scholarly journals Editorial for the Special Issue on Development of CMOS-MEMS/NEMS Devices

Micromachines ◽  
2019 ◽  
Vol 10 (4) ◽  
pp. 273
Author(s):  
Jaume Verd ◽  
Jaume Segura
Keyword(s):  
Integrated Circuits ◽  
Building Blocks ◽  
Special Issue ◽  
Technology Roadmap ◽  
Cmos Mems ◽  
Nanoelectromechanical System

Micro and nanoelectromechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within integrated circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors [...]

scholarly journals Design of an Ultra-Low Voltage Bias Current Generator Highly Immune to Electromagnetic Interference

2021 ◽  
Vol 11 (1) ◽  
pp. 6
Author(s):  
Orazio Aiello
Keyword(s):  
Integrated Circuits ◽  
Electromagnetic Interference ◽  
Low Voltage ◽  
Current Source ◽  
Building Blocks ◽  
Cmos Technology ◽  
Threshold Region ◽  
Output Current ◽  
Current Generator ◽  
Technology Process

The paper deals with the immunity to Electromagnetic Interference (EMI) of the current source for Ultra-Low-Voltage Integrated Circuits (ICs). Based on the properties of IC building blocks, such as the current-splitter and current correlator, a novel current generator is conceived. The proposed solution is suitable to provide currents to ICs operating in the sub-threshold region even in the presence of an electromagnetic polluted environment. The immunity to EMI of the proposed solution is compared with that of a conventional current mirror and evaluated by analytic means and with reference to the 180 nm CMOS technology process. The analysis highlights how the proposed solution generates currents down to nano-ampere intrinsically robust to the Radio Frequency (RF) interference affecting the input of the current generator, differently to what happens to the output current of a conventional mirror under the same conditions.

scholarly journals Interband Cascade Photonic Integrated Circuits on Native III-V Chip

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 599
Author(s):  
Jerry R. Meyer ◽  
Chul Soo Kim ◽  
Mijin Kim ◽  
Chadwick L. Canedy ◽  
Charles D. Merritt ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Detection System ◽  
Laser Cavity ◽  
Building Blocks ◽  
Drive Power ◽  
Optical Elements ◽  
Photonic Integrated Circuit ◽  
Cleaved Facets ◽  
On Chip

We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.

The Impact of Carbon Nanotubes and Graphene on Electronics Industry

2018 ◽  
pp. 2897-2907
Author(s):  
Rafael Vargas-Bernal ◽  
Gabriel Herrera-Pérez ◽  
Margarita Tecpoyotl-Torres
Keyword(s):  
Carbon Nanotubes ◽  
Electrical Properties ◽  
Integrated Circuits ◽  
Electronics Industry ◽  
Future Trends ◽  
Technology Roadmap ◽  
The World ◽  
Materials Used ◽  
Short Time ◽  
The Impact

Since its discovery in 1991 and 2004, carbon nanotubes (CNTs) by Sumio Iijima, and graphene by Andre Geim and Konstantin Novoselov in 2004, these materials have been extensively studied around the world. Both materials have electronic, thermal, magnetic, optical, chemical, and mechanical extraordinary properties. International Technology Roadmap for Semiconductors (ITRS) has predicted that these nanomaterials are potential replacements of the conventional materials used in the manufacture of integrated circuits. Two of the technological aspects that both materials share and have reduced their extensive use are processing and dispersion required to homogenize the electrical properties of the materials based on them. Fortunately, these problems are being solved thanks to the ongoing investigation, and in a short time the materials used in today's electronics industry will be replaced by devices based on these novel materials. The impact of the applications of both materials in the electronics industry, as well as future trends in the following decades are discussed in this paper.

scholarly journals Introduction to JSTQE Special Issue on Foundry Enabled Photonic Integrated Circuits

2019 ◽  
Vol 25 (5) ◽  
pp. 1-3
Author(s):  
Madeleine Glick ◽  
Paul Juodawlkis ◽  
Marco Romagnoli ◽  
Kevin A. Williams ◽  
Zhiping James Zhou
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Special Issue

What is a verb?

2019 ◽  
Vol 14 (2) ◽  
pp. 169-188
Author(s):  
Eva Smolka ◽  
Dorit Ravid
Keyword(s):  
Building Blocks ◽  
The Other ◽  
Special Issue ◽  
Thematic Roles ◽  
Semitic Languages ◽  
General Terms ◽  
Lexical Items ◽  
The One ◽  
Current Special Issue ◽  
Structure And Functions

Abstract Verbs constitute one of the basic building blocks of a clause, setting the structure of arguments and expressing the relationships among nouns in various thematic roles. In general terms, verbs are lexical items expressing verb-oriented notions such as activities, processes, and states. In morphology-rich languages, the syntactic and lexical roles of verbs are mediated by typologically-oriented morphological means. The current Special Issue contrasts the structure and functions of verbs in languages from two morphologically rich, yet typologically different families. The articles in the Special Issue present spoken and written aspects of verbs in usage and development in German (a Germanic language) on the one hand, in Hebrew, Neo-Aramaic, and Arabic (Semitic languages), on the other. From a theoretical linguistic perspective, we ask how the different typological features of these languages affect the function of verbs in sentences, and from a psycholinguistic perspective, we ask how typological differences affect the processing of verbs in the mature minds of adults and in the developing minds of children.

scholarly journals Lithography for enabling advances in integrated circuits and devices

2012 ◽  
Vol 370 (1973) ◽  
pp. 4015-4041 ◽  
Author(s):  
C. Michael Garner
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Extreme Ultraviolet ◽  
Field Effect Transistors ◽  
Semiconductor Industry ◽  
High Volume ◽  
Pattern Transfer ◽  
Time Pattern ◽  
Technology Roadmap ◽  
The Future

Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing.

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