scholarly journals The Influence of Crystal Orientation on Subsurface Damage of Mono-Crystalline Silicon by Bound-Abrasive Grinding

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 365
Author(s):  
Wei Yang ◽  
Yaguo Li
Keyword(s):  
Surface Roughness ◽  
Crystal Orientation ◽  
Subsurface Damage ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Diamond Grit ◽  
Peripheral Speed ◽  
Damage Depth ◽  
The Impact ◽  
Subsurface Defects

Subsurface damage (SSD) produced in a grinding process will affect the performance and operational duration of single-crystal silicon. In order to reduce the subsurface damage depth generated during the grinding process by adjusting the process parameters (added), experiments were designed to investigate the influence of machining factors on SSD. This included crystal orientation, diamond grit size in the grinding wheel, peripheral speed of the grinding wheel, and feeding with the intention to optimize the parameters affecting SSD. Compared with isotropic materials such as glass, we considered the impact of grinding along different crystal directions <100> and <110> on subsurface damage depth (added). The Magnetorheological Finishing (MRF) spot technique was used to detect the depth of SSD. The results showed that the depth of SSD in silicon increased with the size of diamond grit. SSD can be reduced by either increasing the peripheral speed of the grinding wheel or decreasing the feeding rate of the grinding wheel in the <100> crystal orientation, if the same size of diamond grit was employed. In addition, we proposed a modified model around surface roughness and subsurface crack depth, which considered plastic and brittle deformation mechanisms and material properties of different crystal orientations. When the surface roughness (RZ) exceeded the brittle-plastic transition’s critical value RZC (RZC<100> > 1.5 μm, RZC<110> > 0.8 μm), cracks appeared on the subsurface. The experimental results were consistent with the predicted model, which could be used to predict the subsurface cracks by measuring the surface roughness. However, the model only gives the approximate range of subsurface defects, such as dislocations. The morphology and precise depth of plastic deformation subsurface defects, such as dislocations generated in the fine grinding stage, needed to be inspected by transmission electron microscopy (TEM), which were further studied.

scholarly journals Multi-Objective Optimization for Grinding Parameters of 20CrMnTiH Gear with Ceramic Microcrystalline Corundum

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1352 ◽  
Author(s):  
Shengyong Zhang ◽  
Genbao Zhang ◽  
Yan Ran ◽  
Zhichao Wang ◽  
Wen Wang
Keyword(s):  
Surface Roughness ◽  
Practical Significance ◽  
Grinding Wheel ◽  
Linear Regression Method ◽  
Grinding Process ◽  
Low Carbon ◽  
Multi Objective Optimization ◽  
Multi Objective ◽  
Grinding Parameters ◽  
The Impact

(1) The alloy material 20CrMnTiH is widely used in gear manufacturing, but difficult to process, and its quantity (efficiency) and quality (surface quality) are generally negative correlation indicators. As a difficult but realistic problem, it is of important practical significance to explore how to efficiently grind high-precision low-carbon alloy gear workpieces. (2) Firstly, the pixel method was applied to analyze the grinding principles and explore the grinding parameters—the grinding wheel speed and grinding wheel frame moving speed—as well as the feed rate, which impacts the grinding indicators. Secondly, based on the ceramic microcrystalline corundum grinding wheel and the 20CrMnTiH gear workpiece, controlled experiments with 28 groups of grinding parameters were conducted. Moreover, the impact curves of the grinding parameters on the grinding indicators—the grinding efficiency, grinding wheel life, and surface roughness—were obtained by the multiple linear regression method. Finally, the multi-objective optimization method was used to comprehensively optimize the grinding process. (3) Compared with the traditional grinding process, under optimized grinding parameters, the 20CrMnTiH gear workpieces have a lower surface roughness and a longer grinding wheel life, and require a shorter time to achieve grinding accuracy. (4) The grinding experiments showed that the grinding parameters are linearly related to the grinding indicators. The optimization results show that the precision, efficiency, and economy of the 20CrMnTiH gear grinding process have been improved via the comprehensive optimization of the grinding parameters.

