scholarly journals Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 862 ◽  
Author(s):  
Syed Ali Raza Bukhari ◽  
Muhammad Mubasher Saleem ◽  
Umar Shahbaz Khan ◽  
Amir Hamza ◽  
Javaid Iqbal ◽  
...  
Keyword(s):  
Dynamic Response ◽  
Microelectromechanical Systems ◽  
System Modeling ◽  
Silicon On Insulator ◽  
System Level ◽  
Voltage Sensitivity ◽  
Thermally Stable ◽  
Sense Mode ◽  
Drive Mode ◽  
Mems Gyroscope

This paper presents microfabrication process-driven design of a multi-degree of freedom (multi-DoF) non-resonant electrostatic microelectromechanical systems (MEMS) gyroscope by considering the design constraints of commercially available low-cost and widely-used silicon-on-insulator multi-user MEMS processes (SOIMUMPs), with silicon as a structural material. The proposed design consists of a 3-DoF drive mode oscillator with the concept of addition of a collider mass which transmits energy from the drive mass to the passive sense mass. In the sense direction, 2-DoF sense mode oscillator is used to achieve dynamically-amplified displacement in the sense mass. A detailed analytical model for the dynamic response of MEMS gyroscope is presented and performance characteristics are validated through finite element method (FEM)-based simulations. The effect of operating air pressure and temperature variations on the air damping and resulting dynamic response is analyzed. The thermal stability of the design and corresponding effect on the mechanical and capacitive sensitivity, for an operating temperature range of −40 °C to 100 °C, is presented. The results showed that the proposed design is thermally stable, robust to environmental variations, and process tolerances with a wide operational bandwidth and high sensitivity. Moreover, a system-level model of the proposed gyroscope and its integration with the sensor electronics is presented to estimate the voltage sensitivity under the constraints of the readout electronic circuit.

scholarly journals Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

2014 ◽  
Vol 11 (99) ◽  
pp. 20140573 ◽  
Author(s):  
H. Droogendijk ◽  
R. A. Brookhuis ◽  
M. J. de Boer ◽  
R. G. P. Sanders ◽  
G. J. M. Krijnen
Keyword(s):  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Fast Response ◽  
Gyroscopic System ◽  
Drive Mode ◽  
Mems Gyroscope ◽  
Coriolis Forces ◽  
Mems Technology ◽  
Large Measurement ◽  
Theoretical Performance

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed.

scholarly journals Design and Analysis of a High-Gain and Robust Multi-DOF Electro-thermally Actuated MEMS Gyroscope

Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 577 ◽  
Author(s):  
Muhammad Saqib ◽  
Muhammad Mubasher Saleem ◽  
Naveed Mazhar ◽  
Saif Awan ◽  
Umar Shahbaz Khan
Keyword(s):  
Resonant Frequency ◽  
Analytical Model ◽  
Actuation Voltage ◽  
High Gain ◽  
Sense Mode ◽  
Drive Mode ◽  
Mass System ◽  
Mems Gyroscope ◽  
Flat Region ◽  
Thermally Actuated

This paper presents the design and analysis of a multi degree of freedom (DOF) electro-thermally actuated non-resonant MEMS gyroscope with a 3-DOF drive mode and 1-DOF sense mode system. The 3-DOF drive mode system consists of three masses coupled together using suspension beams. The 1-DOF system consists of a single mass whose motion is decoupled from the drive mode using a decoupling frame. The gyroscope is designed to be operated in the flat region between the first two resonant peaks in drive mode, thus minimizing the effect of environmental and fabrication process variations on device performance. The high gain in the flat operational region is achieved by tuning the suspension beams stiffness. A detailed analytical model, considering the dynamics of both the electro-thermal actuator and multi-mass system, is developed. A parametric optimization is carried out, considering the microfabrication process constraints of the Metal Multi-User MEMS Processes (MetalMUMPs), to achieve high gain. The stiffness of suspension beams is optimized such that the sense mode resonant frequency lies in the flat region between the first two resonant peaks in the drive mode. The results acquired through the developed analytical model are verified with the help of 3D finite element method (FEM)-based simulations. The first three resonant frequencies in the drive mode are designed to be 2.51 kHz, 3.68 kHz, and 5.77 kHz, respectively. The sense mode resonant frequency is designed to be 3.13 kHz. At an actuation voltage of 0.2 V, the dynamically amplified drive mode gain in the sense mass is obtained to be 18.6 µm. With this gain, a capacitive change of 28.11   f F and 862.13   f F is achieved corresponding to the sense mode amplitude of 0.15   μ m and 4.5   μ m at atmospheric air pressure and in a vacuum, respectively.

