scholarly journals Electrodeposited Organic Layers Formed from Aryl Diazonium Salts for Inhibition of Copper Corrosion

Materials ◽  
2017 ◽  
Vol 10 (3) ◽  
pp. 235 ◽  
Author(s):  
Ana Chira ◽  
Bogdan Bucur ◽  
Gabriel-Lucian Radu
Keyword(s):  
Diazonium Salts ◽  
Copper Corrosion ◽  
Organic Layers

Surface Modification of Conducting Substrates. Existence of Azo Bonds in the Structure of Organic Layers Obtained from Diazonium Salts

2007 ◽  
Vol 19 (18) ◽  
pp. 4570-4575 ◽  
Author(s):  
Pascal Doppelt ◽  
Géraldine Hallais ◽  
Jean Pinson ◽  
Fetah Podvorica ◽  
Sylvie Verneyre
Keyword(s):  
Surface Modification ◽  
Diazonium Salts ◽  
Organic Layers

Study of the spontaneous formation of organic layers on carbon and metal surfaces from diazonium salts

2006 ◽  
Vol 600 (21) ◽  
pp. 4801-4812 ◽  
Author(s):  
Alain Adenier ◽  
Nicole Barré ◽  
Eva Cabet-Deliry ◽  
Annie Chaussé ◽  
Sophie Griveau ◽  
...  
Keyword(s):  
Metal Surfaces ◽  
Diazonium Salts ◽  
Organic Layers ◽  
Spontaneous Formation

The Electrochemical Reduction of Diazonium Salts on Iron Electrodes. The Formation of Covalently Bonded Organic Layers and Their Effect on Corrosion

2002 ◽  
Vol 14 (1) ◽  
pp. 392-400 ◽  
Author(s):  
Annie Chaussé ◽  
Mohamed M. Chehimi ◽  
Nadia Karsi ◽  
Jean Pinson ◽  
Fetah Podvorica ◽  
...  
Keyword(s):  
Electrochemical Reduction ◽  
Diazonium Salts ◽  
Organic Layers ◽  
Iron Electrodes ◽  
Covalently Bonded

A TEM study of the interface between organic matrix and aragonite in a biological hard tissue, nacre

1992 ◽  
Vol 50 (2) ◽  
pp. 1024-1025
Author(s):  
Jun Liu ◽  
Katie E. Gunnison ◽  
Mehmet Sarikaya ◽  
Ilhan A. Aksay
Keyword(s):  
Mechanical Properties ◽  
Ion Beam ◽  
Laminated Composite ◽  
Organic Matrix ◽  
Pearl Oyster ◽  
Interfacial Structure ◽  
Interfacial Region ◽  
Thin Sections ◽  
Organic Layers ◽  
Transmission Electron

The interfacial structure between the organic and inorganic phases in biological hard tissues plays an important role in controlling the growth and the mechanical properties of these materials. The objective of this work was to investigate these interfaces in nacre by transmission electron microscopy. The nacreous section of several different seashells -- abalone, pearl oyster, and nautilus -- were studied. Nacre is a laminated composite material consisting of CaCO3 platelets (constituting > 90 vol.% of the overall composite) separated by a thin organic matrix. Nacre is of interest to biomimetics because of its highly ordered structure and a good combination of mechanical properties. In this study, electron transparent thin sections were prepared by a low-temperature ion-beam milling procedure and by ultramicrotomy. To reveal structures in the organic layers as well as in the interfacial region, samples were further subjected to chemical fixation and labeling, or chemical etching. All experiments were performed with a Philips 430T TEM/STEM at 300 keV with a liquid Nitrogen sample holder.

TEM study of a biofilm on copper corrosion

1996 ◽  
Vol 54 ◽  
pp. 220-221
Author(s):  
W. A. Chiou ◽  
N. Kohyama ◽  
B. Little ◽  
P. Wagner ◽  
M. Meshii
Keyword(s):  
Marine Bacterium ◽  
Culture Medium ◽  
Copper Alloys ◽  
Pure Copper ◽  
Localized Corrosion ◽  
Natural Seawater ◽  
Copper Corrosion ◽  
New Approach ◽  
The Past ◽  
Copper Tolerant

The corrosion of copper and copper alloys in a marine environment is of great concern because of their widespread use in heat exchangers and steam condensers in which natural seawater is the coolant. It has become increasingly evident that microorganisms play an important role in the corrosion of a number of metals and alloys under a variety of environments. For the past 15 years the use of SEM has proven to be useful in studying biofilms and spatial relationships between bacteria and localized corrosion of metals. Little information, however, has been obtained using TEM capitalizing on its higher spacial resolution and the transmission observation of interfaces. The research presented herein is the first step of this new approach in studying the corrosion with biological influence in pure copper.Commercially produced copper (Cu, 99%) foils of approximately 120 μm thick exposed to a copper-tolerant marine bacterium, Oceanospirillum, and an abiotic culture medium were subsampled (1 cm × 1 cm) for this study along with unexposed control samples.

Tropolone-Based Treatments for Visualising Latent Fingermarks on Porous Surfaces

2019 ◽  
Author(s):  
Clara M. Agapie ◽  
Melissa Sampson ◽  
William Gee
Keyword(s):  
Amino Acids ◽  
Uv Radiation ◽  
Membered Ring ◽  
Diazonium Salts ◽  
Chemical Detection ◽  
Latent Fingerprints ◽  
Porous Surfaces

The work describes a new chemical means of visualising latent fingerprints (fingermarks) using tropolone. Tropolone reacts with amino acids within the fingermark residue to form adducts that absorb UV radiation. These adducts provide useful contrast on highly-fluorescent prous surfaces will illuminated with UV radiation. The conjugated seven-membered ring of the tropolone adduct can be reacted further diazonium salts, which is demonstrated here with formation of two dyes. The methodology is extremely rapid, occurring in minutes with mild heating, and can be applied before ninhydrin in a chemical detection sequence. <br>

Root Cause Analyses of Metal Bridging for Copper Damascene Process

2005 ◽  
Author(s):  
Z. G. Song ◽  
S. P. Neo ◽  
S. K. Loh ◽  
C. K. Oh
Keyword(s):  
Failure Mechanisms ◽  
Copper Corrosion ◽  
Microelectronic Device ◽  
Root Cause ◽  
Damascene Process ◽  
New Process ◽  
Copper Cmp

Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple and mostly it is blocked etch or under-etch. But, for copper damascene process, the root causes of metal bridging are complicated. This paper has discussed the various root causes of metal bridging for copper damascene process, such as those related to litho-etch issue, copper CMP issue, copper corrosion issue and so on.

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