scholarly journals A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 102
Author(s):  
Yurong He ◽  
Chaowei Si ◽  
Guowei Han ◽  
Yongmei Zhao ◽  
Jin Ning ◽  
...  
Keyword(s):  
Mems Devices ◽  
Zero Bias ◽  
Micro Electro Mechanical Systems ◽  
Chip Area ◽  
Mems Accelerometer ◽  
Bias Stability ◽  
Etched Silicon ◽  
Vertical Interconnection ◽  
Capacitive Mems ◽  
On Chip

In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) accelerometers, the entire structure of the accelerometer, includes the mass, the springs, and the composite wafer. The composite wafer is expected to serve as the electrical feedthrough and the fixed capacitance plate at the same time, to simplify the fabrication process, and to save on chip area. It is manufactured by filling melted borosilicate glass into an etched silicon wafer and polishing the wafer flat. A sensitivity of 51.622 mV/g in the range of ±5 g (g = 9.8 m/s2), a zero-bias stability under 0.2 mg, and the noise floor with 11.28 µg/√Hz were obtained, which meet the needs of most acceleration detecting applications. The micromachining solution is beneficial for vertical interconnection and miniaturization of MEMS devices.

scholarly journals Microfluidic and Micromachined/MEMS Devices for Separation, Discrimination and Detection of Airborne Particles for Pollution Monitoring

Micromachines ◽  
2019 ◽  
Vol 10 (7) ◽  
pp. 483 ◽  
Author(s):  
Daniel Puiu Poenar
Keyword(s):  
Optical Scattering ◽  
Pollution Monitoring ◽  
Detection Methods ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Lab On Chip ◽  
Inorganic Particles ◽  
Advantages And Disadvantages ◽  
Air Quality Assessment ◽  
On Chip

Most of the microfluidics-related literature describes devices handling liquids, with only a small part dealing with gas-based applications, and a much smaller number of papers are devoted to the separation and/or detection of airborne inorganic particles. This review is dedicated to this rather less known field which has become increasingly important in the last years due to the growing attention devoted to pollution monitoring and air quality assessment. After a brief introduction summarizing the main particulate matter (PM) classes and the need for their study, the paper reviews miniaturized devices and/or systems for separation, detection and quantitative assessment of PM concentration in air with portable and easy-to-use platforms. The PM separation methods are described first, followed by the key detection methods, namely optical (scattering) and electrical. The most important miniaturized reported realizations are analyzed, with special attention given to microfluidic and micromachined or micro-electro-mechanical systems (MEMS) chip-based implementations due to their inherent capability of being integrated in lab-on-chip (LOC) type of smart microsystems with increased functionalities that can be portable and are easy to use. The operating principles and (when available) key performance parameters of such devices are presented and compared, also highlighting their advantages and disadvantages. Finally, the most relevant conclusions are discussed in the last section.

Research on Zero Bias Characteristic of MEMS Accelerometer in FBW

2014 ◽  
Vol 609-610 ◽  
pp. 1046-1052
Author(s):  
Lun Chao Zhong ◽  
Jian Zhong Wang ◽  
Jia Dong Shi
Keyword(s):  
Random Error ◽  
Temperature Scale ◽  
Least Square Method ◽  
Temperature Characteristic ◽  
Least Square ◽  
Measuring Error ◽  
Zero Bias ◽  
Mems Accelerometer ◽  
Temperature Bias ◽  
Bias Stability

Zero bias is an important performance index of MEMS accelerometerscope. Based on the large amount of given accelerometer experiments, we study zero bias of random error properties, temperature characteristic, large overload environment variation, and then calculate MEMS accelerometer bias, bias stability, zero bias repeatability. Through least-square method,we fit temperature scale factor and temperature bias of MEMS accelerometer. The experimental results show that the compensation method has the advantages of simple operation, effectively compensation for measuring error of MEMS accelerometer which is induced by temperature, and has strong engineering using value.

