scholarly journals KLu(WO4)2/SiO2 Tapered Waveguide Platform for Sensing Applications

Micromachines ◽  
2019 ◽  
Vol 10 (7) ◽  
pp. 454 ◽  
Author(s):  
Medina ◽  
Rüter ◽  
Pujol ◽  
Kip ◽  
Masons ◽  
...  

This paper provides a generic way to fabricate a high-index contrast tapered waveguide platform based on dielectric crystal bonded on glass for sensing applications. As a specific example, KLu(WO4)2 crystal on a glass platform is made by means of a three-technique combination. The methodology used is on-chip bonding, taper cutting with an ultra-precise dicing saw machine and inductively coupled plasma-reactive ion etching (ICP-RIE) as a post-processing step. The high quality tapered waveguides obtained show low surface roughness (25 nm at the top of the taper region), exhibiting propagation losses estimated to be about 3 dB/cm at 3.5 m wavelength. A proof-of-concept with crystal-on-glass tapered waveguides was realized and used for chemical sensing.

2020 ◽  
Vol 35 (10) ◽  
pp. 2248-2254 ◽  
Author(s):  
Pascal Becker ◽  
Christoph Neff ◽  
Sabine Hess ◽  
Peter Weis ◽  
Detlef Günther

A proof-of-concept for a novel Single-Pulse-LA-ICP-TOFMS based method is shown for the forensic investigation of float glass fragments.


Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1033
Author(s):  
Simen Mikalsen Martinussen ◽  
Raimond N. Frentrop ◽  
Meindert Dijkstra ◽  
Sonia Maria Garcia-Blanco

KY(WO4)2 is a promising material for on-chip laser sources. Deep etching of small KY(WO4)2 samples in combination with various thin film deposition techniques is desirable for the manufacturing of such devices. There are, however, several difficulties that need to be overcome before deep etching of KY(WO4)2 can be realized in small samples in a reproducible manner. In this paper, we address the problems of (i) edge bead formation when using thick resist on small samples, (ii) sample damage during lithography mask touchdown, (iii) resist reticulation during prolonged argon-based inductively coupled plasma reactive ion etching (ICP-RIE), and (iv) redeposited material on the feature sidewalls. We demonstrate the etching of 6.5 µm deep features and the removal of redeposited material using a wet etch procedure. This process will enable the realization of waveguides both in ion-irradiated KY(WO4)2 as well as thin KY(WO4)2 membranes transferred onto glass substrate by bonding and subsequent polishing.


2016 ◽  
Vol 36 ◽  
pp. 1-6 ◽  
Author(s):  
A. Modabbernia ◽  
E. Velthorst ◽  
C. Gennings ◽  
L. De Haan ◽  
C. Austin ◽  
...  

AbstractBackgroundDespite evidence for the effects of metals on neurodevelopment, the long-term effects on mental health remain unclear due to methodological limitations. Our objective was to determine the feasibility of studying metal exposure during critical neurodevelopmental periods and to explore the association between early-life metal exposure and adult schizophrenia.MethodsWe analyzed childhood-shed teeth from nine individuals with schizophrenia and five healthy controls. We investigated the association between exposure to lead (Pb2+), manganese (Mn2+), cadmium (Cd2+), copper (Cu2+), magnesium (Mg2+), and zinc (Zn2+), and schizophrenia, psychotic experiences, and intelligence quotient (IQ). We reconstructed the dose and timing of early-life metal exposures using laser ablation inductively coupled plasma mass spectrometry.ResultsWe found higher early-life Pb2+ exposure among patients with schizophrenia than controls. The differences in log Mn2+ and log Cu2+ changed relatively linearly over time to postnatal negative values. There was a positive correlation between early-life Pb2+ levels and psychotic experiences in adulthood. Moreover, we found a negative correlation between Pb2+ levels and adult IQ.ConclusionsIn our proof-of-concept study, using tooth-matrix biomarker that provides direct measurement of exposure in the fetus and newborn, we provide support for the role of metal exposure during critical neurodevelopmental periods in psychosis.


2014 ◽  
Vol 609-610 ◽  
pp. 789-795 ◽  
Author(s):  
Zhen Wang ◽  
Yang Yang Qi ◽  
Ming Liang Zhang ◽  
An Ji ◽  
Fu Hua Yang ◽  
...  

A fabricating process of prototype thermoelectric device based on vertical silicon nanowires (SiNWs) for on-chip integration was presented. The SiNWs with diameter of 200 nm and height of 1 μm were fabricated by electron beam lithography and inductively coupled plasma etching. The gaps between the NWs were filled by the spin-on glass, which isolated the top and bottom electrodes. A serpentine platinum resistance thermometer coil was formed on the NWs to create temperature gradient across the NWs and measure the temperature of the top of NWs. I-V characteristics of the vertical device before and after annealing were measured. The nonlinear I-V curves were obtained, but the annealed one demonstrated 1000-fold reduction in resistance than the unannealed one.


2020 ◽  
Vol 10 (18) ◽  
pp. 6365
Author(s):  
Hongnan Xu ◽  
Daoxin Dai ◽  
Yaocheng Shi

Mode-division multiplexing (MDM) technology has drawn tremendous attention for its ability to expand the link capacity within a single-wavelength carrier, paving the way for large-scale on-chip data communications. In the MDM system, the signals are carried by a series of higher-order modes in a multi-mode bus waveguide. Hence, it is essential to develop on-chip mode-handling devices. Silicon-on-insulator (SOI) has been considered as a promising platform to realize MDM since it provides an ultra-high-index contrast and mature fabrication processes. In this paper, we review the recent progresses on silicon integrated nanophotonic devices for MDM applications. We firstly discuss the working principles and device configurations of mode (de)multiplexers. In the second section, we summarize the multi-mode routing devices, including multi-mode bends, multi-mode crossings and multi-mode splitters. The inverse-designed multi-mode devices are then discussed in the third section. We also provide a discussion about the emerging reconfigurable MDM devices in the fourth section. Finally, we offer our outlook of the development prospects for on-chip multi-mode photonics.


2020 ◽  
Vol 35 (12) ◽  
pp. 2852-2858 ◽  
Author(s):  
Victor Garcia-Montoto ◽  
Pablo Denti ◽  
Linus M. V. Malmquist ◽  
Sylvain Verdier ◽  
Brice Bouyssiere ◽  
...  

A proof of concept has been shown confirming that an interface that hyphenates tSFC and ICP MS techniques is achievable.


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