Surface Layer Damage of Quartz Glass Induced by Ultra-Precision Grinding with Different Grit Size

2017 ◽  
Vol 872 ◽  
pp. 19-24
Author(s):  
Zong Chao Geng ◽  
Shang Gao ◽  
Ren Ke Kang ◽  
Zhi Gang Dong
Keyword(s):  
Surface Roughness ◽  
Quartz Glass ◽  
Subsurface Damage ◽  
Grinding Wheel ◽  
Precision Grinding ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Roughness Surface ◽  
Ultra Precision ◽  
Damage Depth

Quartz glass is a typical hard and brittle material. During the manufacturing process of quartz glass components, ultra-precision grinding is widely used due to its high throughput and good dimensional accuracies. However, grinding will unavoidably induce large surface and subsurface damage. In this study, the surface and subsurface damage characteristics of quartz glass substrates ground by diamond wheels with different grit sizes were investigated in terms of surface roughness, surface topography, subsurface microcrack characteristic, and subsurface damage depth. Discussion was also provided to explore corresponding reasons of surface and subsurface damage induced by diamond grinding wheels with different grit sizes of #1500 and #2000. The experiment results showed that the surface roughness, surface damage, and subsurface damage depth induced by #2000 quartz glass was ground by #1500 diamond grinding wheel, and in ductile mode when ground by #2000 diamond grinding wheel.

Investigation of surface/subsurface integrity and grinding force in grinding of BK7 glass

2016 ◽  
Vol 231 (12) ◽  
pp. 2349-2356 ◽  
Author(s):  
XH Lin ◽  
XL Ke ◽  
H Ye ◽  
CL Hu ◽  
YB Guo
Keyword(s):  
Surface Roughness ◽  
High Efficiency ◽  
Great Influence ◽  
Grinding Force ◽  
Subsurface Damage ◽  
Grinding Wheel ◽  
Grinding Parameters ◽  
Force Increase ◽  
Bk7 Glass ◽  
Damage Depth

The surface/subsurface integrity and grinding force formed during grinding processes of have been researched on BK7 glass using a surface grinder with diamond grinding wheel. The values of surface roughness, subsurface damage and grinding force were measured and the morphology of surface roughness, and subsurface damage were observed with different grinding parameters. The experimental results show that the values of surface roughness, subsurface damage and grinding force increase with the increasing of feed rate and grinding depth and decreasing of wheel speed. The effects trend of grinding parameters on surface roughness, subsurface damage and grinding force are almost the same and the normal grinding force have great influence on surface roughness and subsurface damage, which agree well with theoretical analysis. These relationships can serve as a useful method for non-destructively predicting subsurface damage depth and a theoretical basis for proposing the appropriate grinding parameters to obtain better surface/subsurface integrity and high efficiency.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

scholarly journals Evaluation of Grinding of Unfilled and Glass Fiber Reinforced Polyamide 6,6

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2288
Author(s):  
Roberto Spina ◽  
Bruno Cavalcante
Keyword(s):  
Surface Roughness ◽  
Glass Fiber ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Fiber Reinforced ◽  
Liquid Coolant ◽  
Part Quality ◽  
Glass Fiber Reinforced ◽  
Process Trends

This paper investigates the grinding process on unreinforced (PA66) and reinforced glass-fiber polyamide 6,6 (PA66 GF30) with Al2O3 and SiC abrasive wheels. Both materials were ground by varying rotations, workpiece infeed speed, depth of cuts for sequential roughing/finishing steps. Dry and liquid coolant conditions were also considered during the grinding process to evaluate the effects on part quality. The surface roughness was used to assess the quality of the final products with several parameter combinations, identifying the induced process trends. The results show that at the end of the finishing step, the surface roughness Rz was lower than 4 μm, attaining the lowest value of 1.34 μm for PA66 specimens. The analysis also suggested the choice of the Al2O3 grinding wheel to reach the lowest Rz values for both materials.

Study on the Grinding Process of Ceramic Zirconia Oxide Rod

2014 ◽  
Vol 575 ◽  
pp. 121-127
Author(s):  
Shinn Liang Chang ◽  
Dai Jia Juan ◽  
Bean Yin Lee ◽  
You Jhih Lin
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Rotation Speed ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Hard Machining ◽  
Grinding Machine ◽  
Diamond Grain ◽  
Zirconia Oxide

Grinding technology is used in this study to overcome the hard machining of ceramic with hard and brittle characteristics. The grinding machine with diamond grain size 25 and 5 , spindles speed 1720 rpm and 3450 rpm are applied. Combining the unintentional roll clamp and the grinding machine, ceramic rods can be ground to the desired size.In the research, surface profilometer is applied to measure the rod surface roughness of processing results under different conditions. The results show that the grinding wheel with finer particle, the roughness of the ground ceramic rod will be better. While the rotation speed of grinding wheel is increased, the surface roughness will have the same trend.

