scholarly journals Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers

Materials ◽  
2018 ◽  
Vol 11 (12) ◽  
pp. 2483 ◽  
Author(s):  
Katarzyna Placha ◽  
Richard S. Tuley ◽  
Milena Salvo ◽  
Valentina Casalegno ◽  
Kevin Simpson
Keyword(s):  
Thermoelectric Material ◽  
Bonding Temperature ◽  
Electrical Contact ◽  
Temperature Stability ◽  
Cost Effective ◽  
Diffusion Reaction ◽  
Layered System ◽  
High Temperature Stability ◽  
P Type ◽  
Solid Liquid

Over the past few years, significant progress towards implementation of environmentally sustainable and cost-effective thermoelectric power generation has been made. However, the reliability and high-temperature stability challenges of incorporating thermoelectric materials into modules still represent a key bottleneck. Here, we demonstrate an implementation of the Solid-Liquid Interdiffusion technique used for bonding Mmy(Fe,Co)4Sb12 p-type thermoelectric material to metallic interconnect using a novel aluminium–nickel multi-layered system. It was found that the diffusion reaction-controlled process leads to the formation of two distinct intermetallic compounds (IMCs), Al3Ni and Al3Ni2, with a theoretical melting point higher than the initial bonding temperature. Different manufacturing parameters have also been investigated and their influence on electrical, mechanical and microstructural features of bonded components are reported here. The resulting electrical contact resistances and apparent shear strengths for components with residual aluminium were measured to be (2.8 ± 0.4) × 10−5 Ω∙cm2 and 5.1 ± 0.5 MPa and with aluminium completely transformed into Al3Ni and Al3Ni2 IMCs were (4.8 ± 0.3) × 10−5 Ω∙cm2 and 4.5 ± 0.5 MPa respectively. The behaviour and microstructural changes in the joining material have been evaluated through isothermal annealing at hot-leg working temperature to investigate the stability and evolution of the contact.

FeNbSb p-type half-Heusler compound: beneficial thermomechanical properties and high-temperature stability for thermoelectrics

2017 ◽  
Vol 5 (27) ◽  
pp. 6677-6681 ◽  
Author(s):  
W. Silpawilawan ◽  
K. Kurosaki ◽  
Y. Ohishi ◽  
H. Muta ◽  
S. Yamanaka
Keyword(s):  
High Temperature ◽  
Thermoelectric Properties ◽  
Thermoelectric Material ◽  
Temperature Stability ◽  
Thermomechanical Properties ◽  
High Temperature Stability ◽  
Heusler Compound ◽  
P Type

FeNbSb is an excellent p-type half-Heusler thermoelectric material from the viewpoint of not only thermoelectric properties but also thermomechanical properties.

Temperature Dependence and High-Temperature Stability of the Annealed Ni/Au Ohmic Contact to p-Type GaN in Air

2015 ◽  
Vol 45 (4) ◽  
pp. 2087-2091 ◽  
Author(s):  
Shirong Zhao ◽  
Heather McFavilen ◽  
Shuo Wang ◽  
Fernando A. Ponce ◽  
Chantal Arena ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Dependence ◽  
Ohmic Contact ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
P Type

scholarly journals A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Coatings ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 401 ◽  
Author(s):  
Cherng-Yuh Su ◽  
Jia-Liang Huang ◽  
Po-Chun Chen ◽  
Hsin-Jung Yu ◽  
Dai-Liang Ma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Temperature ◽  
Oxygen Affinity ◽  
Temperature Stability ◽  
High Strength ◽  
High Temperature Stability ◽  
Transmission Electron ◽  
Temperature Diffusion ◽  
La Doped

Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250–350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint.

High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC

1998 ◽  
Vol 27 (4) ◽  
pp. 324-329 ◽  
Author(s):  
T. N. Oder ◽  
J. R. Williams ◽  
M. J. Bozack ◽  
V. Iyer ◽  
S. E. Mohney ◽  
...  
Keyword(s):  
High Temperature ◽  
Ohmic Contacts ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
Chromium Boride ◽  
P Type

Realizing Excellent n‐ and p‐Type Niobium‐Based Half‐Heusler Compounds Based on Thermoelectric Properties and High‐Temperature Stability

2020 ◽  
Vol 6 (6) ◽  
pp. 2000083 ◽  
Author(s):  
Wanthana Silpawilawan ◽  
Sora‐at Tanuslip ◽  
Raju Chetty ◽  
Michihiro Ohta ◽  
Yuji Ohishi ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermoelectric Properties ◽  
Temperature Stability ◽  
Heusler Compounds ◽  
High Temperature Stability ◽  
P Type