scholarly journals A Decoupling Design with T-Shape Structure for the Aluminum Nitride Gyroscope

Micromachines ◽  
2019 ◽  
Vol 10 (4) ◽  
pp. 244
Author(s):  
Yang ◽  
Si ◽  
Han ◽  
Zhang ◽  
Ning ◽  
...  
Keyword(s):  
Aluminum Nitride ◽  
Microelectromechanical Systems ◽  
Sense Mode ◽  
Drive Mode ◽  
Aln Film ◽  
Shape Structure ◽  
Mems Gyroscopes ◽  
Sense Electrode ◽  
Working Principle ◽  
Novel Design

This paper reports a novel design for the decoupling of microelectromechanical systems (MEMS) gyroscopes. The MEMS gyroscope is based on piezoelectric aluminum nitride (AlN) film, and the main structure is a mass hung by T-shape beams. A pair of parallel drive electrodes are symmetrically placed on the surface of the vertical bar for driving the oscillating mass. A serpentine sense electrode is placed on the lateral bar. When the gyroscope is oscillating in drive mode, charges with equal quantity and opposite sign will be polarized and distributed symmetrically along the lateral bar. These charges neutralize each other at the sense electrode. Therefore, no coupling signals can be detected from the sense electrode. This design can realize the decoupling between the drive mode and sense mode. In this work, the T-shape decoupled structure was designed as the key component of an AlN piezoelectric gyroscope and the whole structure was simulated by COMSOL Multiphysics 5.2a. The working principle of the decoupling is described in detail. Electrical properties were characterized by the dynamic signal analyzer. According to the test results, the drive mode and the sense mode are decoupled. The coefficient of orthogonal coupling is 1.55%.

Design and Implementation of a Multiple-Beam Tuning-Fork Gyroscope

2011 ◽  
Author(s):  
Ren Wang ◽  
Peng Cheng ◽  
Fei Xie ◽  
Zhili Hao ◽  
Darrin Young
Keyword(s):  
Tuning Fork ◽  
Rate Sensitivity ◽  
Silicon On Insulator ◽  
Sense Mode ◽  
Thermoelastic Damping ◽  
Quality Factors ◽  
Drive Mode ◽  
Multiple Beam ◽  
Equivalent Impedance ◽  
Mode Vibration

This paper presents the design, fabrication, and experimental results of a multiple-beam tuning-fork gyroscope (MB-TFG). Based on a numerical model of thermoelastic damping, a multiple-beam tuning-fork structure is designed with high Quality factors (Qs) in its two operation modes. A simple mask that defines the device through trenches is employed to implement this MB-TFG design on silicon-on-insulator wafers. The highest measured Qs of the fabricated MB-TFGs in vacuum are 255,000 in the drive-mode and 103,000 in the sense-mode, at a frequency of 15.7kHz. Under a frequency difference of 4Hz between the two modes (operation frequency is 16.8kHz) and a drive-mode vibration amplitude of 3.0μm, the measured rate sensitivity is 80μVPP/°/s with an equivalent impedance of 2.5MΩ. The calculated overall rate resolution of this device is 0.377hr°/√Hz.

scholarly journals Sensitivity Analysis of Single-Drive, 3-axis MEMS Gyroscope Using COMSOL Multiphysics

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1030
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Microelectromechanical Systems ◽  
Angular Rate ◽  
Mode Analysis ◽  
Comsol Multiphysics ◽  
Mechanical Sensitivity ◽  
Drive Mode ◽  
Element Analysis ◽  
Mems Gyroscope ◽  
Fea Model ◽  
Mode Split

