scholarly journals Enhanced Thermal Conductivity of Polyamide-Based Nanocomposites Containing Graphene Oxide Sheets Decorated with Compatible Polymer Brushes

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 751
Author(s):  
Łukasz Łątka ◽  
Kamil Goc ◽  
Czesław Kapusta ◽  
Szczepan Zapotoczny
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Polymer Brushes ◽  
Polyamide 6 ◽  
Interfacial Interactions ◽  
Elongation At Break ◽  
Conductive Additive ◽  
Thermally Conductive ◽  
Enhanced Thermal Conductivity ◽  
Poly Acrylamide

Polyamide-based nanocomposites containing graphene platelets decorated with poly(acrylamide) brushes were prepared and characterized. The brushes were grafted from the surface of graphene oxide (GO), a thermally conductive additive, using atom transfer radical polymerization, which led to the formation of the platelets coated with covalently tethered polymer layers (GO_PAAM), accounting for ca. 31% of the total mass. Polyamide-6 (PA6) nanocomposites containing 1% of GO_PAAM were formed by extrusion followed by injection molding. The thermal conductivity of the nanocomposite was 54% higher than that of PA6 even for such a low content of GO. The result was assigned to strong interfacial interactions between the brushes and PA6 matrix related to hydrogen bonding. Control nanocomposites containing similarly prepared GO decorated with other polymer brushes that are not able to form hydrogen bonds with PA6 revealed no enhancement of the conductivity. Importantly, the nanocomposite containing GO_PAAM also demonstrated larger tensile strength without deteriorating the elongation at break value, which was significantly decreased for the other coated platelets. The proposed approach enhances the interfacial interactions thanks to the covalent tethering of dense polymer brushes on 2D fillers and may be used to improve thermal properties of other polymer-based nanocomposites with simultaneous enhancement of their mechanical properties.

Effects of molding on property of thermally conductive and electrically insulating polyamide 6–based composite

2018 ◽  
Vol 32 (9) ◽  
pp. 1190-1203 ◽  
Author(s):  
Xuping Yang ◽  
Wenbin Yang ◽  
Jinghui Fan ◽  
Juying Wu ◽  
Kai Zhang
Keyword(s):  
Thermal Conductivity ◽  
Tensile Strength ◽  
Injection Molding ◽  
Annealing Time ◽  
Polyamide 6 ◽  
Molding Pressure ◽  
Hot Press ◽  
Molding Method ◽  
Thermally Conductive ◽  
Press Molding

Thermally conductive and electrically insulating polyamide 6 (PA6) matrix quaternary composites were prepared by hot press molding and injection molding, respectively. The quaternary composites were composed of zero-dimensional aluminum oxide particle, one-dimensional silicon carbide whisker, two-dimensional flake graphite, and PA6 resin matrix. Morphology, structure, density, thermal conductivity, volume electrical resistivity, and tensile strength of two types of composites were characterized by scanning electron microscopy, X-ray diffractometer, thermal conductivity tester, high resistance micro-current tester, and tensile tester. The results showed that crystallinity, thermal conductivity, density, and tensile strength of hot press molding samples were superior to those of samples made by injection molding method. This is due to that hot press molding method can provide higher molding pressure and longer annealing time than injection molding. The mechanism could be explained that the performances of the composites were promoted by increasing molding pressure and annealing time.

Zinc Composites With Enhanced Thermal Conductivity for Use in Fused Deposition Modeling Systems

2017 ◽  
Author(s):  
Tyler J. Sonsalla ◽  
Leland Weiss ◽  
Arden Moore ◽  
Adarsh Radadia ◽  
Debbie Wood ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Fused Deposition Modeling ◽  
Waste Heat ◽  
Conductive Polymer ◽  
Three Dimensional ◽  
Sem Images ◽  
Fused Deposition ◽  
Thermally Conductive ◽  
Deposition Modeling ◽  
Enhanced Thermal Conductivity

Waste heat is a major energy loss in manufacturing facilities. Thermally conductive polymer composite heat exchangers could be utilized in the ultralow temperature range (below 200° C) for waste heat recovery. Fused deposition modeling (FDM), also known as three-dimensional (3-D) printing, has become an increasingly popular technology and presents one approach to fabrication of these exchangers. The primary challenge to the use of FDM is the low-conductivity of the materials themselves. This paper presents a study of a new polymer-Zn composite designed for enhanced thermal conductivity for usage in FDM systems. Thermal properties were assessed in addition to basic printability. Filler volume percentages were varied to study the effects on material properties. Scanning electron microscope (SEM) images were taken of the 3-D printed test pieces to determine filler orientation and filler distribution. Lastly, experimentally obtained thermal conductivity values were compared to the theoretical thermal conductivity values predicted from the Lewis-Nielsen model.

scholarly journals Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

2017 ◽  
Vol 35 (2) ◽  
pp. 382-389 ◽  
Author(s):  
Lukasz Jarosinski ◽  
Andrzej Rybak ◽  
Karolina Gaska ◽  
Grzegorz Kmita ◽  
Renata Porebska ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Graphene Nanoplatelets ◽  
Electrical Insulation ◽  
Graphene Nanocomposites ◽  
Thermally Conductive ◽  
Conductive Particles ◽  
Proper Performance ◽  
Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

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