Device and Reliability Physics of Capacitive MEMS

2007 ◽  
Author(s):  
Evgeni Gusev
Keyword(s):  
Initial Phase ◽  
Turning Point ◽  
Mechanical Systems ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Fast Growing ◽  
Reliability Characteristics ◽  
Capacitive Mems

Micro-electro-mechanical systems (MEMS) and its younger “brother” nano-electro-mechanical systems (NEMS) are fast growing fields. In fact, in many areas, it is now at a turning point from the initial phase of device concept research and prototyping to volume manufacturing. To large extent, this transition is due to better general understanding of MEMS devices, materials and processes, major advances in packaging methods, and, as a result, significantly improved reliability characteristics up to billions of operation cycles.

Stiffness Measurement of Micro-Cantilever Based on Negative Electrostatic Stiffness

2020 ◽  
Vol 12 (1) ◽  
pp. 96-100
Author(s):  
Xianshan Dong ◽  
Qinwen Huang ◽  
Yun Huang ◽  
Wei Su ◽  
Ping Lai
Keyword(s):  
Basic Structure ◽  
Mems Devices ◽  
Mechanical Stiffness ◽  
Micro Electro Mechanical Systems ◽  
Mems Accelerometer ◽  
Mems Sensor ◽  
The Difference ◽  
Micro Cantilever ◽  
Fabrication Variation ◽  
Non Destructive

Micro-cantilever is basic structure of Micro-Electro-Mechanical-Systems (MEMS) sensor, and mechanical stiffness is the most important parameter of micro-cantilever. The mechanical stiffness can be affected by shape, size and material, and it should be experimentally measured for fabrication variation. Yet, the micro scale of MEMS cantilever makes the measurement difficult, and the traditional method isn't suitable for the micro-cantilever. This study proposes a new method for measuring the mechanical stiffness of micro-cantilever, and measurement of MEMS accelerometer was also experimentally carried out. The proposed method exploits the feature that the voltage applied on cantilever can lead to negative electrostatic stiffness, and this stiffness can change the deformation of cantilever. The mechanical stiffness can be obtained through analyzing the change of output. Results from this study coincided with our theoretical model, and the difference between results obtained by this method and SEM was 2.2%. This work provides a new way to precisely obtain mechanical stiffness of micro-cantilever using non-destructive method, making it helpful for researchers to design micro-cantilever and MEMS devices.

scholarly journals A Stochastic Model to Describe the Scattering in the Response of Polysilicon MEMS

2021 ◽  
Vol 2 (1) ◽  
pp. 95
Author(s):  
Luca Dassi ◽  
Marco Merola ◽  
Eleonora Riva ◽  
Angelo Santalucia ◽  
Andrea Venturelli ◽  
...  
Keyword(s):  
Silicon Film ◽  
Micro Fabrication ◽  
Micro Electro Mechanical Systems ◽  
Local Fluctuations ◽  
Stochastic Framework ◽  
On Line ◽  
Chip Testing ◽  
On Chip ◽  
Time Required ◽  
Polycrystalline Silicon Film

The current miniaturization trend in the market of inertial microsystems is leading to movable device parts with sizes comparable to the characteristic length-scale of the polycrystalline silicon film morphology. The relevant output of micro electro-mechanical systems (MEMS) is thus more and more affected by a scattering, induced by features resulting from the micro-fabrication process. We recently proposed an on-chip testing device, specifically designed to enhance the aforementioned scattering in compliance with fabrication constraints. We proved that the experimentally measured scattering cannot be described by allowing only for the morphology-affected mechanical properties of the silicon films, and etch defects must be properly accounted for too. In this work, we discuss a fully stochastic framework allowing for the local fluctuations of the stiffness and of the etch-affected geometry of the silicon film. The provided semi-analytical solution is shown to catch efficiently the measured scattering in the C-V plots collected through the test structure. This approach opens up the possibility to learn on-line specific features of the devices, and to reduce the time required for their calibration.

scholarly journals A Tunable-Gain Transimpedance Amplifier for CMOS-MEMS Resonators Characterization

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 82
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura
Keyword(s):  
Cmos Technology ◽  
Open Loop ◽  
Transimpedance Amplifier ◽  
Mems Devices ◽  
Monolithically Integrated ◽  
Mems Resonators ◽  
Electromechanical Performance ◽  
Cmos Mems ◽  
Promising Solution ◽  
On Chip

CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.35-µm CMOS technology specifically oriented to drive and sense monolithically integrated CMOS-MEMS resonators up to 50 MHz with a tunable transimpedance gain ranging from 112 dB to 121 dB. The output voltage noise is as low as 225 nV/Hz1/2—input-referred current noise of 192 fA/Hz1/2—at 10 MHz, and the power consumption is kept below 1-mW. In addition, the TIA amplifier exhibits an open-loop gain independent of the parasitic input capacitance—mostly associated with the MEMS layout—representing an advantage in MEMS testing compared to other alternatives such as Pierce oscillator schemes. The work presented includes the characterization of three types of MEMS resonators that have been fabricated and experimentally characterized both in open-loop and self-sustained configurations using the integrated TIA amplifier. The experimental characterization includes an accurate extraction of the electromechanical parameters for the three fabricated structures that enables an accurate MEMS-CMOS circuitry co-design.

scholarly journals The description of friction of silicon MEMS with surface roughness: virtues and limitations of a stochastic Prandtl–Tomlinson model and the simulation of vibration-induced friction reduction

2010 ◽  
Vol 1 ◽  
pp. 163-171 ◽  
Author(s):  
W Merlijn van Spengen ◽  
Viviane Turq ◽  
Joost W M Frenken
Keyword(s):  
Surface Roughness ◽  
Critical Role ◽  
Measurement Data ◽  
Friction Model ◽  
Friction Reduction ◽  
Atomic Scale ◽  
Mems Devices ◽  
Tomlinson Model ◽  
Atomic Force ◽  
On Chip

We have replaced the periodic Prandtl–Tomlinson model with an atomic-scale friction model with a random roughness term describing the surface roughness of micro-electromechanical systems (MEMS) devices with sliding surfaces. This new model is shown to exhibit the same features as previously reported experimental MEMS friction loop data. The correlation function of the surface roughness is shown to play a critical role in the modelling. It is experimentally obtained by probing the sidewall surfaces of a MEMS device flipped upright in on-chip hinges with an AFM (atomic force microscope). The addition of a modulation term to the model allows us to also simulate the effect of vibration-induced friction reduction (normal-force modulation), as a function of both vibration amplitude and frequency. The results obtained agree very well with measurement data reported previously.

scholarly journals A Miniature Optical Force Dual-Axis Accelerometer Based on Laser Diodes and Small Particles Cavities

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1375
Author(s):  
Junji Pu ◽  
Kai Zeng ◽  
Yulie Wu ◽  
Dingbang Xiao
Keyword(s):  
Light Source ◽  
Optical System ◽  
High Sensitivity ◽  
Measurement Range ◽  
Optical Force ◽  
Zero Bias ◽  
Micro Electro Mechanical Systems ◽  
Force Effect ◽  
High Measurement ◽  
Mems Technology

In recent years, the optical accelerometer based on the optical trapping force effect has gradually attracted the attention of researchers for its high sensitivity and high measurement accuracy. However, due to its large size and the complexity of optical path adjustment, the optical force accelerometers reported are only suitable for the laboratory environment up to now. In this paper, a miniature optical force dual-axis accelerometer based on the miniature optical system and a particles cavity which is prepared by Micro-Electro-Mechanical Systems (MEMS) technology is proposed. The overall system of the miniature optical levitation including the miniature optical system and MEMS particles cavity is a cylindrical structure with a diameter of about 10 mm and a height of 33 mm (Φ 10 mm × 33 mm). Moreover, the size of this accelerometer is 200 mm × 100 mm × 100 mm. Due to the selected light source being a laser diode light source with elliptical distribution, it is sensitive to the external acceleration in both the long axis and the short axis. This accelerometer achieves a measurement range of ±0.17 g–±0.26 g and measurement resolution of 0.49 mg and 1.88 mg. The result shows that the short-term zero-bias stability of the two orthogonal axes of the optical force accelerometer is 4.4 mg and 9.2 mg, respectively. The main conclusion that can be drawn is that this optical force accelerometer could provide an effective solution for measuring acceleration with an optical force effect for compact engineering devices.

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