scholarly journals Development of Real-Time Measurement Platform for Stretchable and Rollable Functions of Flexible Electronics under Multiple Dynamic Loads

Micromachines ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 106
Author(s):  
Chang-Chun Lee ◽  
Jui-Chang Chuang ◽  
Ruei-Ci Shih ◽  
Chi-Wei Wang
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Sine Wave ◽  
Wearable Devices ◽  
Dynamic Loads ◽  
Inspection System ◽  
Mechanical Reliability ◽  
Electronic Components ◽  
Real Time Measurement ◽  
Applied Fields

Mainstream next generation electronic devices with miniaturized structures and high levels of performance are needed to meet the characteristic requirements of electronics with flexible and stretchable capabilities. Accordingly, several applied fields of innovative electronic component techniques, such as wearable devices, foldable curtain-like displays, and flexible hybrid electronic (FHE) biosensors, are considered. This study presents a novel inspection system with multifunctions of stressing tensile and bending mechanical loads to acquire the stretchable and rollable characteristics of soft specimens. The performance of the proposed measurement platform using samples of three different geometric types is evaluated in terms of its stretchability. The results show a remarkable enhancement of mechanical reliability when the sine wave geometric structure is used. A symmetrical sine wave-shaped sample is designed to measure performance under cyclic rolling. The proposed measurement platform of flexible electronics meets the testing requirements of mechanical reliability for the development of future flexible electronic components and FHE products.

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

2005 ◽  
Author(s):  
Frank Fan Wang
Keyword(s):  
Dynamic Load ◽  
Random Vibration ◽  
Sine Wave ◽  
Electronic Equipment ◽  
Dynamic Loads ◽  
Peak Acceleration ◽  
Maximum Acceleration ◽  
Dynamic Excitations ◽  
Dynamic Damage ◽  
Resonant Point

It is a challenge to correlate different dynamic loads. Often, attempts are made to compare the peak acceleration of sine wave to the root mean square (RMS) acceleration of random vibration and shock. However, peak sine acceleration is the maximum acceleration at one frequency. Random RMS is the square root of the area under a spectral density curve. These are not equivalent. This paper is to discuss a mathematical method to compare different kinds of dynamic damage at the resonant point of the related electronic equipment. The electronic equipment will vibrate at its resonance point when there are dynamic excitations. The alternative excitation at the resonant frequency causes the most damage. This paper uses this theory to develop a method to correlate different dynamic load conditions for electronic equipment. The theory is that if one kind of dynamic load causes the same levels of damaging effects as the other, the levels of vibration can then be related.

scholarly journals Sheet Resistance Measurements of Conductive Thin Films: A Comparison of Techniques

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 960
Author(s):  
Mira Naftaly ◽  
Satyajit Das ◽  
John Gallop ◽  
Kewen Pan ◽  
Feras Alkhalil ◽  
...  
Keyword(s):  
Thin Films ◽  
Sheet Resistance ◽  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductivity Measurements ◽  
Terahertz Time Domain Spectroscopy ◽  
Comparison Of Techniques ◽  
Terahertz Frequencies ◽  
Conductive Thin Films ◽  
Multiple Samples

Conductive thin films are an essential component of many electronic devices. Measuring their conductivity accurately is necessary for quality control and process monitoring. We compare conductivity measurements on films for flexible electronics using three different techniques: four-point probe, microwave resonator and terahertz time-domain spectroscopy. Multiple samples were examined, facilitating the comparison of the three techniques. Sheet resistance values at DC, microwave and terahertz frequencies were obtained and were found to be in close agreement.

Bursting Oscillations and Experimental Verification of a Rucklidge System

2021 ◽  
Vol 31 (08) ◽  
pp. 2130023
Author(s):  
Zhijun Li ◽  
Siyuan Fang ◽  
Minglin Ma ◽  
Mengjiao Wang
Keyword(s):  
Electronic Devices ◽  
Pitchfork Bifurcation ◽  
Phase Portraits ◽  
Formation Mechanisms ◽  
Analysis Method ◽  
Good Qualitative Agreement ◽  
Bursting Oscillations ◽  
Real Time Measurement ◽  
Time Varying Parameter ◽  
Measurement Results

Bursting oscillations are ubiquitous in multi-time scale systems and have attracted widespread attention in recent years. However, research on experimental demonstration of the bursting oscillations induced by delayed bifurcation is very rarely reported. In this paper, a parametrically driven Rucklidge system is introduced and a distinct delayed behavior is observed when the time-varying parameter passes through the pitchfork bifurcation point. Different bursting patterns induced by such a delayed behavior are numerically investigated under different excitation amplitudes based on the fast–slow analysis method. Furthermore, in order to reproduce the bursting electronic signals and explore the underlying formation mechanisms experimentally, a real physical circuit of the parametrically driven Rucklidge system is developed by using off-the-shelf electronic devices. The real-time measurement results such as time series, phase portraits and transformed phase portraits are in good qualitative agreement with those obtained from the numerical computations. The experimental evidence to verify bursting oscillations induced by delayed pitchfork bifurcation is thus provided in this study.