Improvement for Bearing Ring Grinding Process Based on Six Sigma Methods

2013 ◽  
Vol 423-426 ◽  
pp. 898-903
Author(s):  
Ming Yue Guo ◽  
Hong Liang Lou
Keyword(s):  
Tilt Angle ◽  
Six Sigma ◽  
Orthogonal Experiment ◽  
Outer Ring ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Roundness Error ◽  
Assessment Index ◽  
Bearing Ring ◽  
The Impact

In this paper, six sigma methods were used in bearing ring grinding process improvement. In the improvement, bearing outer ring roundness error was selected as the assessment index, and exsiting problems in grinding process were defined, roundness error of bearing outer ring was measured.One-way analysis of variance was applied to analyze the test results, it indicates that workpiece center height, guide wheel tilt angle and grinding wheel balance are the three main factors that affecting roundness error.According to this analysis, orthogonal experiment was designed. The results show that grinding wheel balance, guide wheel tilt angle and workpiece center height on the impact of roundness error are in descending order. On this basis, a series of measures were carried out to control these three parameters. Uitimately, the grinding process capability index is increased from 0.88 to 1.43, and the target of improvement are achieved.

Detailed Analysis and Description of Grinding Wheel Topographies

2017 ◽  
Vol 139 (5) ◽  
Author(s):  
Markus Weiß ◽  
Fritz Klocke ◽  
Sebastian Barth ◽  
Matthias Rasim ◽  
Patrick Mattfeld
Keyword(s):  
Detailed Analysis ◽  
Functional Properties ◽  
Quantitative Description ◽  
Cutting Edge ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Wheels ◽  
New Approach ◽  
Wheel Topography ◽  
The Impact

In this paper, an innovative approach for the description of the functional properties of a grinding wheel surface is discussed. First, the state of the art in the description of grinding wheel topographies is summarized. Furthermore, the fundamentals for a new approach for the quantitative description of grinding wheel topographies are provided. In order to analyze the functional properties of a grinding wheel's topography depending on its specification, grinding experiments were carried out. For the experimental investigations vitrified, synthetic resin bonded and electroplated grinding wheels with varied compositions were analyzed. During the experiments, the topographies of the investigated grinding wheels have been analyzed by means of the topotool in detail. The developed software tool allows a detailed description of the kinematic cutting edges depending on the grinding process parameters and the grinding wheel specification. In addition to the calculation of the number of kinematic cutting edges and the area per cutting edge, a differentiation of the cutting edge areas in normal and tangential areas of the grinding wheel's circumferential direction is implemented. Furthermore, the topotool enables to analyze the kinematic cutting edges shape by calculating the angles of the grain in different directions. This enables a detailed analysis and a quantitative comparison of grinding wheel topographies related to different grinding wheel specifications. In addition, the influence of the dressing process and wear conditions to the grinding wheel topography can be evaluated. The new approach allows a better characterization of the contact conditions between grinding wheel and workpiece. Hence, the impact of a specific topography on the grinding process behavior, the generated grinding energy distribution, and the grinding result can be revealed.

scholarly journals Relations between subsurface damage depth and surface roughness of grinded fused silica

2013 ◽  
Vol 21 (25) ◽  
pp. 30433 ◽  
Author(s):  
P. Blaineau ◽  
R. Laheurte ◽  
P. Darnis ◽  
N. Darbois ◽  
O. Cahuc ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Fused Silica ◽  
Subsurface Damage ◽  
Damage Depth

Effects of Relative Velocity on Grinding Performances under Si Wafer Rotary Grinding

2016 ◽  
Vol 874 ◽  
pp. 395-400
Author(s):  
Jumpei Kusuyama ◽  
Takayuki Kitajima ◽  
Akinori Yui ◽  
Toshihiro Ito
Keyword(s):  
Surface Roughness ◽  
Power Consumption ◽  
Relative Velocity ◽  
Velocity Ratio ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Wafer Thickness ◽  
Grinding Conditions ◽  
The Difference ◽  
Si Wafer

For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum at the center of wafer. Generally, the grinding performances are discussed in terms of the ratio of the rotational speeds of the grinding wheel and the wafer. However, it is not possible to use this ratio to determine the grinding conditions for different wafer sizes grinding as this ratio does not show the difference in relative velocity. Therefore, a new relative velocity ratio was defined in this study. Then, the Si wafer grinding was performed to investigate the effect of the surface roughness and the power consumption of the grinding wheel spindle on the relative velocity ratio.

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