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Si Yu ◽  
Zhen Wang ◽  
Jiajie Fan ◽  
Cheng Qian ◽  
Zhentao Deng ◽  
...  
Keyword(s):  
High Temperature ◽  
Dielectric Properties ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Temperature Stability ◽  
Cost Effective ◽  
Practical Significance ◽  
Light Sources ◽  
High Temperature Stability ◽  
Light Emitting

Abstract Light-emitting diodes (LED) chip scale packages (CSPs) have been promoted as a new light source with many advantages in smaller package size, lower material and process cost, and better heat dissipation effect. However, as it is exposed in harsh environments such as high temperature, high humidity, and high blue light irradiation, silicone material used in LED CSPs always suffers deterioration, which will seriously affect the LED's reliability and working life. Thus, the preparation of high reliable silicone has practical significance to promote the application of LED CSPs in lighting. In this research, titanium was introduced into the molecular chain of phenyl silicone by using the hydrolysis condensation method. A high temperature aging test was then performed to the prepared silicone before and after modification, and their optical, thermomechanical, and dielectric properties were characterized to evaluate their reliabilities. The results show that: (1) the Arrhenius function with the dielectric property as an aging characterization can be used as a temperature accelerated life model to predict the service life of the prepared silicone and (2) the titanium modified silicone can advance the high temperature stability on optical properties, thermomechanical, and dielectric properties and enhance the life expectancy. The major contributions of this study are to support the improvement of the novel LED CSP packaging materials and processes, and also to provide the technical guidance on the fast, accurate, and cost-effective reliability assessment for high-quality LED light sources.

Enhanced field emission of p-type 3C-SiC nanowires with B dopants and sharp corners

2014 ◽  
Vol 2 (23) ◽  
pp. 4515-4520 ◽  
Author(s):  
Yang Yang ◽  
Hao Yang ◽  
Guodong Wei ◽  
Lin Wang ◽  
Minghui Shang ◽  
...  
Keyword(s):  
High Temperature ◽  
Field Emission ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
Turn On ◽  
Sic Nanowires ◽  
P Type ◽  
Sharp Corners

We report the enhanced field emission of B-doped SiC nanowires with a low turn-on field and enhanced high-temperature stability.

Cost Effective Synthesis and Fabrication of Phase-Pure Kesterite Cu2-xZn1.3SnS4 P-type Absorber Layer Thin Films by Solvent Based Process Technique for Photovoltaic Solar Energy Applications

2018 ◽  
Vol 7 (4) ◽  
pp. 36
Author(s):  
B. Khadambari ◽  
S. S. Bhattacharya
Keyword(s):  
Solar Energy ◽  
Renewable Energy Sources ◽  
Cost Effective ◽  
Absorber Layer ◽  
Window Layer ◽  
Energy Applications ◽  
Process Technique ◽  
Absorber Material ◽  
Effective Synthesis ◽  
P Type

Solar has become one of the fastest growing renewable energy sources. With the push towards sustainability it is an excellent solution to resolve the issue of our diminishing finite resources. Alternative photovoltaic systems are of much importance to utilize solar energy efficiently. The Cu-chalcopyrite compounds CuInS2 and CuInSe2 and their alloys provide absorber material of high absorption coefficients of the order of 105 cm-1. Cu2ZnSnS4 (CZTS) is more promising material for photovoltaic applications as Zn and Sn are abundant materials of earth’s crust. Further, the preparation of CZTS-ink facilitates the production of flexible solar cells. The device can be designed with Al doped ZnO as the front contact, n-type window layer (e.g. intrinsic ZnO); an n-type thin film buffer layer (e.g. CdS) and a p-type CZTS absorber layer with Molybdenum (Mo) substrate as back contact. In this study, CZTS films were synthesized by a non-vaccum solvent based process technique from a molecular-ink using a non toxic eco-friendly solvent dimethyl sulfoxide (DMSO). The deposited CZTS films were optimized and characterized by XRD, UV-visible spectroscopy and SEM.

UNS N06455

Alloy Digest ◽  
1989 ◽  
Vol 38 (1) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Stress Corrosion Cracking ◽  
Temperature Stability ◽  
Heat Treating ◽  
High Ductility ◽  
High Temperature Stability ◽  
Nickel Chromium ◽  
Long Time ◽  
Resistance To Stress

Abstract UNS NO6455 is a nickel-chromium-molybdenum alloy with outstanding high-temperature stability as shown by high ductility and corrosion resistance even after long-time aging in the range 1200-1900 F. The alloy also has excellent resistance to stress-corrosion cracking and to oxidizing atmospheres up to 1900 F. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ni-367. Producer or source: Nickel and nickel alloy producers.

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