In this paper, a COMSOL Multiphysics-based methodology is presented for evaluation of the microelectromechanical systems (MEMS) gyroscope. The established finite element analysis (FEA) model was successfully validated through a comparison with analytical and Matlab/Simulink analysis results. A simplified single-drive, 3-axis MEMS gyroscope was analyzed using a mode split approach, having a drive resonant frequency of 24,918 Hz, with the x-sense, y-sense, and z-sense being 25,625, 25,886, and 25,806 Hz, respectively. Drive-mode analysis was carried out and a maximum drive-displacement of 4.0 μm was computed for a 0.378 μN harmonic drive force. Mechanical sensitivity was computed at 2000 degrees per second (dps) input angular rate while the scale factor for roll, pitch, and yaw was computed to be 0.014, 0.011, and 0.013 nm/dps, respectively.

scholarly journals A Low-g MEMS Accelerometer with High Sensitivity, Low Nonlinearity and Large Dynamic Range Based on Mode-Localization of 3-DoF Weakly Coupled Resonators

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 310
Author(s):  
Muhammad Mubasher Saleem ◽  
Shayaan Saghir ◽  
Syed Ali Raza Bukhari ◽  
Amir Hamza ◽  
Rana Iqtidar Shakoor ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Dynamic Range ◽  
Proof Mass ◽  
Amplitude Ratio ◽  
Silicon On Insulator ◽  
Coupled Resonators ◽  
Mode Localization ◽  
Mems Accelerometer ◽  
Weakly Coupled ◽  
Input Acceleration

This paper presents a new design of microelectromechanical systems (MEMS) based low-g accelerometer utilizing mode-localization effect in the three degree-of-freedom (3-DoF) weakly coupled MEMS resonators. Two sets of the 3-DoF mechanically coupled resonators are used on either side of the single proof mass and difference in the amplitude ratio of two resonator sets is considered as an output metric for the input acceleration measurement. The proof mass is electrostatically coupled to the perturbation resonators and for the sensitivity and input dynamic range tuning of MEMS accelerometer, electrostatic electrodes are used with each resonator in two sets of 3-DoF coupled resonators. The MEMS accelerometer is designed considering the foundry process constraints of silicon-on-insulator multi-user MEMS processes (SOIMUMPs). The performance of the MEMS accelerometer is analyzed through finite-element-method (FEM) based simulations. The sensitivity of the MEMS accelerometer in terms of amplitude ratio difference is obtained as 10.61/g for an input acceleration range of ±2 g with thermomechanical noise based resolution of 0.22 and nonlinearity less than 0.5%.

scholarly journals Design Approach for Reducing Cross-Axis Sensitivity in a Single-Drive Multi-Axis MEMS Gyroscope

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 902
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Microelectromechanical Systems ◽  
Reduction Rate ◽  
Design Technique ◽  
Matching Method ◽  
Mems Gyroscope ◽  
Mode Split ◽  
The Cross ◽  
The Individual ◽  
Cross Axis ◽  
Ratio Matching

In this paper, a new design technique is presented to estimate and reduce the cross-axis sensitivity (CAS) in a single-drive multi-axis microelectromechanical systems (MEMS) gyroscope. A simplified single-drive multi-axis MEMS gyroscope, based on a mode-split approach, was analyzed for cross-axis sensitivity using COMSOL Multiphysics. A design technique named the “ratio-matching method” of drive displacement amplitudes and sense frequency differences ratios was proposed to reduce the cross-axis sensitivity. Initially, the cross-axis sensitivities in the designed gyroscope for x and y-axis were calculated to be 0.482% and 0.120%, respectively, having an average CAS of 0.301%. Using the proposed ratio-matching method and design technique, the individual cross-axis sensitivities in the designed gyroscope for x and y-axis were reduced to 0.018% and 0.073%, respectively. While the average CAS was reduced to 0.045%, showing a reduction rate of 85.1%. Moreover, the proposed ratio-matching method for cross-axis sensitivity reduction was successfully validated through simulations by varying the coupling spring position and sense frequency difference variation analyses. Furthermore, the proposed methodology was verified experimentally using fabricated single-drive multi-axis gyroscope.

