New insights and perspectives into biological materials for flexible electronics

2017 ◽  
Vol 46 (22) ◽  
pp. 6764-6815 ◽  
Author(s):  
Lili Wang ◽  
Di Chen ◽  
Kai Jiang ◽  
Guozhen Shen
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Biological Materials ◽  
Flexible Electronic ◽  
Critical Components ◽  
Flexible Electronic Devices

Materials based on biological materials are becoming increasingly competitive and are likely to be critical components in flexible electronic devices.

A reversible and highly conductive adhesive: towards self-healing and recyclable flexible electronics

2020 ◽  
Vol 8 (23) ◽  
pp. 7772-7785 ◽  
Author(s):  
Qiming Yan ◽  
Meng Zhou ◽  
Heqing Fu
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductive Adhesive ◽  
Self Healing ◽  
Next Generation ◽  
Conductive Adhesives ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Flexible conductive adhesives are important materials for the next generation of flexible electronic devices.

Flexible Electronic Devices From Hot Embossing Materials Transfer

2005 ◽  
Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Building Blocks ◽  
Transfer Printing ◽  
Flexible Devices ◽  
Planar Surfaces ◽  
Flexible Electronic ◽  
Semiconductor Nanomaterials ◽  
Flexible Electronic Devices

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.

The research status and challenges of shape memory polymer-based flexible electronics

2019 ◽  
Vol 6 (5) ◽  
pp. 931-944 ◽  
Author(s):  
Hui Gao ◽  
Jinrong Li ◽  
Fenghua Zhang ◽  
Yanju Liu ◽  
Jinsong Leng
Keyword(s):  
Shape Memory ◽  
Flexible Electronics ◽  
Shape Memory Polymer ◽  
Electronic Devices ◽  
Research Status ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

This review summarizes the advances and challenges of shape memory polymer-based flexible electronic devices.

scholarly journals Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Bending Strain ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Highly transparent, all-oxide, heteroepitaxy ferroelectric thin film for flexible electronic devices

2018 ◽  
Vol 458 ◽  
pp. 540-545 ◽  
Author(s):  
Chuanlai Ren ◽  
Congbing Tan ◽  
Lunjun Gong ◽  
Mingkai Tang ◽  
Min Liao ◽  
...  
Keyword(s):  
Thin Film ◽  
Electronic Devices ◽  
Ferroelectric Thin Film ◽  
Flexible Electronic ◽  
Flexible Electronic Devices
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