scholarly journals The Design and Implementation of a Low-Power Gating Scan Element in 32/28 nm CMOS Technology

2017 ◽  
Vol 7 (2) ◽  
pp. 7
Author(s):  
Mahshid Naeini ◽  
Sreedharan Dass ◽  
Chia Ooi
2021 ◽  
Vol 11 (1) ◽  
pp. 429
Author(s):  
Min-Su Kim ◽  
Youngoo Yang ◽  
Hyungmo Koo ◽  
Hansik Oh

To improve the performance of analog, RF, and digital integrated circuits, the cutting-edge advanced CMOS technology has been widely utilized. We successfully designed and implemented a high-speed and low-power serial-to-parallel (S2P) converter for 5G applications based on the 28 nm CMOS technology. It can update data easily and quickly using the proposed address allocation method. To verify the performances, an embedded system (NI-FPGA) for fast clock generation on the evaluation board level was also used. The proposed S2P converter circuit shows extremely low power consumption of 28.1 uW at 0.91 V with a core die area of 60 × 60 μm2 and operates successfully over a wide clock frequency range from 5 M to 40 MHz.


Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 350 ◽  
Author(s):  
Xu Bai ◽  
Jianzhong Zhao ◽  
Shi Zuo ◽  
Yumei Zhou

This paper presents a 2.5 Gbps 10-lane low-power low voltage differential signaling (LVDS) transceiver for a high-speed serial interface. In the transmitter, a complementary MOS H-bridge output driver with a common mode feedback (CMFB) circuit was used to achieve a stipulated common mode voltage over process, voltage and temperature (PVT) variations. The receiver was composed of a pre-stage common mode voltage shifter and a rail-to-rail comparator. The common mode voltage shifter with an error amplifier shifted the common mode voltage of the input signal to the required range, thereby the following rail-to-rail comparator obtained the maximum transconductance to recover the signal. The chip was fabricated using SMIC 28 nm CMOS technology, and had an area of 1.46 mm2. The measured results showed that the output swing of the transmitter was around 350 mV, with a root-mean-square (RMS) jitter of 3.65 [email protected] Gbps, and the power consumption of each lane was 16.51 mW under a 1.8 V power supply.


2012 ◽  
Vol 21 (04) ◽  
pp. 1250028 ◽  
Author(s):  
B. HODA SEYEDHOSSEINZADEH ◽  
MOHAMMAD YAVARI

This paper describes the design and implementation of a reconfigurable low-power sigma-delta modulator (SDM) for multi-standard wireless communications in a 90 nm CMOS technology. Both architectural and circuital reconfigurations are used to adapt the performance of the modulator to multi-standard applications. The feasibility of the presented solution is demonstrated using system-level simulations as well as transistor-level simulations of the modulator. HSPICE simulation results show that the proposed modulator achieves 76.8/78.9/80.8/85/89.5 dB peak signal-to-noise plus distortion ratio (SNDR) within the standards WiFi, WiMAX, WCDMA, Bluetooth and GSM with the bandwidth of 12.5 MHz, 10 MHz, 1.92 MHz, 0.5 MHz, and 250 kHz, respectively, under the power consumption of 37/37/12/5/5 mW using a single 1 V power supply.


Author(s):  
Alberto Annovi ◽  
Giovanni Calderini ◽  
Francesco Crescioli ◽  
Francesco De Canio ◽  
Luca Frontini ◽  
...  

VLSI Design ◽  
1996 ◽  
Vol 4 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. Srivastava ◽  
K. Venkatapathy

In this work, the design and implementation of a low power ternary full adder are presented in CMOS technology. In a ternary full adder design, the basic building blocks, the positive ternary inverter (PTI) and negative ternary inverter (NTI) are developed using a CMOS inverter and pass transistors. In designs of PTI and NTI, W/L ratios of transistors have been varied for their optimum performance. The ternary full adder and its building blocks have been simulated with SPICE 2G.6 using the MOSIS model parameters. The rise and fall times of PTI show an improvement by a factor of 14 and 4, respectively, and that of the NTI by a factor of nearly 4 and 17, respectively over that of earlier designs implemented in depletion-enhancement CMOS (DECMOS) technology. The noise margins improve by a factor of nearly 2 in PTI and NTI, respectively.The ternary full adder has been fabricated in MOSIS two micron n-well CMOS technology. The full adder and its building blocks, NTI and PTI have been tested experimentally for static and dynamic performance, compared with the SPICE simulated behavior, and close agreement is observed.The ternary-valued logic circuits designed in the present work which do not use depletion mode MOSFETS perform better than that implemented earlier in DECMOS technology. The present design is fully compatible with the current CMOS technology, uses fewer components and dissipates power in the microwatt range.


Author(s):  
Pradeep Kumar ◽  
Amit Kolhe

This paper describes the design and implementation of a Low Power 3-bit flash Analog to Digital converter (ADC). It includes 7 comparators and one thermometer to binary encoder. It is implemented in 0.18um CMOS Technology. The presimulation of ADC is done in T-Spice and post layout simulation is done in Microwind3.1. The response time of the comparator equal to 6.82ns and for Flash ADC as 18.77ns.The Simulated result shoes the power consumption in Flash ADC as is 36.273mw .The chip area is for Flash ADC is 1044um2 .


2015 ◽  
Vol 46 (12) ◽  
pp. 1426-1433 ◽  
Author(s):  
Ibrahim Abdo ◽  
Mutasem Odeh ◽  
Fadi R. Shahroury

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