectangular evaporator LHP with sintered stainless-steel wick when functioning under gravity assisted condition. Working fluid of this LHP was water. The present LHP could maintain stable operation in the range of heating power from 50 W to 520 W and keep the temperature on the heater’s top surface at 85oC, commonly recommended as the limitation temperature of electronics, when heating power reaches value 350 W (129.6 kW/m2). Besides, when turning the heater off, it took about 15 minutes for the LHP to cool the heating block from 102oC to 37oC. In addition, an assumption of the boiling heat transfer is introduced in this paper to explain the performance of evaporator at different heat flux conditions of the experiment. 

Investigation of Loop Heat Pipe Startup Using Liquid Core Visualization

2008 ◽  
Author(s):  
B. P. d’Entremont ◽  
J. M. Ochterbeck
Keyword(s):  
Heat Pipe ◽  
Liquid Core ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Buoyancy Driven Flows ◽  
Compensation Chamber ◽  
Fill Level ◽  
Heat Loads

In this investigation, a Loop Heat Pipe (LHP) evaporator has been studied using a borescope inserted through the compensation chamber into the liquid core. This minimally intrusive technique allows liquid/vapor interactions to be observed throughout the liquid core and compensation chamber. A low conductivity ceramic was used for the wick and ammonia as the working fluid. Results indicate that buoyancy driven flows, both two-phase and single-phase, play essential roles in evacuating excess heat from the core, which explains the several differences in performance between horizontal and vertical orientations of the evaporator. This study also found no discernable effect of the pre-start fill level of the compensation chamber on thermal performance during startup at moderate and high heat loads.

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

2005 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Thermal Control ◽  
Capillary Forces ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Wick Structure ◽  
Flat Evaporator ◽  
Heat Loads

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.

Working Fluid Inventory Effect on Heat Transfer Performance of a Grooved Micro Heat Pipe

2013 ◽  
Vol 589-590 ◽  
pp. 559-564
Author(s):  
Xi Bing Li ◽  
Yun Shi Ma ◽  
Xun Wang ◽  
Ming Li
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Mathematic Model ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Flux Concentration

As a highly efficient heat transfer component, a micro heat pipe (MHP) has been widely applied to the situations with high heat flux concentration. However, a MHPs heat transfer performance is affected by many factors, among which, working fluid inventory has great influence on the security, reliability and frost resistance of its heat transfer performance. In order to determine the appropriate working fluid inventory for grooved MHPs, this paper first analyzed the working principle, major heat transfer limits and heat flux distribution law of grooved MHPs in electronic chips with high heat flux concentration, then established a mathematic model for the working fluid inventory in grooved MHPs. Finally, with distilled water being the working fluid, a series of experimental investigations were conducted at different temperatures to test the heat transfer performances of grooved MHPs, which were perfused with different inventories and with different adiabatic section lengths. The experimental results show that when the value of α is roughly within 0.40±0.05, a grooved MHP can acquire its best heat transfer performance, and the working fluid inventory can be determined by the proposed mathematic model. Therefore this study solves the complicated problem of determining appropriate working fluid inventory for grooved MHPs.

A Mathematical Modeling Method for Capillary Limit of Micro Heat Pipe with Sintered Wick

2011 ◽  
Vol 175 ◽  
pp. 335-341
Author(s):  
Xi Bing Li ◽  
Chang Long Yang ◽  
Gong Di Xu ◽  
Wen Yuan ◽  
Shi Gang Wang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
High Heat ◽  
Experimental Investigations ◽  
High Heat Flux ◽  
Micro Heat Pipe ◽  
Copper Powders ◽  
Capillary Limit

With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

Analysis of the Evaporating Characteristics of the Grooved Micro Heat Pipe with Alkali Metals as Working Fluid

2012 ◽  
Vol 516-517 ◽  
pp. 84-87 ◽  
Author(s):  
Lei Yu ◽  
Wei Qiang Liu
Keyword(s):  
Thin Film ◽  
Mathematical Model ◽  
Heat Flux ◽  
Heat Pipe ◽  
Alkali Metals ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Working Fluids ◽  
High Temperature Heat Pipe

This paper has built a mathematical model for the evaporating characteristics of the grooved micro heat pipe’s thin film region and computed them in a specific working condition. The evaporating model of Wayner was employed in this mathematical model. The results from computation showed, for the H2O and NH3 as working fluid, at the beginning of the thin film region, the heat flux raised rapidly to a peak value and then declined to almost 0 also rapidly in a very short distance. Differently, for the Na and K as working fluid, the heat flux raised quickly but declined slower. Therefore, the alkali metals working fluids had larger area of high heat flux covered. The results indicated that the alkali metals working fluid has better evaporating characteristics for the high-temperature heat pipe than normal working fluids.

Enhanced Pool Boiling With Ethanol at Subatmospheric Pressures for Electronics Cooling

2013 ◽  
Vol 135 (11) ◽  
Author(s):  
Ankit Kalani ◽  
Satish G. Kandlikar
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Pool Boiling ◽  
Saturation Temperature ◽  
Electronics Cooling ◽  
High Heat ◽  
Working Fluid ◽  
Practical Implementation ◽  
High Heat Flux ◽  
Cooling Systems

The growing trend in miniaturization of electronics has generated a need for efficient thermal management of these devices. Boiling has the ability to dissipate a high heat flux while maintaining a small temperature difference. A vapor chamber with pool boiling offers an effective way to provide cooling and to maintain temperature uniformity. The objective of the current work is to investigate pool boiling performance of ethanol on enhanced microchannel surfaces. Ethanol is an attractive working fluid due to its better heat transfer performance and higher heat of vaporization compared to refrigerants, and lower normal boiling point compared to water. The saturation temperature of ethanol can be further reduced to temperatures suitable for electronics cooling by lowering the pressure. Experiments were performed at four different absolute pressures, 101.3 kPa, 66.7 kPa, 33.3 kPa, and 16.7 kPa using different microchannel surface configurations. Heat dissipation in excess of 900 kW/m2 was obtained while maintaining the wall surface below 85 °C at 33 kPa. Flammability, toxicity, and temperature overshoot issues need to be addressed before practical implementation of ethanol-based cooling systems can occur.

Sign in / Sign up

Export Citation Format

Share Document