scholarly journals Single Layer Broadband Anti-Reflective Coatings for Plastic Substrates Produced by Full Wafer and Roll-to-Roll Step-and-Flash Nano-Imprint Lithography

Materials ◽  
2013 ◽  
Vol 6 (9) ◽  
pp. 3710-3726 ◽  
Author(s):  
Marieke Burghoorn ◽  
Dorrit Roosen-Melsen ◽  
Joris de Riet ◽  
Sami Sabik ◽  
Zeger Vroon ◽  
...  
2019 ◽  
Vol 211 ◽  
pp. 5-12 ◽  
Author(s):  
Usama Tahir ◽  
M. Ahmad Kamran ◽  
Min Hyeok Jang ◽  
Myung Yung Jeong

2007 ◽  
Vol 124-126 ◽  
pp. 523-526 ◽  
Author(s):  
Ki Yeon Yang ◽  
Jong Woo Kim ◽  
Sung Hoon Hong ◽  
Heon Lee

Self-Assembled Monolayer (SAM) is a single layer of ordered molecules absorbed on a surface by chemical bonding between the molecular head group and the surface. The surface properties can be controlled by the terminal functional group of the SAM layer. In order to utilize SAM layers for device applications, SAM layer needs to be patterned as a sub-micron size. Patterning of SAM layer in sub-micron size has been done by various techniques including direct-writing by dip-pen nano lithography, selective etching with UV photons, and selective deposition of SAM layer by &-contact printing. In this study, silane based SAM layer was patterned to the sub-micron size using zero residual Nano imprint Lithography, which is regarded as next generation lithography technique due to its simplicity, high throughput and high resolution pattern transferring capability. Using zero-residual layer imprinting, 300nm~2um sized SAM patterns can successfully fabricated. In order to check the surface property of patterned SAM layer, a solution containing nano Ag particles was spin-coated on the SAM patterned substrate and nano Ag particles were selectively deposited on the substrate.


2011 ◽  
Vol 24 (4) ◽  
pp. 383-388 ◽  
Author(s):  
Akihiko Kono ◽  
Takashi Maruoka ◽  
Arai Yu ◽  
Yoshihiko Hirai ◽  
Hideo Horibe

2000 ◽  
Vol 636 ◽  
Author(s):  
Qiyu Huang ◽  
Whye-Kei Lye ◽  
David M. Longo ◽  
Michael L. Reed

AbstractAlumina formed by the electrochemical anodization of bulk aluminum has a regular porous structure [1]. Sub-100 nm pores with aspect ratios as high as 1000:1 can easily be formed [2] without elaborate processing. Anodization of aluminum thus provides the basis for the inexpensive, high throughput microfabrication of structures with near vertical sidewalls [2]. In this work we explore the patterned anodic oxidation of deposited aluminum thin films, facilitating the integration of this technique with established microfabrication tools. An anodization barrier of polymethylmethacrylate (PMMA) is deposited onto 300 nm thick aluminum films. The barrier film is subsequently patterned and the exposed aluminum anodized in a 10% sulfuric acid solution. Barrier patterning techniques utilized in this study include optical exposure, ion-beam milling and nano-imprint lithography. Sharp edge definition on micron scale patterns has been achieved using optical methods. Extension of this technique to smaller dimensions by ion-beam milling and nano-imprint lithography is presented. We further report on the observation of contrast reversal of anodization with very thin PMMA barriers, which provides a novel means of pattern transfer. Potential applications and challenges will be discussed.


2016 ◽  
Author(s):  
Florian Chalvin ◽  
Naoto Nakamura ◽  
Takamitsu Tochino ◽  
Masaaki Yasuda ◽  
Hiroaki Kawata ◽  
...  

2012 ◽  
Vol 23 (25) ◽  
pp. 255302 ◽  
Author(s):  
L Ressier ◽  
E Palleau ◽  
S Behar

2008 ◽  
Author(s):  
Hyun Wook Ro ◽  
Ronald L. Jones ◽  
Huagen Peng ◽  
Hae-Jeong Lee ◽  
Eric K. Lin ◽  
...  

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