scholarly journals Dry Film Photoresist-Based Microfabrication: A New Method to Fabricate Millimeter-Wave Waveguide Components

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 260
Author(s):  
Sadia Farjana ◽  
Mohamadamir Ghaderi ◽  
Sofia Rahiminejad ◽  
Sjoerd Haasl ◽  
Peter Enoksson
Keyword(s):  
Millimeter Wave ◽  
Low Cost ◽  
Fabrication Method ◽  
Geometrical Structures ◽  
Passive Components ◽  
Waveguide Components ◽  
Silicon Based ◽  
Q Values ◽  
Dry Film ◽  
Dry Film Photoresist

This paper presents a novel fabrication method based on dry film photoresists to realize waveguides and waveguide-based passive components operating at the millimeter-wave frequency (30–300 GHz). We demonstrate that the proposed fabrication method has a high potential as an alternative to other microfabrication technologies, such as silicon-based and SU8-based micromachining for realizing millimeter-wave waveguide components. Along with the nearly identical transfer of geometrical structures, the dry film photoresist offers other advantages such as fewer processing steps, lower production cost, and shorter prototyping time over the conventional micromachining technologies. To demonstrate the feasibility of the fabrication process, we use SUEX dry film to fabricate a ridge gap waveguide resonator. The resonator is designed to exhibit two resonances at 234.6 and 284 GHz. The measured attenuation at 234 GHz is 0.032 dB/mm and at 283 GHz is 0.033 dB/mm for the fabricated prototype. A comparative study among different existing technologies indicates that the reported method can give a better unloaded Q-value than other conventional processes. The measured unloaded Q-values are in good agreement with the simulated unloaded Q-values. The signal attenuation indicates that SUEX dry film photoresists can be used to fabricate passive devices operating at millimeter-wave frequencies. Moreover, this new fabrication method can offer fast and low-cost prototyping.

scholarly journals Low-cost multilevel microchannel lab on chip: DF-1000 series dry film photoresist as a promising enabler

RSC Advances ◽  
2014 ◽  
Vol 4 (97) ◽  
pp. 54847-54853 ◽  
Author(s):  
R. Courson ◽  
S. Cargou ◽  
V. Conedera ◽  
M. Fouet ◽  
M. C. Blatche ◽  
...  
Keyword(s):  
Low Cost ◽  
Lab On Chip ◽  
On Chip ◽  
Dry Film ◽  
Dry Film Photoresist

A low-cost fabrication method for sub-millimeter wave GaAs Schottky diode

2017 ◽  
Vol 32 (10) ◽  
pp. 105006
Author(s):  
Sarvenaz Jenabi ◽  
Dominic Deslandes ◽  
Francois Boone ◽  
Serge A Charlebois
Keyword(s):  
Millimeter Wave ◽  
Schottky Diode ◽  
Low Cost ◽  
Fabrication Method

scholarly journals Fabrication of Porous Silicon Based Humidity Sensing Elements on Paper

2015 ◽  
Vol 2015 ◽  
pp. 1-10 ◽  
Author(s):  
Tero Jalkanen ◽  
Anni Määttänen ◽  
Ermei Mäkilä ◽  
Jaani Tuura ◽  
Martti Kaasalainen ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Smart Cities ◽  
Low Cost ◽  
Electrical Characterization ◽  
Fabrication Process ◽  
Sensing Element ◽  
Paper Substrate ◽  
Roll To Roll ◽  
Silver Electrodes ◽  
Silicon Based

A roll-to-roll compatible fabrication process of porous silicon (pSi) based sensing elements for a real-time humidity monitoring is described. The sensing elements, consisting of printed interdigitated silver electrodes and a spray-coated pSi layer, were fabricated on a coated paper substrate by a two-step process. Capacitive and resistive responses of the sensing elements were examined under different concentrations of humidity. More than a three orders of magnitude reproducible decrease in resistance was measured when the relative humidity (RH) was increased from 0% to 90%. A relatively fast recovery without the need of any refreshing methods was observed with a change in RH. Humidity background signal and hysteresis arising from the paper substrate were dependent on the thickness of sensing pSi layer. Hysteresis in most optimal sensing element setup (a thick pSi layer) was still noticeable but not detrimental for the sensing. In addition to electrical characterization of sensing elements, thermal degradation and moisture adsorption properties of the paper substrate were examined in connection to the fabrication process of the silver electrodes and the moisture sensitivity of the paper. The results pave the way towards the development of low-cost humidity sensors which could be utilized, for example, in smart packaging applications or in smart cities to monitor the environment.