scholarly journals Direct Ink Writing of Materials for Electronics-Related Applications: A Mini Review

2021 ◽  
Vol 8 ◽  
Author(s):  
Zhenzhong Hou ◽  
Hai Lu ◽  
Ying Li ◽  
Laixia Yang ◽  
Yang Gao
Keyword(s):  
Human Life ◽  
Electronic Devices ◽  
Electronic Components ◽  
Direct Ink Writing ◽  
Recent Developments ◽  
Print Materials ◽  
On Chip ◽  
Functional Components ◽  
Printing Techniques

Recently, the fabrication of electronics-related components via direct ink writing (DIW) has attracted much attention. Compared to the conventionally fabricated electronic components, DIW-printed ones have more complicated structures, higher accuracy, improved efficiency, and even enhanced performances that arise from well-designed architectures. The DIW technology allows directly print materials on a variety of flat substrates, even a conformal one, well suiting them to applications such as wearable devices and on-chip integrations. Here, recent developments in DIW printing of emerging components for electronics-related applications are briefly reviewed, including electrodes, electronic circuits, and functional components. The printing techniques, processes, ink materials, advantages, and properties of DIW-printed architectures are discussed. Finally, the challenges and outlooks on the manufacture of 3D structured electronic devices by DIW are outlined, pointing out future designs and developments of DIW technology for electronics-related applications. The combination of DIW and electronic devices will help to improve the quality of human life and promote the development of science and society.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

2021 ◽  
Vol 21 (12) ◽  
pp. 5960-5964
Author(s):  
Kwon Jai Lee ◽  
Jee Young Oh ◽  
Kyong Nam Kim
Keyword(s):  
Residual Stress ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Rapid Development ◽  
Electronic Devices ◽  
Copper Film ◽  
Electronics Industry ◽  
Electronic Components ◽  
Graphene Layers ◽  
Electronic Parts

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

scholarly journals Directly Electrospun Carbon Nanofibers Incorporated with Mn3O4 Nanoparticles as Bending-Resistant Cathode for Flexible Al-Air Batteries

Nanomaterials ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 216 ◽  
Author(s):  
Ying Yu ◽  
Yuxin Zuo ◽  
Ying Liu ◽  
Youjun Wu ◽  
Zhonghao Zhang ◽  
...  
Keyword(s):  
Carbon Nanofibers ◽  
Flexible Electronics ◽  
Mechanical Stability ◽  
Specific Capacity ◽  
Wearable Devices ◽  
Power Source ◽  
High Specific Capacity ◽  
Continuous Bending ◽  
Air Battery ◽  
Mn3o4 Nanoparticles

Al-air batteries are regarded as potential power source for flexible and wearable devices. However, the traditional cathodes of Al-air batteries are easy to be broken after continuous bending. This is why few Al-air batteries have been tested under the state of dynamic bending so far. Herein, carbon nanofibers incorporated with Mn3O4 catalyst have been prepared as bending-resistant cathodes through direct electrospinning. The cathode assembled in Al-air battery showed excellent electrochemical and mechanical stability. A high specific capacity of 1021 mAh/cm2 was achieved after bending 1000 times, which is 81.7% of that in platform state. This work will facilitate the progress of using Al-air battery in flexible electronics.

Latest Advancements in Wearable Devices

2022 ◽  
pp. 58-64
Author(s):  
Mohit Angurala
Keyword(s):  
Daily Life ◽  
Electronic Devices ◽  
Wearable Computing ◽  
Wearable Devices ◽  
Comprehensive Review ◽  
The Masses

Wearable devices have impacted the daily life of every individual. These devices come with the embedded feature that fits almost within clothes, accessories, or even watches. One of the wearables named “wrist-worn devices” has gained acceptance by the masses among other wearables. Vital information can be easily gathered with the help of such wearables. These are also suitable for myriad applications such as sports, agriculture, medical, and several more. This chapter gives a comprehensive review of wearable computing electronic devices being used in various fields and provides the latest trends in wearables. The main objective of this review is to discuss various challenges that are faced by individuals in using wearables and the latest methods that can overcome these issues. In the modern epoch, wireless wearable devices have gained a lot of importance in various fields such as sports, agriculture, medical, and many more.

New insights and perspectives into biological materials for flexible electronics

2017 ◽  
Vol 46 (22) ◽  
pp. 6764-6815 ◽  
Author(s):  
Lili Wang ◽  
Di Chen ◽  
Kai Jiang ◽  
Guozhen Shen
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Biological Materials ◽  
Flexible Electronic ◽  
Critical Components ◽  
Flexible Electronic Devices

Materials based on biological materials are becoming increasingly competitive and are likely to be critical components in flexible electronic devices.

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