scholarly journals Investigation on Laser Welding of Al Ribbon to Cu Sheet: Weldability, Microstructure, and Mechanical and Electrical Properties

Metals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 831
Author(s):  
Won-Sang Shin ◽  
Dae-Won Cho ◽  
Donghyuck Jung ◽  
Heeshin Kang ◽  
Jeng O Kim ◽  
...  
Keyword(s):  
Laser Welding ◽  
Intermetallic Compounds ◽  
Marangoni Effect ◽  
Dynamics Simulation ◽  
Process Window ◽  
Power Electronic ◽  
Experimental Conditions ◽  
Electron Probe Microanalyzer ◽  
Mechanical And Electrical Properties ◽  
Transmission Electron

The pulsed laser welding of Al ribbon to Cu sheet was investigated for the electrical interconnections in power electronic modules. The various experimental conditions with the different laser powers, scan speeds, and heat inputs were employed for obtaining the defect-free Al/Cu joints. During the Al/Cu laser welding, the intermetallic compounds were formed in the welding zone. An electron probe microanalyzer and transmission electron microscopy confirmed the phases of intermetallic compounds, which were found to be Al4Cu9, Al2Cu, AlCu, etc. The computational fluid dynamics simulation revealed that the Marangoni effect induced the circulation of the molten pool, resulting in the mixture of Al and Cu and the formation of swirl-like structures at the Al/Cu joints. The tensile shear strengths and electrical resistances of the Al/Cu joints were measured, and they showed a strong correlation with the welding area. A decrease in mechanical strength and an increase in electrical resistance were measured with increasing the welding area of Al/Cu joints. Moreover, the process window for the defect-free Al/Cu joints was developed, and the experimental conditions for Al/Cu laser braze-welding were examined to minimize the intermetallic compounds formation at the Al/Cu joints.

Nanoengineering carbon nanotubes: The effects of electron irradiation on nanotube structure

2012 ◽  
Vol 1407 ◽  
Author(s):  
Katherine McDonell ◽  
Gwénaëlle Proust ◽  
Luming Shen
Keyword(s):  
Electron Microscopy ◽  
Molecular Dynamics ◽  
Raman Spectroscopy ◽  
Electron Beam ◽  
Electron Irradiation ◽  
Beam Intensity ◽  
Dynamics Simulation ◽  
Simulation Approach ◽  
Experimental Conditions ◽  
Transmission Electron

ABSTRACTA combined experimental and simulation approach into the impacts of electron irradiation on carbon nanotube morphology was conducted. Single-walled nanotubes (SWCNTs) were irradiated using a JEOL Transmission Electron Microscope (TEM) using a range of accelerating voltages varying from 90keV to 200keV and temperatures between 300K and 800K with different exposure periods (order of minutes). The effects of irradiation were observed and characterised using electron microscopy and Raman spectroscopy. Specimens were observed prior to, during and following irradiation to discern any changes that occurred in SWCNTs as a result of irradiation. Raman spectroscopy was used to characterise the different allotropes of carbon present in irradiated and non-irradiated samples of SWCNTs. Experimental conditions were mimicked using molecular dynamics simulation. SWCNTs were irradiated under conditions equivalent to experimental electron beam intensity and specimen temperature using AIREBO [1,2] and Primary Knock-on (PKA) approximation [3]. The preliminary results indicate that electron beam intensity and temperature affect the type and frequency of modification to CNT structure.

A study of the submicron indent-induced plastic deformation

1999 ◽  
Vol 14 (6) ◽  
pp. 2251-2258 ◽  
Author(s):  
C. F. Robertson ◽  
M. C. Fivel
Keyword(s):  
Plastic Deformation ◽  
Three Dimensional ◽  
Dislocation Nucleation ◽  
Dislocation Dynamics ◽  
Dynamics Simulation ◽  
Nanoindentation Test ◽  
Experimental Conditions ◽  
Discrete Dislocation Dynamics ◽  
Discrete Dislocation ◽  
Transmission Electron

A new method has been developed to achieve a better understanding of submicron indent-induced plastic deformation. This method combines numerical modeling and various experimental data and techniques. Three-dimensional discrete dislocation dynamics simulation and the finite element method (FEM) were used to model the experimental conditions associated with nanoindentation testing in fcc crystals. Transmission electron microscopy (TEM) observations of the indent-induced plastic volume and analysis of the experimental loading curve help in defining a complete set of dislocation nucleation rules, including the shape of the nucleated loops and the corresponding macroscopic loading. A validation of the model is performed through direct comparisons between a simulation and experiments for a nanoindentation test on a [001] copper single crystal up to 50 nm deep.