Modeling the Propagation of Failures in Software Driven Hardware Systems to Enable Risk-Informed Design

2008 ◽  
Author(s):  
David C. Jensen ◽  
Irem Y. Tumer ◽  
Tolga Kurtoglu
Keyword(s):  
Complex System ◽  
Product Life Cycle ◽  
System Modeling ◽  
Software Component ◽  
Temperature Data ◽  
System Level ◽  
Design Stage ◽  
Redundancy Management ◽  
Hardware System ◽  
Failure Propagation

Software-driven hardware configurations account for the majority of modern complex systems. The often costly failures of such systems can be attributed to software specific, hardware specific, or software/hardware interaction failures. The understanding of the propagation of failures in a complex system is critical because, while a software component may not fail in terms of loss of function, a software operational state can cause an associated hardware failure. The least expensive phase of the product life cycle to address failures is during the design stage. This results in a need to evaluate how a combined software/hardware system behaves and how failures propagate from a design stage analysis framework. Historical approaches to modeling the reliability of these systems have analyzed the software and hardware components separately. As a result significant work has been done to model and analyze the reliability of either component individually. Research into interfacing failures between hardware and software has been largely on the software side in modeling the behavior of software operating on failed hardware. This paper proposes the use of high-level system modeling approaches to model failure propagation in combined software/hardware system. Specifically, this paper presents the use of the Function-Failure Identification and Propagation (FFIP) framework for system level analysis. This framework is applied to evaluate nonlinear failure propagation within the Reaction Control System Jet Selection of the NASA space shuttle, specifically, for the redundancy management system. The redundancy management software is a subset of the larger data processing software and is involved in jet selection, warning systems, and pilot control. The software component that monitors for leaks does so by evaluating temperature data from the fuel and oxidizer injectors and flags a jet as having a failure by leak if the temperature data is out of bounds for three or more cycles. The end goal is to identify the most likely and highest cost paths for fault propagation in a complex system as an effective way to enhance the reliability of a system. Through the defining of functional failure propagation modes and path evaluation, a complex system designer can evaluate the effectiveness of system monitors and comparing design configurations.

scholarly journals MEMS Gyroscope Automatic Real-Time Mode-Matching Method Based on Phase-Shifted 45° Additional Force Demodulation

Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 3001 ◽  
Author(s):  
Feng Bu ◽  
Dacheng Xu ◽  
Heming Zhao ◽  
Bo Fan ◽  
Mengmeng Cheng
Keyword(s):  
Real Time ◽  
Microelectromechanical Systems ◽  
Control Variable ◽  
Mode Frequency ◽  
Mode Matching ◽  
Sense Mode ◽  
Zero Bias ◽  
Real Time Mode ◽  
Additional Force ◽  
Force Signal

In order to solve the problem where existing mode-matching methods in microelectromechanical systems (MEMS) vibrating gyroscopes fail to meet real-time and reliability requirements, this paper presents a novel method to accomplish automatic and real-time mode-matching based on phase-shifted 45° additional force demodulation (45° AFD-RM). The phase-shifted 45° additional force signal has the same frequency as the quadrature force signal, but it is phase-shifted by 45° and applied to the sense mode. In addition, two-way phase-shifted 45° demodulations are used at the sense-mode detection output to obtain a phase metric that is independent of the Coriolis force and can reflect the mode-matching state. Then, this phase metric is used as a control variable to adaptively control the tuning voltage, so as to change the sense-mode frequency through the negative stiffness effect and ultimately achieve real-time mode-matching. Simulation and experimental results show that the proposed 45° AFD-RM method can achieve real-time matching. The mode frequency split is controlled within 0.1 Hz, and the gyroscope scale factor, zero-bias instability, and angle random walk are effectively improved.

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

2001 ◽  
Author(s):  
Vijay K. Varadan
Keyword(s):  
Self Assembly ◽  
Communication Systems ◽  
Microelectromechanical Systems ◽  
System Level ◽  
Smart Devices ◽  
Mems Devices ◽  
Wafer Level ◽  
Sensors And Actuators ◽  
Complex Adaptive ◽  
Microelectronics Industry

Abstract The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and MicroElectroMechanical Systems (MEMS). This effort offers the promise of: 1. Increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed for the IC and microelectronics industry. Examples include micro stereo lithographic and micro molding techniques. 2. Developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines. 3. Development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation. 4. Development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems.

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