scholarly journals Major Impediment to Highly Efficient, Stable and Low-Cost Perovskite Solar Cells

Metals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 964 ◽  
Author(s):  
Yue Zhang ◽  
Haiming Zhang ◽  
Xiaohui Zhang ◽  
Lijuan Wei ◽  
Biao Zhang ◽  
...  
Keyword(s):  
Solar Cells ◽  
Carrier Mobility ◽  
High Efficiency ◽  
Low Cost ◽  
Perovskite Solar Cells ◽  
Environmental Stability ◽  
Perovskite Materials ◽  
Hybrid Perovskite ◽  
Silicon Based ◽  
Major Impediment

Organic–inorganic hybrid perovskite solar cells (PSCs) have made immense progress in recent years, owing to outstanding optoelectronic properties of perovskite materials, such as high extinction coefficient, carrier mobility, and low exciton binding energy. Since the first appearance in 2009, the efficiency of PSCs has reached 23.3%. This has made them the most promising rival to silicon-based solar cells. However, there are still several issues to resolve to promote PSCs’ outdoor applications. In this review, three crucial aspects of PSCs, including high efficiency, environmental stability, and low-cost of PSCs, are described in detail. Recent in-depth studies on different aspects are also discussed for better understanding of these issues and possible solutions.

scholarly journals Research progress of carbon-assisted etching of silicon nanostructures

2021 ◽  
Vol 2076 (1) ◽  
pp. 012060
Author(s):  
Xiaoyu Yang ◽  
Ling Tong ◽  
Lin Wu ◽  
Baoguo Zhang ◽  
Zhiyuan Liao ◽  
...  
Keyword(s):  
Large Scale ◽  
Low Cost ◽  
Lithium Ion ◽  
Development Trend ◽  
Research Progress ◽  
Silicon Nanostructures ◽  
Storage Devices ◽  
Existing Problems ◽  
Energy Conversion And Storage ◽  
Silicon Based

Abstract Silicon nanostructures are attracting growing attention due to their properties and promising application prospects in solar energy conversion and storage devices, thermoelectric devices, lithium-ion batteries, and biosensing technologies. The large-scale and low-cost preparation of silicon nanostructures is critical for silicon-based advanced functional devices commercialization. In this paper, the feasibility and mechanism of silicon nanostructure fabricated by non-metallic carbon catalytic etching, as well as the currently existing problems and future development trend are reviewed.

scholarly journals PELATIHAN PEMBUATAN LAYOUT PCB DENGAN DIP TRACE DAN DRY FILM PHOTORESIST BAGI SMK MUHAMMADIYAH 2 SALAM MAGELANG

2018 ◽  
Vol 1 (1) ◽  
pp. 13
Author(s):  
Denny Dermawan
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Short Term ◽  
Work Related ◽  
Short Course ◽  
Photoresist Film ◽  
Near Term ◽  
Dry Film ◽  
Final Work ◽  
Dry Film Photoresist

The desire of students of SMK Muhammadiyah 2 Salam Magelang to be able to make a printed circuit board is something that is very important to be welcomed and followed up wisely so that the desire of the students is not just a wishful dream but will be a reality. This activity is meant to be an effort not only to overcome difficulties at certain times (short-term activities), but is expected to be sustainable for the future (longer term). Looking at the fact, of course, should be strived to realize the handling of the problem at least for the near term. For that required activities that are practical and immediate benefits can be taken as the activity can be a short course or short training. To solve the problem, it is realized by holding a short course / training course on PCB Layout Creation with DIP TRACE and Dry Film Photoresist technology followed by etching process, drilling and installation of components that will be useful for students who want to do the main final work related with the manufacture of tools / hardware. Keywords: Making PCB, DIP TRACE, Dry Photoresist film

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