A comparative study on the cold type and thermal type field emission guns used in the same electron microscope

1978 ◽  
Vol 36 (1) ◽  
pp. 58-59
Author(s):  
M. Iwatsuki ◽  
Y. Kokubo ◽  
Y. Harada
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Signal To Noise Ratio ◽  
Electron Source ◽  
Resolving Power ◽  
Optical Source ◽  
Experimental Conditions ◽  
High Brightness ◽  
Illumination System ◽  
Transmission Electron

On accout of its high brightness, small optical source size, and minimal energy spread, the field emission gun (FEG) has the advantage that it provides the conventional transmission electron microscope (TEM) with a highly coherent illumination system and directly improves the resolving power and signal-to-noise ratio of the scanning electron microscope (SEM). The FEG is generally classified into two types; the cold field emission (C-FEG) and thermal field emission gun (T-FEG). The former, in which a field emitter is used at the room temperature, was successfully developed as an electron source for the SEM. The latter, in which the emitter is heated to the temperature range of 1000-1800°K, was also proved to be very suited as an electron source for the TEM, as well as for the SEM. Some characteristics of the two types of the FEG have been studied and reported by many authors. However, the results of the respective types have been obtained separately under different experimental conditions.

scholarly journals Microstructure and Photothermal Conversion Performance of Ti/(Mo-TiAlN)/(Mo-TiAlON)/Al2O3 Selective Absorbing Film for Non-Vacuum High-Temperature Applications

2020 ◽  
Vol 11 (1) ◽  
pp. 124
Author(s):  
Haibin Geng ◽  
Hanzhe Ye ◽  
Xingliang Chen ◽  
Sibin Du
Keyword(s):  
Visible Light ◽  
Near Infrared ◽  
Substitutional Solid Solution ◽  
Experimental Conditions ◽  
Al Content ◽  
Spectrum Range ◽  
Light Interference ◽  
Transmission Electron ◽  
Conversion Performance ◽  
Columnar Grain

This paper aims to clarify the phase composition in each sub-layer of tandem absorber TiMoAlON film and verify its thermal stability. The deposited multilayer Ti/(Mo-TiAlN)/(Mo-TiAlON)/Al2O3 films include an infrared reflectance layer, light interference absorptive layers with different metal doping amounts, and an anti-reflectance layer. The layer thicknesses of Ti, Mo-TiAlN, Mo-TiAlON, and Al2O3 are 100, 300, 200, and 80 nm, respectively. Al content increases to 12 at.% and the ratio of N/O is nearly 0.1, which means nitride continuously changes to oxide. According to X-ray Diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM) results, the diffraction peak that appears at 2θ = 40° demonstrates that Mo element aggregates in the substitutional solid solution (Ti,Al)(O,N) columnar grain. TiMoAlON films have low reflectivity in the spectrum range of 300–900 nm. When Al content is more than 10 at.%, absorptivity is almost in the spectrum range from visible to infrared, but absorptivity decreases in the ultraviolet spectrum range. When Al content is increased to 12 at.%, absorptivity α decreases by 0.05 in the experimental conditions. After baking in atmosphere at 500 °C for 8 h, the film has the highest absorptivity when doped with 2 at.% Mo. In the visible-light range, α = 0.97, and in the whole ultraviolet-visible-light near-infrared spectrum range, α = 0.94, and emissivity ε = 0.02 at room temperature and ε = 0.10 at 500 °C.

A Critical Review of Morphologic Findings and Data From 14 Toxicological Studies Involving Fish Exposures to Diclofenac

2021 ◽  
pp. 019262332198965
Author(s):  
Jeffrey C. Wolf
Keyword(s):  
Diagnostic Errors ◽  
Data Interpretation ◽  
Included Study ◽  
Experimental Conditions ◽  
Regulatory Decision ◽  
Transmission Electron ◽  
Toxicological Studies ◽  
Morphologic Data ◽  
Ambiguous Data

A number of studies have investigated the potential toxicity of the analgesic agent diclofenac (DCF) in various fish species under a diverse array of experimental conditions. Reported evidence of toxicity in these investigations is often strongly reliant on morphologic end points such as histopathology, immunohistochemistry, and transmission electron microscopy. However, it may be challenging for scientists who perform environmental hazard or risk determination to fully appreciate the intricacies of these specialized endpoints. Therefore, the purpose of the current review was to critically assess the quality of morphologic data in 14 papers that described the experimental exposure of fish to DCF. Areas of focus during this review included study design, diagnostic accuracy, magnitude of reported changes, data interpretation and presentation, and the credibility of individual reported findings. Positive attributes of some studies included robust experimental designs, accurate diagnoses, and straightforward and transparent data reporting. Issues identified in certain articles included diagnostic errors, failure to account for sampling and/or observer bias, failure to evaluate findings according to sex, exaggeration of lesion severity, interstudy inconsistencies, unexplained phenomena, and incomplete or ambiguous data presentation. It is hoped that the outcome of this review will be of value for personnel involved in regulatory decision-making.

Effect of Laser Thermal Processing on Defect Evolution in Silicon

2002 ◽  
Vol 717 ◽  
Author(s):  
Erik Kuryliw ◽  
Kevin S. Jones ◽  
David Sing ◽  
Michael J. Rendon ◽  
Somit Talwar
Keyword(s):  
Point Defects ◽  
Thermal Processing ◽  
Defect Formation ◽  
Secondary Ion Mass Spectrometry ◽  
Laser Energy ◽  
Process Window ◽  
Loop Formation ◽  
Transmission Electron ◽  
Ultra Shallow Junctions ◽  
Laser Thermal Processing

AbstractLaser Thermal Processing (LTP) involves laser melting of an implantation induced preamorphized layer to form highly doped ultra shallow junctions in silicon. In theory, a large number of interstitials remain in the end of range (EOR) just below the laser-formed junction. There is also the possibility of quenching in point defects during the liquid phase epitaxial regrowth of the melt region. Since post processing anneals are inevitable, it is necessary to understand both the behavior of these interstitials and the nature of point defects in the recrystallized-melt region since they can directly affect deactivation and enhanced diffusion. In this study, an amorphizing 15 keV 1 x 1015/cm2 Si+ implant was done followed by a 1 keV 1 x 1014/cm2 B+ implant. The surface was then laser melted at energy densities between 0.74 and 0.9 J/cm2 using a 308 nm excimer-laser. It was found that laser energy densities above 0.81 J/cm2 melted past the amorphous-crystalline interface. Post-LTP furnace anneals were performed at 750°C for 2 and 4 hours. Transmission electron microscopy was used to analyze the defect formation after LTP and following furnace anneals. Secondary ion mass spectrometry measured the initial and final boron profiles. It was observed that increasing the laser energy density led to increased dislocation loop formation and increased diffusion after the furnace anneal. A maximum loop density and diffusion was observed at the end of the process window, suggesting a correlation between the crystallization defects and the interstitial evolution.

Effect of Intermetallic Compounds Content on Laser Welding Performance of Al-Fe Alloy Sheets

2014 ◽  
Vol 794-796 ◽  
pp. 401-406 ◽  
Author(s):  
Pi Zhi Zhao ◽  
Yan Feng Pan ◽  
Jiang Tao ◽  
Xiang Jun Shi ◽  
Qi Zhang
Keyword(s):  
Thermal Conductivity ◽  
Laser Welding ◽  
Intermetallic Compounds ◽  
Nonuniform Distribution ◽  
Welding Parameters ◽  
Lower Content ◽  
Absorbed Energy ◽  
Size Uniformity ◽  
Distribution Uniformity ◽  
Weld Pools

The present study investigated the laser welding performance of Al-Fe aluminum alloy sheets with different contents of intermetallic compounds. Under the same welding parameters, the alloy of higher intermetallic compounds content has wide and deep weld pools with uniform sizes. The alloy of lower intermetallic compounds content has narrow and shallow weld pools with nonuniform sizes. The higher content of intermetallic compounds results in higher laser absorptivity and lower thermal conductivity, and then increases the effective absorbed energy during welding, which is beneficial to the formation of wide and deep weld pools. The distribution uniformity of intermetallic compounds influences the size uniformity of weld pools. In the alloy with lower content of intermetallic compounds, the nonuniform distribution of intermeallic compounds results in the formation of abnormal weld pool, leading to the nonuniform size of the weld pools. In the alloy with higher content of intermetallic compounds, uniform distribution of intermetallic compounds make the size of weld pools more uniform.

Customized Circuit Interconnect and Repair by Laser Seeding and Constriction-Induced Plating.

1990 ◽  
Vol 203 ◽  
Author(s):  
Julian P. Partridge ◽  
C. Julian Chen
Keyword(s):  
Equilibrium Potential ◽  
Palladium Acetate ◽  
Process Window ◽  
Acetate Solution ◽  
Cross Sectional ◽  
Mechanical And Electrical Properties ◽  
Copper Electrolyte ◽  
Ion Laser ◽  
Novel Method ◽  
Current Densities

ABSTRACTA novel method has been developed for producing customized copper interconnections on thermally-sensitive substrates by laser seeding followed by constrictioninduced electroplating. A polyimide, polytetrafluoroethylene, or glass-epoxy substrate is first sprayed with palladium acetate solution. 500 nm thick palladium interconnects are then formed using a 514 nm argon ion laser (10 mW - 50 mW) to selectively pyrolyze the acetate film. After cleaning, the part is immersed in an acid copper electrolyte and an alternating current (0.1 Amp - 2.0 Amp) passed through the palladium seed. Joule heating produces a cathodic shift in the equilibrium potential (dε0/dT = 0.63 mV/degree) which causes electrodeposition of copper along the seeded connection.Cross-sectional microscopy and electrochemical polarization studies show that local plating current densities of 10 mA/cm2 produce 1000 εm × 25 εm × 10 εm line geometries exhibiting excellent mechanical and electrical properties. The large process window suggests that customization and repair on lincwidths below 1 mil (25 εm) should be achievable routinely.

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

2009 ◽  
Vol 24 (8) ◽  
pp. 2638-2643 ◽  
Author(s):  
Kai-Jheng Wang ◽  
Yan-Zuo Tsai ◽  
Jenq-Gong Duh ◽  
Toung-Yi Shih
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Formation Mechanism ◽  
Transmission Electron Microscope ◽  
Electron Probe ◽  
Under Bump Metallization ◽  
Rich Phase ◽  
Snagcu Solder ◽  
Electron Probe Microanalyzer ◽  
Transmission Electron

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn–Ag–Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed.

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